Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
02/02/1993 | US5184206 Direct thermocompression bonding for thin electronic power chips |
02/02/1993 | US5184205 Semiconductor device having multi-layered wiring, and method of manufacturing the same |
02/02/1993 | US5184204 Semiconductor device with high surge endurance |
02/02/1993 | US5184203 Semiconductor device having a charge transfer device, MOSFETs, and bipolar transistors--all formed in a single semiconductor substrate |
02/02/1993 | US5184202 Semiconductor integrated circuit device |
02/02/1993 | US5184201 Static induction transistor |
02/02/1993 | US5184199 Silicon carbide semiconductor device |
02/02/1993 | US5184196 Projection exposure apparatus |
02/02/1993 | US5184162 Testing integrated circuit using an A/D converter built in a semiconductor chip |
02/02/1993 | US5184061 Voltage regulator for generating a constant reference voltage which does not change over time or with change in temperature |
02/02/1993 | US5184035 Bootstrap circuit incorporated in semiconductor memory device for driving word lines |
02/02/1993 | US5184033 Regulated BiCMOS output buffer |
02/02/1993 | US5183846 Silicone ladder polymer coating composition |
02/02/1993 | US5183800 Interconnection method for semiconductor device comprising a high-temperature superconductive material |
02/02/1993 | US5183795 Selective, electroless deposition of metal into interconnect channels; spacing to give low electrical resistance and high resistance to electromigration and stress migration |
02/02/1993 | US5183784 Bonding semiconductor |
02/02/1993 | US5183783 Single crystal silicon islands; treatment to divest substrate of undesirable warpage |
02/02/1993 | US5183782 Process for fabricating a semiconductor device including a tungsten silicide adhesive layer |
02/02/1993 | US5183781 Forming interconnection layer of polysilicon in contact hole; depositing doped and nondoped polysilicon films in sequence; reactive ion etching with at least one carbon fluoride gas |
02/02/1993 | US5183780 Dopant source; melting both insulator and semiconductor films with high-energy beam; forming doped polycrystalline contact hole without patterning and etching |
02/02/1993 | US5183779 Method for doping GaAs with high vapor pressure elements |
02/02/1993 | US5183778 Forming two layers of crystalline gallium arsenide with intervening layer of crystalline germanium; defect reduction |
02/02/1993 | US5183777 Method of forming shallow junctions |
02/02/1993 | US5183776 Heteroepitaxy by growth of thermally strained homojunction superlattice buffer layers |
02/02/1993 | US5183775 Method for forming capacitor in trench of semiconductor wafer by implantation of trench surfaces with oxygen |
02/02/1993 | US5183774 Method of making a semiconductor memory device |
02/02/1993 | US5183773 Internal circuit with memory device and lightly doped drain structure; double-layered gate; protects against voltage surges |
02/02/1993 | US5183772 Gentle slope formed where second and third polycrystalline layers overlap over the switching transistor area; stacked capacitor |
02/02/1993 | US5183771 Method of manufacturing lddfet having double sidewall spacers |
02/02/1993 | US5183770 Diffusion regions formed with use of gate electrode as mask; reduced crystalline defects |
02/02/1993 | US5183769 Diffusing pre-deposited dopant |
02/02/1993 | US5183768 Method of fabricating semiconductor device by forming doped regions that limit width of the base |
02/02/1993 | US5183767 Method for internal gettering of oxygen in iii-v compound semiconductors |
02/02/1993 | US5183724 Method of producing a strip of lead frames for integrated circuit dies in a continuous system |
02/02/1993 | US5183699 Wafer processing films |
02/02/1993 | US5183684 Ceramification of an alkylaluminum amide to nitride with high temperature in presemce of ammonia |
02/02/1993 | US5183647 Decomposing impurities dinitrogen difluoride in specified vessel it's wall surface is covered with passive film nickle fluide |
02/02/1993 | US5183592 Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin |
02/02/1993 | US5183534 One-step development and etching of photoresist/polyamic acid layer using an aqueous solution of solvent, alkylamine and small amount of an ionic base |
02/02/1993 | US5183533 Method for etching chromium film formed on substrate |
02/02/1993 | US5183531 Dry etching method |
02/02/1993 | US5183530 Method of manufacturing diamond thermistors |
02/02/1993 | US5183512 Method of cleaning semiconductor wafer and computer disks by purified water treated with electric AC signal |
02/02/1993 | US5183510 Apparatus and process for chemical vapor deposition |
02/02/1993 | US5183402 Workpiece support |
02/02/1993 | US5183378 Wafer counter having device for aligning wafers |
