| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/25/1980 | US4195195 Tape automated bonding test board |
| 03/25/1980 | US4195193 Lead frame and chip carrier housing |
| 03/25/1980 | US4194934 Method of passivating a semiconductor device utilizing dual polycrystalline layers |
| 03/25/1980 | US4194668 Apparatus for aligning and soldering multiple electrode pedestals to the solderable ohmic contacts of semiconductor components |
| 03/25/1980 | US4194283 Process for the production of a single transistor memory cell |
| 03/25/1980 | CA1074457A1 Method for manufacturing a semiconductor integrated circuit device |
| 03/25/1980 | CA1074427A1 Solid state display apparatus |
| 03/25/1980 | CA1074412A1 Low profile integrated circuit socket |
| 03/20/1980 | WO1980000513A1 Electrical socket connector construction |
| 03/20/1980 | WO1980000511A1 Method and device for cooling dissipation heat producing electric and/or electronic elements |
| 03/18/1980 | US4193445 Conduction cooled module |
| 03/18/1980 | US4193444 Electrical mounting means for thermal conduction |
| 03/18/1980 | CA1074023A1 Millimeter wave semiconductor device |
| 03/11/1980 | US4193125 Read only memory |
| 03/11/1980 | US4193083 Package for push-pull semiconductor devices |
| 03/11/1980 | US4193082 Multi-layer dielectric structure |
| 03/11/1980 | US4192433 Hermetic sealing cover for a container for semiconductor devices |
| 03/11/1980 | US4192063 Silver-soldering ring of copper-nickel alloy |
| 03/11/1980 | US4192059 Process for and structure of high density VLSI circuits, having inherently self-aligned gates and contacts for FET devices and conducting lines |
| 03/11/1980 | CA1073557A1 Multilayer interconnect system, and method of making |
| 03/11/1980 | CA1073555A1 Heat transfer mechanism for integrated circuit package |
| 03/05/1980 | EP0008406A1 Method for producing a passivating layer on a silicon semiconductor body |
| 03/04/1980 | US4191577 Brazing slurry |
| 03/04/1980 | CA1073046A1 High current-rectifier arrangement |
| 02/26/1980 | US4190855 Installation of a semiconductor chip on a glass substrate |
| 02/26/1980 | US4190854 Trim structure for integrated capacitors |
| 02/26/1980 | US4190735 Semiconductor device package |
| 02/26/1980 | US4190310 Ejection device for a electronic package connector |
| 02/26/1980 | US4190176 Sealing cover unit for a container for a semiconductor device |
| 02/26/1980 | US4190098 Multiple component circuit board cooling device |
| 02/26/1980 | US4189825 Integrated test and assembly device |
| 02/20/1980 | EP0008002A1 Electronic circuit package and method of testing such package |
| 02/20/1980 | EP0007993A1 Conductor plate for mounting and electrically connecting semiconductor chips |
| 02/19/1980 | US4189524 To reduce short circuiting |
| 02/19/1980 | US4189342 Semiconductor device comprising projecting contact layers |
| 02/19/1980 | US4189199 Electrical socket connector construction |
| 02/19/1980 | US4189085 Method of assembling a microcircuit with face-mounted leads |
| 02/19/1980 | US4188996 Liquid cooler for semiconductor power elements |
| 02/19/1980 | US4188708 Integrated circuit package with optical input coupler |
| 02/19/1980 | US4188707 Semiconductor devices and method of manufacturing the same |
| 02/12/1980 | US4188671 Switched-capacitor memory |
| 02/12/1980 | US4188637 Disc-shaped semiconductor device having an annular housing of elastomer material |
| 02/12/1980 | US4188636 Semiconductor device having bump terminal electrodes |
| 02/12/1980 | US4188438 Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices |
| 02/12/1980 | US4188194 Direct conversion process for making cubic boron nitride from pyrolytic boron nitride |
| 02/12/1980 | US4188085 High density solder tail connector assembly for leadless integrated circuit packages |
| 02/12/1980 | US4187599 Layers of silver and tin, electrodeposition |
| 02/12/1980 | CA1071772A1 Method of manufacturing a semi-conductor device employing semi-conductor to semi-insulator conversion by ion implantation |
| 02/06/1980 | EP0007762A1 Apparatus and method for encapsulating electronic components in hardenable plastics |
| 02/05/1980 | US4187529 Terminal construction for electrical circuit device |
| 02/05/1980 | US4187513 Solid state current limiter |
