Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1980
07/15/1980US4213117 Method and apparatus for detecting positions of chips on a semiconductor wafer
07/15/1980US4212349 Micro bellows thermo capsule
07/15/1980US4212265 Tinning apparatus for multiple solder surfaces
07/15/1980CA1081411A1 Method for hermetically sealing an electronic circuit package
07/10/1980WO1980001437A1 High frequency semiconductor unit
07/09/1980EP0012863A2 Method of making semiconductor devices with reduced parasitic capacitance
07/09/1980EP0012846A1 Thyristor
07/08/1980US4211919 Portable data carrier including a microprocessor
07/08/1980CA1081370A1 Package for light-triggered thyristor
07/08/1980CA1081334A1 Two-part electrical connector for mounting an electrical component on a substrate
07/01/1980US4210926 Intermediate member for mounting and contacting a semiconductor body
07/01/1980US4210885 Thin film lossy line for preventing reflections in microcircuit chip package interconnections
07/01/1980US4210704 Electrical devices employing a conductive epoxy resin formulation as a bonding medium
07/01/1980US4210498 Camma-pyrones, nitrated catechols, and flavones as chelating agents
07/01/1980US4210464 Method of simultaneously controlling the lifetimes and leakage currents in semiconductor devices by hot electron irradiation through passivating glass layers
07/01/1980US4210462 Vitreous external lamellas, radiation transparent resin
07/01/1980US4209894 Fusible-link semiconductor memory
06/1980
06/24/1980US4209799 Semiconductor mounting producing efficient heat dissipation
06/24/1980US4209798 Module for integrated circuits
06/24/1980US4209716 Semiconductor integrated circuit with implanted resistor element in second-level polycrystalline silicon layer
06/24/1980US4209358 Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
06/24/1980US4209355 Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
06/24/1980US4209347 Has similar coefficient of thermal expansion
06/24/1980US4208781 Semiconductor integrated circuit with implanted resistor element in polycrystalline silicon layer
06/17/1980CA1079868A1 Plastic encapsulated semiconductor devices and method of making same
06/17/1980CA1079862A1 Metallized ceramic and printed circuit module
06/17/1980CA1079683A1 Forming feedthrough connections for multilevel interconnection metallurgy systems
06/12/1980WO1980001222A1 Method of manufacturing semiconductor laser devices
06/12/1980WO1980001220A1 Three-dimensionally structured microelectronic device
06/11/1980EP0012019A1 An electrode for a semiconductor device and method of making such an electrode
06/11/1980EP0011975A1 A semiconductor element in an EPROM bootstrap circuit
06/11/1980EP0011694A1 Method and apparatus for the reversible adjustment of the electrical parameters of an electrical circuit
06/10/1980US4207587 Package for light-triggered thyristor
06/10/1980US4207585 Semiconductors
06/10/1980US4207556 Programmable logic array arrangement
06/03/1980US4206472 Thin film structures and method for fabricating same
06/03/1980US4206254 Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
05/1980
05/28/1980EP0011406A1 Multilayer circuit board, and method of making it
05/27/1980US4204317 Method of making a lead frame
05/27/1980CA1078528A1 Method for producing pressed contact power semiconductors
05/27/1980CA1078480A1 Low profile dip receptacle
05/20/1980US4204248 Heat transfer mounting arrangement for a solid state device connected to a circuit board
05/20/1980US4204246 Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
05/20/1980US4204218 Support structure for thin semiconductor wafer
05/20/1980US4203792 Method for the fabrication of devices including polymeric materials
05/20/1980US4203648 Solder bearing terminal
05/20/1980US4203488 Self-fastened heat sinks
05/20/1980CA1078079A1 Method for preparing a multilayer ceramic
05/20/1980CA1078077A1 Self-registering method of fabricating field effect transistors
05/20/1980CA1078071A1 Integrated circuit package