02/02/1993 | US5183370 Apparatus for placing or storing flat articles in a cassette with intermediate racks |
02/02/1993 | US5183245 Semi-conductor wafer retention clip |
02/02/1993 | US5182853 Method for encapsulting IC chip |
02/02/1993 | US5182851 Method for holding a strip of conductive lead frames |
02/02/1993 | CA2000024C Resonant tunneling semiconductor devices |
02/02/1993 | CA1313428C Electrostatic chuck |
02/02/1993 | CA1313425C Automatic routing method using prioritized routability indices |
02/02/1993 | CA1313343C Metal organic vapor phase epitaxial growth of group iii-v semiconductor materials |
02/02/1993 | CA1313298C Hermetically sealed package having an electronic component |
01/30/1993 | CA2074791A1 Negative-working radiation-sensitive mixture and radiation-sensitive recording material produced therewith |
01/28/1993 | DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin |
01/28/1993 | DE4223326A1 Traeger oder behaelter fuer wafer oder aehnliche halbleiterplaettchen Carriers or containers for wafers or similar halbleiterplaettchen |
01/27/1993 | WO1993003424A1 Apparatus and method for focusing hard x-rays |
01/27/1993 | EP0524818A1 Multi-layer wiring structure in a semiconductor device and method of manufacturing the same |
01/27/1993 | EP0524817A2 Crystal growth method of III - V compound semiconductor |
01/27/1993 | EP0524759A1 Device fabrication process |
01/27/1993 | EP0524754A2 A film wiring and a method of its fabrication |
01/27/1993 | EP0524741A1 Method for improving the resolution of a semiconductor mask |
01/27/1993 | EP0524620A2 Field effect transistor and high frequency circuits using the same |
01/27/1993 | EP0524499A1 Method for forming a photomask pattern |
01/27/1993 | EP0524189A1 Optically compensated bipolar transistor |
01/27/1993 | EP0471034A4 Twisted wire jumper electrical interconnector |
01/27/1993 | CN1068444A Semiconductor device and manufacturing method thereof |
01/27/1993 | CN1068443A Manufacturing method for semiconductor matrix material |
01/27/1993 | CA2089557A1 Apparatus and method for focusing hard x-rays |
01/26/1993 | US5182719 Method of fabricating a second semiconductor integrated circuit device from a first semiconductor integrated circuit device |
01/26/1993 | US5182661 Thin film field effect transistor array for use in active matrix liquid crystal display |
01/26/1993 | US5182627 Interconnect and resistor for integrated circuits |
01/26/1993 | US5182626 Insulated gate bipolar transistor and method of manufacturing the same |
01/26/1993 | US5182620 Active matrix display device |
01/26/1993 | US5182619 Semiconductor device having an MOS transistor with overlapped and elevated source and drain |
01/26/1993 | US5182495 Plasma processing method and apparatus using electron cyclotron resonance |
01/26/1993 | US5182471 Hysteresis comparator |
01/26/1993 | US5182469 Integrated circuit having bipolar transistors and field effect transistors respectively using potentials of opposite polarities relative to substrate |
01/26/1993 | US5182455 Method of detecting relative positional deviation between two objects |
01/26/1993 | US5182424 Module encapsulation by induction heating |
01/26/1993 | US5182420 Method of fabricating metallized chip carriers from wafer-shaped substrates |
01/26/1993 | US5182234 Profile tailored trench etch using a SF6 -O2 etching composition wherein both isotropic and anisotropic etching is achieved by varying the amount of oxygen |
01/26/1993 | US5182233 Gallium arsenide |
01/26/1993 | US5182232 Annealing, oxidation, etching |
01/26/1993 | US5182231 Method for modifying wiring of semiconductor device |
01/26/1993 | US5182230 Laser methods for circuit repair on integrated circuits and substrates |
01/26/1993 | US5182229 Selenium or sulfur |
01/26/1993 | US5182227 Capacitor, local oxidation, trench |
01/26/1993 | US5182226 Method for fabrication of a field oxide of the buried inverse t-type using oxygen or nitrogen ion implantation |
01/26/1993 | US5182225 Process for fabricating BICMOS with hypershallow junctions |
01/26/1993 | US5182224 Method of making dynamic random access memory cell having a SDHT structure |
01/26/1993 | US5182223 Method of making an integrated circuit with capacitor |
01/26/1993 | US5182222 Process for manufacturing a DMOS transistor |
01/26/1993 | US5182221 Oxidizing silicon compound to silicon dioxide |
01/26/1993 | US5182219 Push-back junction isolation semiconductor structure and method |
01/26/1993 | US5182218 Production methods for compound semiconductor device having lightly doped drain structure |
01/26/1993 | US5182217 Method of fabricating a trapping-mode |
01/26/1993 | US5182184 Novolak resins of lowered hydroxyl content and high contrast high thermal stability positive photoresists prepared therefrom |