| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/26/1979 | CA1057420A1 Passivated and encapsulated semiconductors and method of making same |
| 06/26/1979 | CA1057417A1 Ingrown lead frame with strain relief |
| 06/26/1979 | CA1057411A1 Through-substrate source contact for microwave fet |
| 06/19/1979 | US4158850 Thyristor having improved cooling and improved high frequency operation with adjacent control terminals |
| 06/19/1979 | US4158745 Semiconductors |
| 06/19/1979 | US4158719 Alloying controlled to obtain desired qualities |
| 06/19/1979 | CA1056658A1 Method of vapor deposition |
| 06/13/1979 | EP0002364A1 Integrated semiconductor device and process for producing it |
| 06/13/1979 | EP0002205A1 Process for producing nucleate boiling centers on a surface of a silicon semiconductor substrate, cooling method using a surface produced by said process and apparatus for cooling a semiconductor device |
| 06/13/1979 | EP0002185A1 Process for interconnecting two crossed conducting metal lines deposited on a substrate |
| 06/12/1979 | US4157611 Packaging structure for semiconductor IC chip and method of packaging the same |
| 06/12/1979 | CA1056511A1 Intermetallic layers in thin films for improved electromigration resistance |
| 06/05/1979 | US4157563 Semiconductor device |
| 06/05/1979 | US4156963 Method for manufacturing a semiconductor device |
| 05/31/1979 | WO1979000302A1 Semiconductor device |
| 05/30/1979 | EP0002166A2 Carrier for mounting an integrated-circuit chip and method for its manufacture |
| 05/30/1979 | EP0002165A1 Method of manufacturing a conductor structure and application in a field effect transistor |
| 05/30/1979 | EP0002107A2 Method of making a planar semiconductor device |
| 05/29/1979 | US4156751 Sheet material for forming envelopes used to protect electronic components |
| 05/29/1979 | US4156458 Flexible thermal connector for enhancing conduction cooling |
| 05/22/1979 | US4156250 Oxides of germanium, lead, silicon, and aluminum and small amount of water |
| 05/22/1979 | US4155155 Metal layers applied by vacuum deposition and serigraphy |
| 05/22/1979 | CA1055159A1 Charge transfer device manufacture |
| 05/22/1979 | CA1055134A1 Terminal lead construction for electrical circuit substrate |
| 05/16/1979 | EP0001892A1 Lead frame and package for establishing electrical connections to electronic components |
| 05/16/1979 | EP0001890A1 Improvements in or relating to microwave integrated circuit packages |
| 05/15/1979 | US4154874 Of aluminum and a transition metal, annealing, masking |
| 05/15/1979 | US4154344 Material for forming envelopes used to protect electronic components |
| 05/15/1979 | US4153988 Decreased driver noise and cross-talk between signal lines |
| 05/15/1979 | CA1054725A1 Discontinuous semiconductor contact layers |
| 05/15/1979 | CA1054724A1 Correcting doping defects |
| 05/08/1979 | US4153949 Electrically programmable read-only-memory device |
| 05/08/1979 | US4153910 Molded semiconductor device with header leads |
| 05/08/1979 | US4153518 Electrodeposition |
| 05/08/1979 | US4153107 Temperature equalizing element for a conduction cooling module |
| 05/08/1979 | US4152823 High temperature refractory metal contact assembly and multiple layer interconnect structure |
| 05/08/1979 | CA1053866A1 Microcellular heterocyclic polymer structures |
| 05/02/1979 | EP0001707A1 A thermally isolated monolithic semiconductor die and a process for producing such a die |
| 05/02/1979 | EP0001550A1 Integrated semiconductor circuit for a small-sized structural element, and method for its production |
| 05/01/1979 | US4152718 Semiconductor structure for millimeter waves |
| 05/01/1979 | US4152195 Polyamides, two-step cure |
| 05/01/1979 | US4151638 Hermetic glass encapsulation for semiconductor die and method |
| 05/01/1979 | CA1053749A1 Converter valve |
| 04/24/1979 | US4151548 Cooling container for cooling a semiconductor element |
| 04/24/1979 | US4151547 Arrangement for heat transfer between a heat source and a heat sink |
| 04/24/1979 | US4151546 Semiconductor device having electrode-lead layer units of differing thicknesses |
| 04/24/1979 | US4151545 Semiconductor electric circuit device with plural-layer aluminum base metallization |
| 04/24/1979 | US4151544 Lead terminal for button diode |
