| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/27/1979 | US4176142 Powder coating composition |
| 11/27/1979 | CA1067196A1 Cooling assembly |
| 11/20/1979 | US4174562 Process for forming metallic ground grid for integrated circuits |
| 11/14/1979 | EP0005185A1 Method for simultaneously forming Schottky-barrier diodes and ohmic contacts on doped semiconductor regions |
| 11/13/1979 | US4174491 Mount for a light emitting device |
| 11/13/1979 | US4173821 Method of producing semiconductor devices |
| 11/13/1979 | CA1066431A1 Semiconductor device manufacture |
| 11/06/1979 | US4173768 Contact for semiconductor devices |
| 11/06/1979 | US4173683 Organosilicon compound |
| 11/06/1979 | US4173664 Polyxylenes, sterically hindered phenol |
| 11/06/1979 | US4173148 Semiconductor strain gauge with temperature compensator |
| 10/31/1979 | EP0005020A1 A method of making a connection between a metal member and a metal braid |
| 10/30/1979 | US4172907 Coating with heat curable resin |
| 10/30/1979 | US4172698 Pressure gas operated pump |
| 10/30/1979 | US4172317 IC insertion hand tool |
| 10/30/1979 | CA1065499A1 Semiconductor component with electric contacts and process for making the same |
| 10/23/1979 | US4172261 Semiconductor device having a highly air-tight package |
| 10/23/1979 | US4172004 Method for forming dense dry etched multi-level metallurgy with non-overlapped vias |
| 10/18/1979 | WO1979000817A1 Semiconductor device comprising at least two semiconductor elements |
| 10/18/1979 | WO1979000814A1 Semiconductor device comprising two semiconductor elements |
| 10/17/1979 | EP0004708A1 Electrical connector with ejector mechanism |
| 10/17/1979 | EP0004556A1 Method and device for manufacturing an intermediate mounting element for semiconductor chips |
| 10/16/1979 | US4171528 Solderable zener diode |
| 10/16/1979 | US4171049 Magazine and a method of storing electronic components |
| 10/16/1979 | CA1064624A1 High density semiconductor circuit layout |
| 10/09/1979 | US4170677 Anisotropic resistance bonding technique |
| 10/04/1979 | WO1979000736A1 Transistors |
| 10/03/1979 | EP0004475A2 Method of making a heat sink mounting |
| 10/03/1979 | EP0004333A2 Procedure for cooling of electrical components by means of gas and a cooling body |
| 10/03/1979 | EP0004293A2 Array of disc-type thyristors in thermal and electrical contact on cooling bodies |
| 10/03/1979 | EP0004289A2 Method for connecting a first integrated circuit device with a plurality of connection points to a second integrated circuit device |
| 10/02/1979 | US4169746 Method for making silicon on sapphire transistor utilizing predeposition of leads |
| 10/02/1979 | US4169642 Integrated circuit connector |
| 10/02/1979 | CA1063732A1 Semiconductor device with pressure electrical contacts having irregular surfaces |
| 09/25/1979 | US4169271 Fireproofing |
| 09/25/1979 | US4169270 Insulated-gate field-effect transistor with self-aligned contact hole to source or drain |
| 09/25/1979 | US4168960 Method of making a glass encapsulated diode |
| 09/25/1979 | CA1063255A1 Semiconductor wafer alignment marks for use with electron beams |
| 09/25/1979 | CA1063215A1 Semiconductor laser |
| 09/19/1979 | EP0004148A1 Electrical connector for use in mounting an electronic device on a substrate |
| 09/18/1979 | US4168507 Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive RF power package |
| 09/18/1979 | CA1062658A1 Making coplanar layers of thin films |
| 09/11/1979 | US4167771 Thermal interface adapter for a conduction cooling module |
| 09/11/1979 | US4167647 Hybrid microelectronic circuit package |
| 09/11/1979 | US4167413 Making hybrid IC with photoresist laminate |
| 09/04/1979 | US4167031 Heat dissipating assembly for semiconductor devices |
| 09/04/1979 | US4166665 Liquid cooled connector for large scale integrated circuit packages |
| 09/04/1979 | US4166574 Apparatus for marking identification symbols on wafer |
| 08/28/1979 | US4166279 Electromigration resistance in gold thin film conductors |
| 08/28/1979 | CA1061471A1 Controlled thickness of dielectric films on conductor edges |
| 08/23/1979 | WO1979000578A1 Rotating rectifying device for the excitation of a synchronous machine |
| 08/21/1979 | US4165226 Process for preparing an element of a dual-in-line ceramic package provided with a layer of sealing glass |
| 08/21/1979 | US4164811 Process for making a semiconductor component with electrical contacts |
