Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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07/15/1980 | US4213117 Method and apparatus for detecting positions of chips on a semiconductor wafer |
07/15/1980 | US4212349 Micro bellows thermo capsule |
07/15/1980 | US4212265 Tinning apparatus for multiple solder surfaces |
07/15/1980 | CA1081411A1 Method for hermetically sealing an electronic circuit package |
07/10/1980 | WO1980001437A1 High frequency semiconductor unit |
07/09/1980 | EP0012863A2 Method of making semiconductor devices with reduced parasitic capacitance |
07/09/1980 | EP0012846A1 Thyristor |
07/08/1980 | US4211919 Portable data carrier including a microprocessor |
07/08/1980 | CA1081370A1 Package for light-triggered thyristor |
07/08/1980 | CA1081334A1 Two-part electrical connector for mounting an electrical component on a substrate |
07/01/1980 | US4210926 Intermediate member for mounting and contacting a semiconductor body |
07/01/1980 | US4210885 Thin film lossy line for preventing reflections in microcircuit chip package interconnections |
07/01/1980 | US4210704 Electrical devices employing a conductive epoxy resin formulation as a bonding medium |
07/01/1980 | US4210498 Camma-pyrones, nitrated catechols, and flavones as chelating agents |
07/01/1980 | US4210464 Method of simultaneously controlling the lifetimes and leakage currents in semiconductor devices by hot electron irradiation through passivating glass layers |
07/01/1980 | US4210462 Vitreous external lamellas, radiation transparent resin |
07/01/1980 | US4209894 Fusible-link semiconductor memory |
06/24/1980 | US4209799 Semiconductor mounting producing efficient heat dissipation |
06/24/1980 | US4209798 Module for integrated circuits |
06/24/1980 | US4209716 Semiconductor integrated circuit with implanted resistor element in second-level polycrystalline silicon layer |
06/24/1980 | US4209358 Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive |
06/24/1980 | US4209355 Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices |
06/24/1980 | US4209347 Has similar coefficient of thermal expansion |
06/24/1980 | US4208781 Semiconductor integrated circuit with implanted resistor element in polycrystalline silicon layer |
06/17/1980 | CA1079868A1 Plastic encapsulated semiconductor devices and method of making same |
06/17/1980 | CA1079862A1 Metallized ceramic and printed circuit module |
06/17/1980 | CA1079683A1 Forming feedthrough connections for multilevel interconnection metallurgy systems |
06/12/1980 | WO1980001222A1 Method of manufacturing semiconductor laser devices |
06/12/1980 | WO1980001220A1 Three-dimensionally structured microelectronic device |
06/11/1980 | EP0012019A1 An electrode for a semiconductor device and method of making such an electrode |
06/11/1980 | EP0011975A1 A semiconductor element in an EPROM bootstrap circuit |
06/11/1980 | EP0011694A1 Method and apparatus for the reversible adjustment of the electrical parameters of an electrical circuit |
06/10/1980 | US4207587 Package for light-triggered thyristor |
06/10/1980 | US4207585 Semiconductors |
06/10/1980 | US4207556 Programmable logic array arrangement |
06/03/1980 | US4206472 Thin film structures and method for fabricating same |
06/03/1980 | US4206254 Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern |
05/28/1980 | EP0011406A1 Multilayer circuit board, and method of making it |
05/27/1980 | US4204317 Method of making a lead frame |
05/27/1980 | CA1078528A1 Method for producing pressed contact power semiconductors |
05/27/1980 | CA1078480A1 Low profile dip receptacle |
05/20/1980 | US4204248 Heat transfer mounting arrangement for a solid state device connected to a circuit board |
05/20/1980 | US4204246 Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block |
05/20/1980 | US4204218 Support structure for thin semiconductor wafer |
05/20/1980 | US4203792 Method for the fabrication of devices including polymeric materials |
05/20/1980 | US4203648 Solder bearing terminal |
05/20/1980 | US4203488 Self-fastened heat sinks |
05/20/1980 | CA1078079A1 Method for preparing a multilayer ceramic |
05/20/1980 | CA1078077A1 Self-registering method of fabricating field effect transistors |
05/20/1980 | CA1078071A1 Integrated circuit package |