| 04/24/1979 | US4151543 Lead electrode structure for a semiconductor chip carried on a flexible carrier |
| 04/24/1979 | US4151479 Low frequency power amplifier using MOS FET's |
| 04/24/1979 | CA1053379A1 Lead frames on plastic films |
| 04/24/1979 | CA1053090A1 Resist reflow method for making submicron patterned resist masks |
| 04/17/1979 | US4150420 Electrical connector |
| 04/17/1979 | US4150394 Flat package semiconductor device having high explosion preventing capacity |
| 04/17/1979 | US4150393 High frequency semiconductor package |
| 04/17/1979 | US4150177 Method for selectively nickeling a layer of polymerized polyester resin |
| 04/17/1979 | US4149310 Method of making a heat sink mounting |
| 04/17/1979 | CA1052912A1 Gang bonding interconnect tape for semiconductive devices and method of making same |
| 04/17/1979 | CA1052896A1 Microelectronic circuit case |
| 04/10/1979 | CA1052075A1 Longitudinally fed component insertion apparatus |
| 04/04/1979 | EP0001209A1 Integrated semiconductor circuit |
| 04/03/1979 | US4148056 Glass-encapsulated semiconductor device containing cylindrical stack of semiconductor pellets |
| 04/03/1979 | US4148055 Integrated circuit having complementary bipolar transistors |
| 04/03/1979 | US4147971 Impedance trim network for use in integrated circuit applications |
| 04/03/1979 | US4147889 Chip carrier |
| 04/03/1979 | US4147579 Method of producing an electric component consisting of elements joined by an insulating co-polymer layer |
| 04/03/1979 | CA1052002A1 Apparatus for cooling electrical devices at different electrical potentials by means of a flowing medium |
| 03/27/1979 | US4146903 System for limiting power dissipation in a power transistor to less than a destructive level |
| 03/27/1979 | US4146902 Irreversible semiconductor switching element and semiconductor memory device utilizing the same |
| 03/27/1979 | US4146655 Method for encapsulating a semiconductor diode |
| 03/22/1979 | WO1979000140A1 Solar panel unit |
| 03/21/1979 | EP0001153A1 Cooling heat generating electrical components in an electrical apparatus |
| 03/21/1979 | EP0001123A1 Capsule for cooling semiconductor chips |
| 03/20/1979 | US4145708 Power module with isolated substrates cooled by integral heat-energy-removal means |
| 03/20/1979 | US4145703 Doped polysilicon gate electrode, v-shaped |
| 03/20/1979 | US4145702 Electrically programmable read-only-memory device |
| 03/20/1979 | US4144648 Connector |
| 03/13/1979 | US4144493 Integrated circuit test structure |
| 03/13/1979 | US4143456 Semiconductor device insulation method |
| 03/13/1979 | CA1050668A1 Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices |
| 03/13/1979 | CA1050647A1 Light-emitting diode element and device |
| 03/07/1979 | EP0000863A1 Temperature compensated integrated semiconductor resistor |
| 03/06/1979 | US4143395 Stud-type semiconductor device |
| 03/06/1979 | US4143390 Semiconductor device and a logical circuit formed of the same |
| 03/06/1979 | US4143383 Controllable impedance attenuator having all connection contacts on one side |
| 03/06/1979 | US4142893 Spray etch dicing method |
| 03/06/1979 | US4142662 Method of bonding microelectronic chips |
| 03/06/1979 | US4142577 Cooling device for a liquid-cooled semiconductor power component |
| 03/06/1979 | CA1050189A1 Organopolysiloxane containing adhesive compositions |
| 02/27/1979 | US4142231 High current low voltage liquid cooled switching regulator DC power supply |
| 02/27/1979 | US4142203 Method of assembling a hermetically sealed semiconductor unit |
| 02/27/1979 | US4142202 Gold, nickel, silver, dopes |
| 02/27/1979 | US4142115 Semiconductor device with a thermal protective device |
| 02/27/1979 | US4141782 Bump circuits on tape utilizing chemical milling |
| 02/27/1979 | US4141712 Manufacturing process for package for electronic devices |
| 02/27/1979 | US4141135 Planar diode, deposition, metallization |
| 02/21/1979 | EP0000856A1 Magnetic heat transfer device for semiconductor chip |
| 02/21/1979 | EP0000786A1 Closed type boiling cooling apparatus |
| 02/21/1979 | EP0000743A1 Method for fabricating tantalum contacts on a N-type conducting silicon semiconductor substrate |
| 02/20/1979 | US4141055 Crossover structure for microelectronic circuits |