Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1981
06/24/1981EP0030641A2 Insulating coating for ceramic substrate and method to form such a coating
06/24/1981EP0030634A1 Nickel-X/gold/nickel-X conductors for solid state devices
06/24/1981EP0030633A1 Nickel-gold-nickel conductors for solid state devices
06/23/1981US4275410 Three-dimensionally structured microelectronic device
06/23/1981US4275407 Durable insulating protective layer for hybrid CCD/mosaic IR detector array
06/23/1981US4275380 Topography for integrated circuits pattern recognition array
06/23/1981CA1103811A1 Metalized substrate having a thin film barrier layer
06/17/1981EP0030486A1 Current rectifier assembly
06/17/1981EP0030280A1 Matrix array of semiconductor elements
06/16/1981US4274106 Explosion proof vibration resistant flat package semiconductor device
06/16/1981US4273859 Method of forming solder bump terminals on semiconductor elements
06/16/1981US4273805 Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer
06/16/1981US4273185 Device for holding a disc-shaped semiconductor element
06/11/1981WO1981001629A1 Fine-line solid state device
06/10/1981EP0030168A1 Device for parallel arrangement of very high frequency power transistors
06/10/1981EP0029858A1 Semiconductor device
06/09/1981US4272776 Semiconductor device and method of manufacturing same
06/09/1981US4272644 Electronic hybrid circuit package
06/09/1981US4272561 Polymer coating, masking
06/09/1981US4271588 Process of manufacturing a encapsulated hybrid circuit assembly
06/09/1981CA1102923A1 Semiconductor metallisation system
06/03/1981EP0029785A1 Electrical connection system
06/03/1981EP0029501A2 Heat sink member and aircooling system for semiconductor modules
06/02/1981US4271426 Leaded mounting and connector unit for an electronic device
06/02/1981US4271424 Electrical contact connected with a semiconductor region which is short circuited with the substrate through said region
06/02/1981US4271061 Epoxy resin compositions for sealing semiconductors
06/02/1981US4270604 Heat sink
06/02/1981US4270265 Method of manufacturing hybrid integrated circuit assemblies
06/02/1981US4270262 Semiconductor device and process for making the same
05/1981
05/28/1981WO1981001484A1 Semiconductor memory device
05/28/1981WO1981001423A1 Method of and apparatus for active electrochemical water and similar environmental contaminant elimination in semiconductor and other electronic and electrical devices and the like
05/27/1981EP0029369A2 A method of manufacturing a semiconductor device
05/27/1981EP0029334A1 Series-connected combination of two-terminal semiconductor devices and their fabrication
05/27/1981EP0029099A2 Semiconductor memory device
05/26/1981US4270138 Enhanced thermal transfer package for a semiconductor device
05/26/1981US4270106 Broadband mode suppressor for microwave integrated circuits
05/26/1981CA1102010A1 Magnetic heat sink for semiconductor ship
05/26/1981CA1102009A1 Integrated circuit layout utilizing separated active circuit and wiring regions
05/20/1981EP0028994A2 Compositions and method for the encapsulation of electronic components by a mouldable material based on a thermohardenable prepolymer
05/20/1981EP0028823A1 Electrically conductive connection between the active parts of an electrical component or an integrated circuit with contact points
05/19/1981US4268850 Forced vaporization heat sink for semiconductor devices
05/19/1981US4268849 Raised bonding pad
05/19/1981US4268848 Preferred device orientation on integrated circuits for better matching under mechanical stress
05/19/1981US4268584 Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon
05/19/1981US4268348 Method for making semiconductor structure
05/19/1981US4267633 Method to make an integrated circuit with severable conductive strip
05/19/1981US4267632 Process for fabricating a high density electrically programmable memory array
05/14/1981WO1981001345A1 Integrated circuit alpha radiation shielding means
05/13/1981EP0028490A1 Integrated circuit with Alpha radiation shielding means
05/12/1981US4267559 Low thermal impedance light-emitting diode package
05/12/1981CA1101127A1 Semiconductor component with protective passivating layer
05/06/1981EP0028170A1 Method of grooving and vitrification by silicon nitride masking and semiconductor components obtained
05/06/1981EP0027825A1 Ceramic base
05/05/1981USRE30604 Reusable fixture for an integrated circuit chip
05/05/1981US4266282 Vertical semiconductor integrated circuit chip packaging
05/05/1981US4266267 Mounting arrangement for transistors and the like
05/05/1981US4266239 Semiconductor device having improved high frequency characteristics
05/05/1981US4266090 Kovar" alloy frame brazed to a molybdenum bottom used for microcircuits
05/05/1981US4266089 Stainless steel frame soldered to a copper bottom for microcircuits
05/05/1981US4265935 Integrated circuits
05/05/1981US4265685 Utilizing simultaneous masking and diffusion of peripheral substrate areas
05/05/1981CA1100648A1 Method for providing a metal silicide layer on a substrate
04/1981
04/29/1981EP0027629A1 Semiconductor component with at least one or several semiconductor bodies
04/28/1981US4264917 Flat package for integrated circuit devices
04/28/1981US4264397 Apparatus for sticking nonconductive tape having plating perforations to sheet metal
04/28/1981US4263965 Leaved thermal cooling module
04/28/1981CA1100202A1 Electrical connector having a resilient cover
04/22/1981EP0027395A1 Process for passivating gallium arsenide semiconductor components
04/21/1981US4263607 Snap fit support housing for a semiconductor power wafer
04/21/1981US4263606 Insulative layer over wiring, containing bump electrode
04/21/1981US4263058 Forming metal silicide layer, oxidizing
04/21/1981CA1099822A1 Fabricating integrated circuits incorporating high- performance bipolar transistors
04/21/1981CA1099821A1 Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive rf power package
04/21/1981CA1099481A1 Cubic boron nitride (cbn) compact and direct conversion process for making same from pyrolytic boron nitride (pbn)
04/15/1981EP0027017A1 Integrated circuit package
04/15/1981EP0026967A2 A method of manufacturing a semiconductor device using a thermosetting resin film
04/15/1981EP0026953A1 Method of manufacturing a semiconductor device
04/15/1981EP0026807A1 Multilayer module with constant characteristic wave impedance
04/15/1981EP0026788A1 Semiconductor device
04/14/1981US4262300 Microcircuit package formed of multi-components
04/14/1981US4262299 Semiconductor-on-insulator device and method for its manufacture
04/14/1981US4262295 Semiconductor device
04/14/1981US4262165 Packaging structure for semiconductor IC chip
04/14/1981US4261781 Process for forming compound semiconductor bodies
04/14/1981US4261519 Air distribution system
04/14/1981US4261096 Process for forming metallic ground grid for integrated circuits
04/14/1981CA1099338A1 Cooling capsule for thyristors
04/07/1981US4261005 Miniature heat sink
04/07/1981US4261004 Semiconductor device
04/07/1981US4261003 Integrated circuit structures with full dielectric isolation and a novel method for fabrication thereof
04/07/1981US4260451 Method of reworking substrates, and solutions for use therein
04/07/1981US4260436 Dielectrics, dopes, cells
04/07/1981CA1098980A1 Electrical connector
04/07/1981CA1098662A1 Method of making a lead frame
04/02/1981WO1981000949A1 Double cavity semiconductor chip carrier
03/1981
03/31/1981US4259685 Clamp for securing an encased power frame to a heat sink
03/31/1981US4259684 Packages for microwave integrated circuits
03/31/1981US4259680 N-p-n structure
03/31/1981US4259436 Tape carriers for integrated circuits
03/31/1981US4259367 Fine line repair technique
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