| 08/14/1979 | US4164461 Semiconductor integrated circuit structures and manufacturing methods |
| 08/07/1979 | US4164003 Integrated circuit package and connector therefor |
| 08/07/1979 | US4163769 Sintering diamond particles to form polycrystalline composite, leaching graphite to remove undesirable electrical conductivity properties, heat sink |
| 08/07/1979 | US4163656 Method of manufacturing a lead-through of a metal element through a ceramic component by means of sealing |
| 08/07/1979 | CA1059941A1 Method of depositing a metal on a surface comprising an electrically non-conductive ferrite |
| 07/31/1979 | US4163246 Semiconductor integrated circuit device employing a polycrystalline silicon as a wiring layer |
| 07/31/1979 | US4163242 MOS storage integrated circuit using individual FET elements |
| 07/31/1979 | US4163072 Encapsulation of circuits |
| 07/31/1979 | CA1059648A1 Microelectronic circuit coating system |
| 07/25/1979 | EP0003034A1 Housing for power semiconductor device |
| 07/24/1979 | US4162538 Thin film programmable read-only memory having transposable input and output lines |
| 07/24/1979 | US4162514 Arrangement for semiconductor power components |
| 07/24/1979 | US4162507 Contact structure for a multiple semiconductor component |
| 07/24/1979 | US4162506 Semiconductor integrated circuit device with dual thickness poly-silicon wiring |
| 07/24/1979 | US4161980 Cooling capsule for thyristors |
| 07/24/1979 | US4161817 Method and apparatus for making a semiconductor device mounting element embodying an embedded fan-out wire arrangement |
| 07/24/1979 | CA1059243A1 Polycrystalline silicon semiconductor passivation and masking |
| 07/24/1979 | CA1059241A1 Method of manufacturing a semiconductor device employing silicon ion implantation into silicon compound layer |
| 07/17/1979 | US4161746 Glass sealed diode |
| 07/17/1979 | US4161745 Semiconductor device having non-metallic connection zones |
| 07/17/1979 | US4161744 Passivated semiconductor device and method of making same |
| 07/17/1979 | US4161743 Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat |
| 07/17/1979 | US4161740 High frequency power transistor having reduced interconnection inductance and thermal resistance |
| 07/17/1979 | US4161701 Semiconductor laser |
| 07/17/1979 | US4161430 Method of forming integrated circuit metal interconnect structure employing molybdenum on aluminum |
| 07/17/1979 | US4161213 Cooling capsule for a thyristor |
| 07/17/1979 | CA1058770A1 Edgeless transistor |
| 07/17/1979 | CA1058736A1 Plug-in diode module |
| 07/11/1979 | EP0002996A1 Solid-state means carrier, its manufacture and its use in a fluid cooling system of such means |
| 07/11/1979 | EP0002883A1 A thermal interface between surfaces of a heat source and heat sink |
| 07/11/1979 | EP0002751A1 Circuit for adjusting the value of resistance of a terminating resistance of interconnections in semiconductor structures |
| 07/11/1979 | EP0002731A1 Thin film structure for a contact arrangement and method for fabricating same |
| 07/11/1979 | EP0002725A1 Film forming composition for coating the pins of a module |
| 07/11/1979 | EP0002703A1 Method of production of thin conducting metal strips on semiconductor substrates and strips produced by this method |
| 07/10/1979 | US4161016 Semiconductor and heat sink assembly |
| 07/10/1979 | US4160992 Plural semiconductor devices mounted between plural heat sinks |
| 07/10/1979 | US4160991 High performance bipolar device and method for making same |
| 07/10/1979 | US4160989 Integrated circuit having complementary bipolar transistors |
| 07/10/1979 | US4160987 Field effect transistors with polycrystalline silicon gate self-aligned to both conductive and non-conductive regions and fabrication of integrated circuits containing the transistors |
| 07/10/1979 | CA1058330A1 Process for depositing conductive layers on substrates |
| 07/10/1979 | CA1058326A1 Gate assist turn-off, amplifying gate thyristor and a package assembly therefor |
| 07/10/1979 | CA1058312A1 Circuit device packaging technique |
| 06/26/1979 | US4159507 Stripline circuit requiring high dielectrical constant/high G-force resistance |
| 06/26/1979 | US4159505 Packaging assembly for electronic mechanism |
| 06/26/1979 | US4159483 Low profile force indicating fastener, especially for semiconductor clamps |
| 06/26/1979 | US4159221 Method for hermetically sealing an electronic circuit package |
| 06/26/1979 | CA1057421A1 Process for making a brazed lead electrode, and product thereof |