| 01/24/1980 | WO1980000116A1 Mounting semi-conductor elements with insulating envelope |
| 01/23/1980 | EP0007015A1 Device for cooling semiconductor chips with monolithic integrated circuits |
| 01/23/1980 | EP0006907A1 Solar panel unit |
| 01/22/1980 | US4185294 Semiconductor device and a method for manufacturing the same |
| 01/22/1980 | US4184933 Integrated circuits; etching, sputtering |
| 01/15/1980 | US4184211 Output stage for switching regulated power supply |
| 01/15/1980 | US4184207 High density floating gate electrically programmable ROM |
| 01/15/1980 | US4184133 Assembly of microwave integrated circuits having a structurally continuous ground plane |
| 01/15/1980 | US4183781 Stabilization process for aluminum microcircuits which have been reactive-ion etched |
| 01/15/1980 | US4183400 Heat exchanger |
| 01/15/1980 | US4183135 Hermetic glass encapsulation for semiconductor die and method |
| 01/09/1980 | EP0006702A1 Semiconductor integrated memory circuit |
| 01/09/1980 | EP0006509A1 Process for the manufacturing of a passivating coating on electronic circuits and material for the coating |
| 01/09/1980 | EP0006445A1 Methods of fabricating electrical apparatus comprising one or more heat generating electrical components |
| 01/09/1980 | EP0006444A1 Multi-layer dielectric substrate |
| 01/09/1980 | EP0006241A1 Cooling device for electrical components |
| 01/08/1980 | US4183042 Power semiconductor device |
| 01/08/1980 | US4183041 Self biasing of a field effect transistor mounted in a flip-chip carrier |
| 01/08/1980 | US4183037 Semiconductor device |
| 01/08/1980 | US4182781 Low cost method for forming elevated metal bumps on integrated circuit bodies employing an aluminum/palladium metallization base for electroless plating |
| 01/08/1980 | CA1069620A1 Semiconductor device having a passivated surface |
| 01/01/1980 | CA1069220A Integrated circuit package |
| 12/25/1979 | US4180828 Hybrid circuit having a semiconductor circuit |
| 12/25/1979 | US4180826 MOS double polysilicon read-only memory and cell |
| 12/25/1979 | US4180596 Method for providing a metal silicide layer on a substrate |
| 12/25/1979 | US4180161 Carrier structure integral with an electronic package and method of construction |
| 12/25/1979 | US4179802 Studded chip attachment process |
| 12/25/1979 | US4179794 Process of manufacturing semiconductor devices |
| 12/25/1979 | CA1068829A Integrated test and assembly device |
| 12/18/1979 | US4179324 Superimposing on substrate, electrostatically bonding, removal from substrate |
| 12/18/1979 | US4178674 Process for forming a contact region between layers of polysilicon with an integral polysilicon resistor |
| 12/12/1979 | EP0006003A1 Improvements in or relating to field effect devices and their fabrication |
| 12/12/1979 | EP0006002A1 Method of fabricating a field effect transistor |
| 12/12/1979 | EP0006001A1 Improvements in or relating to field effect devices and their fabrication |
| 12/12/1979 | EP0005762A1 Method to apply a tension with an electron beam |
| 12/12/1979 | EP0005739A1 Method of making cross-over interconnections for integrated RC networks |
| 12/12/1979 | EP0005723A1 Large scale integrated circuit and method of fabricating the same |
| 12/11/1979 | US4178630 Fluid-cooled thyristor valve |
| 12/11/1979 | US4178197 Formation of epitaxial tunnels utilizing oriented growth techniques |
| 12/11/1979 | US4177554 Assembling leads to a substrate |
| 12/11/1979 | CA1068011A1 Process for fabricating devices having dielectric isolation utilizing anodic treatment and selective oxidation |
| 12/11/1979 | CA1068010A1 Semiconductor devices using genetically grown films of silicon nitride |
| 12/11/1979 | CA1068001A1 Single igfet memory cell with buried storage element |
| 12/11/1979 | CA1067972A1 Electrical connection structure and method |
| 12/04/1979 | US4177480 Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads |
| 12/04/1979 | US4177096 Method for manufacturing a semiconductor integrated circuit device |
| 12/04/1979 | US4176443 Method of connecting semiconductor structure to external circuits |
| 11/29/1979 | WO1979001012A1 Fluid cooled semiconductor device |
| 11/27/1979 | US4176372 Semiconductor device having oxygen doped polycrystalline passivation layer |