05/14/1980 | EP0011013A1 Process of making devices comprising calibrated metallic spheres and electrocatalytic writing device |
05/14/1980 | EP0010623A1 Method for forming a laminated structure for highly integrated semiconductor devices with an insulating layer between two conductive layers |
05/13/1980 | US4203129 Bubble generating tunnels for cooling semiconductor devices |
05/13/1980 | US4202916 Surfacing process for the stabilization of semiconductor bodies employing glass containing quartz passivating layer |
05/13/1980 | CA1077582A1 Termination means for an electrical device |
05/13/1980 | CA1077564A1 Cooling container for liquid-cooled semiconductor construction elements and manufacturing process for such a cooling container |
05/06/1980 | US4202007 Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers |
05/06/1980 | US4201598 Electron irradiation process of glass passivated semiconductor devices for improved reverse characteristics |
05/06/1980 | US4200975 Additive method of forming circuit crossovers |
05/06/1980 | CA1076934A1 Edge etch method and structure for producing narrow openings to the surface of materials |
04/30/1980 | EP0010204A1 Semiconductor absolute pressure transducer assembly |
04/30/1980 | EP0010139A1 Read only memory cell using FET transistors |
04/30/1980 | EP0010138A1 A method of treating aluminium microcircuits |
04/29/1980 | US4200880 Microwave transistor with distributed output shunt tuning |
04/29/1980 | CA1076709A1 Electrical connector |
04/29/1980 | CA1076342A1 Intermediate precoat layer for encapsulated electrical device |
04/22/1980 | US4199778 Interconnection structure for semiconductor integrated circuits |
04/22/1980 | US4199777 Semiconductor device and a method of manufacturing the same |
04/22/1980 | US4199654 Semiconductor mounting assembly |
04/16/1980 | EP0009978A1 Hybrid Type integrated circuit device |
04/16/1980 | EP0009610A1 Method for producing testable semiconductor miniature containers in strip form |
04/16/1980 | EP0009605A1 Cooling structure for a semiconductor module |
04/15/1980 | US4198696 Laser cut storage cell |
04/15/1980 | US4198694 X-Y Addressable memory |
04/15/1980 | US4198444 Method for providing substantially hermetic sealing means for electronic components |
04/15/1980 | US4197632 Monitoring, current modifier |
04/15/1980 | CA1075830A1 Glass passivated junction semiconductor devices |
04/15/1980 | CA1075827A1 Above and below ground plane wiring |
04/08/1980 | US4197555 Semiconductor device |
04/08/1980 | US4196959 Carrier strip for round lead pins and method for making the same |
04/08/1980 | US4196775 Shock-mounted, liquid cooled cold plate assembly |
04/08/1980 | US4196508 Durable insulating protective layer for hybrid CCD/mosaic IR detector array |
04/08/1980 | CA1075376A1 Double extruded mount |
04/08/1980 | CA1075373A1 Semiconductor device having a hetero junction |
04/08/1980 | CA1075372A1 Semiconductor device with underpass interconnection zone |
04/08/1980 | CA1075370A1 Gas-insulated thyristor arrangement |
04/08/1980 | CA1075271A1 Glass for the passivation of semiconductor devices |
04/03/1980 | WO1980000642A1 Semiconductor device |
04/03/1980 | WO1980000641A1 Dynamic random access memory |
04/03/1980 | WO1980000640A1 Process for manufacturing a filled casing for a disc shape semiconductor body and presenting at least one pn jonction |
04/02/1980 | EP0009152A1 Controllable semiconductor power device |
04/02/1980 | EP0009135A1 Method for producing a plastic encapsulation for semiconductor elements on metallic carriers and encapsulation thereby produced |
04/02/1980 | EP0009131A1 Process for in situ modification of solder alloy compositions |
04/02/1980 | EP0009125A1 Semiconductor component with passivating protection layer |
04/01/1980 | US4196467 Electronic system housing structure, particularly for automotive environments |
04/01/1980 | US4196444 Encapsulated power semiconductor device with single piece heat sink mounting plate |
04/01/1980 | US4196443 Buried contact configuration for CMOS/SOS integrated circuits |
04/01/1980 | US4196442 Semiconductor device |
04/01/1980 | US4196309 Semiconductor device subassembly and manufacture thereof |
03/25/1980 | US4195307 Fabricating integrated circuits incorporating high-performance bipolar transistors |