05/14/1980EP0011013A1 Process of making devices comprising calibrated metallic spheres and electrocatalytic writing device
05/14/1980EP0010623A1 Method for forming a laminated structure for highly integrated semiconductor devices with an insulating layer between two conductive layers
05/13/1980US4203129 Bubble generating tunnels for cooling semiconductor devices
05/13/1980US4202916 Surfacing process for the stabilization of semiconductor bodies employing glass containing quartz passivating layer
05/13/1980CA1077582A1 Termination means for an electrical device
05/13/1980CA1077564A1 Cooling container for liquid-cooled semiconductor construction elements and manufacturing process for such a cooling container
05/06/1980US4202007 Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
05/06/1980US4201598 Electron irradiation process of glass passivated semiconductor devices for improved reverse characteristics
05/06/1980US4200975 Additive method of forming circuit crossovers
05/06/1980CA1076934A1 Edge etch method and structure for producing narrow openings to the surface of materials
04/1980
04/30/1980EP0010204A1 Semiconductor absolute pressure transducer assembly
04/30/1980EP0010139A1 Read only memory cell using FET transistors
04/30/1980EP0010138A1 A method of treating aluminium microcircuits
04/29/1980US4200880 Microwave transistor with distributed output shunt tuning
04/29/1980CA1076709A1 Electrical connector
04/29/1980CA1076342A1 Intermediate precoat layer for encapsulated electrical device
04/22/1980US4199778 Interconnection structure for semiconductor integrated circuits
04/22/1980US4199777 Semiconductor device and a method of manufacturing the same
04/22/1980US4199654 Semiconductor mounting assembly
04/16/1980EP0009978A1 Hybrid Type integrated circuit device
04/16/1980EP0009610A1 Method for producing testable semiconductor miniature containers in strip form
04/16/1980EP0009605A1 Cooling structure for a semiconductor module
04/15/1980US4198696 Laser cut storage cell
04/15/1980US4198694 X-Y Addressable memory
04/15/1980US4198444 Method for providing substantially hermetic sealing means for electronic components
04/15/1980US4197632 Monitoring, current modifier
04/15/1980CA1075830A1 Glass passivated junction semiconductor devices
04/15/1980CA1075827A1 Above and below ground plane wiring
04/08/1980US4197555 Semiconductor device
04/08/1980US4196959 Carrier strip for round lead pins and method for making the same
04/08/1980US4196775 Shock-mounted, liquid cooled cold plate assembly
04/08/1980US4196508 Durable insulating protective layer for hybrid CCD/mosaic IR detector array
04/08/1980CA1075376A1 Double extruded mount
04/08/1980CA1075373A1 Semiconductor device having a hetero junction
04/08/1980CA1075372A1 Semiconductor device with underpass interconnection zone
04/08/1980CA1075370A1 Gas-insulated thyristor arrangement
04/08/1980CA1075271A1 Glass for the passivation of semiconductor devices
04/03/1980WO1980000642A1 Semiconductor device
04/03/1980WO1980000641A1 Dynamic random access memory
04/03/1980WO1980000640A1 Process for manufacturing a filled casing for a disc shape semiconductor body and presenting at least one pn jonction
04/02/1980EP0009152A1 Controllable semiconductor power device
04/02/1980EP0009135A1 Method for producing a plastic encapsulation for semiconductor elements on metallic carriers and encapsulation thereby produced
04/02/1980EP0009131A1 Process for in situ modification of solder alloy compositions
04/02/1980EP0009125A1 Semiconductor component with passivating protection layer
04/01/1980US4196467 Electronic system housing structure, particularly for automotive environments
04/01/1980US4196444 Encapsulated power semiconductor device with single piece heat sink mounting plate
04/01/1980US4196443 Buried contact configuration for CMOS/SOS integrated circuits
04/01/1980US4196442 Semiconductor device
04/01/1980US4196309 Semiconductor device subassembly and manufacture thereof
03/1980
03/25/1980US4195307 Fabricating integrated circuits incorporating high-performance bipolar transistors