H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/1992
12/15/1992	US5172203 IC chip
12/15/1992	US5172201 Semiconductor memory device with increased capacitance of capacitor and manufacturing method thereof
12/15/1992	US5172199 Compact nonvolatile semiconductor memory device using stacked active and passive elements
12/15/1992	US5172190 Alignment patterns for two objects to be aligned relative to each other
12/15/1992	US5172189 Exposure apparatus
12/15/1992	US5172188 Pattern shift measuring method
12/15/1992	US5172160 Optical lithographic device having a machine frame with force compensation
12/15/1992	US5172049 IC test equipment
12/15/1992	US5172013 Substrate bias generator for semiconductor devices
12/15/1992	US5171972 Heat treating furnace
12/15/1992	US5171717 Method for batch cleaving semiconductor wafers and coating cleaved facets
12/15/1992	US5171714 Photolithography
12/15/1992	US5171713 Forming projections on substrates; overcoating with polyimide; etching
12/15/1992	US5171712 Electroconductive projections on bonding pads formed on transparent substrates
12/15/1992	US5171711 Method of manufacturing integrated circuit devices
12/15/1992	US5171710 Radiation, neutralization
12/15/1992	US5171709 Laser methods for circuit repair on integrated circuits and substrates
12/15/1992	US5171708 Method of boron diffusion into semiconductor wafers having reduced stacking faults
12/15/1992	US5171706 Forming multilayer structure on semiconductor; etching striped grooves perpendicular to direction of optical waveguides
12/15/1992	US5171705 Self-aligned structure and process for DMOS transistor
12/15/1992	US5171704 Gaas device fabrication utilizing metalorganic molecular beam epitaxy (mombe)
12/15/1992	US5171703 Device and substrate orientation for defect reduction and transistor length and width increase
12/15/1992	US5171702 Method for forming a thick base oxide in a BiCMOS process
12/15/1992	US5171701 Method of manufacturing master-slice semiconductor integrated circuits
12/15/1992	US5171700 Field effect transistor structure and method
12/15/1992	US5171699 Vertical DMOS transistor structure built in an N-well CMOS-based BiCMOS process and method of fabrication
12/15/1992	US5171698 Forming polycrystalline silicon; then silicon oxide, silicon nitride; preferential etching
12/15/1992	US5171697 Method of forming multiple layer collector structure for bipolar transistors
12/15/1992	US5171696 Bipolar transistor
12/15/1992	US5171656 Photosensitive composition
12/15/1992	US5171642 Multilayered intermetallic connection for semiconductor devices
12/15/1992	US5171608 Method of pattern transfer in photolithography using laser induced metallization
12/15/1992	US5171415 Cooling method and apparatus for magnetron sputtering
12/15/1992	US5171412 Forming two layers by two steps, first step includes a collimated low temperature sputtering and second step utilizes high temperature/high power sputtering of aluminum to fill voids and grooves of substrate surface and planarize it
12/15/1992	US5171401 Using methane, hydrogen and argon mixture, generating metal hydrocarbons
12/15/1992	US5171398 Equipment for sticking adhesive tape on semiconductor wafer
12/15/1992	US5171393 Wafer processing apparatus
12/15/1992	US5171370 Effusion cell of a molecular beam epitaxy system
12/15/1992	US5171031 Semiconductor fabricating apparatus
12/15/1992	US5170931 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
12/15/1992	US5170929 Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
12/15/1992	US5170928 Bonding head
12/15/1992	US5170714 Vacuum processing apparatus and transportation system thereof
12/15/1992	CA1311565C Method for providing a metal-semiconductor contact
12/15/1992	CA1311538C Interconnection of electronic components
12/15/1992	CA1311402C Process for the preparation of doped 3-5 monocristalline semi-dielectrics and their applications
12/12/1992	CA2070976A1 Polyethers based on 9, 9-bis-perfluoroalkyl-3,6-dihydroxy-xanthene or 9-aryl-9-perfluoroalkyl-3,6-dihydroxy-xanthene
12/10/1992	WO1992022138A1 Switching arrangement with transistors
12/10/1992	WO1992022094A1 SHALLOW OHMIC CONTACTS TO n-AlxGa1-xAs
12/10/1992	WO1992022090A1 Thermally conductive electronic assembly
12/10/1992	WO1992022089A1 Semiconductor chip cooling apparatus
12/10/1992	WO1992022088A1 Anti-fuse structures and methods for making same
12/10/1992	WO1992022087A1 Method for cleaning and apparatus thereof
12/10/1992	WO1992022086A1 Anneal to decrease moisture absorbance of intermetal dielectrics
12/10/1992	WO1992022085A1 Window for microwave plasma processing device
12/10/1992	WO1992022084A1 Organic preclean for improving vapor phase wafer etch uniformity
12/10/1992	WO1992021954A1 Method of evaluating segregation at solid-liquid interface and segregation apparatus therefor
12/10/1992	WO1992019012A3 Polypropylene wafer carrier
12/10/1992	WO1992016306A3 Manufacture of high precision electronic components with ultra-high purity liquids
12/10/1992	DE4218618A1 Single-crystal semiconductor growth technique - using Czochralski method with applied magnetic field, provides equalised axial oxygen concn. of crystal blank
12/10/1992	DE4218495A1 Semiconductor device suitable for LSI - has 2nd metal wiring layer formed on metal film electrically connected to photoresist, selectively coated on 1st metal wiring above insulating layer
12/10/1992	DE4217836A1 Removal of far-Uv hardenable resist process - comprising plasma oxidising resist and removing with microwave irradiation at rate determined by oxygen@ pressure and microwave intensity
12/10/1992	DE4211247A1 Semiconductor wafer with membrane pressure sensor elements - has semiconducting substrate with through-holes and bonded socket with sets of holes corresp. to sensor elements and substrate holes
12/10/1992	DE4118973A1 Vorrichtung zur plasmaunterstuetzten bearbeitung von substraten A plasma assisted processing of substrates
12/10/1992	DE4118148A1 Schalteranordnung mit transistoren Switch assembly with transistors
12/09/1992	EP0517627A1 Deposited carbon mask for dry etch processing of Si
12/09/1992	EP0517623A2 Transistor with a predetermined current gain in a bipolar integrated circuit
12/09/1992	EP0517607A1 Method of fabrication of a non-volatile memory cell and memory cell fabricated with this method
12/09/1992	EP0517551A2 Method of forming a multilayer wiring structure on a semiconductor device
12/09/1992	EP0517548A2 Chemical vapor deposition method for forming silicon oxide film
12/09/1992	EP0517475A2 Process for coating a substrate with a silica precursor
12/09/1992	EP0517443A2 GaAs mesfets with enhanced schottky barrier
12/09/1992	EP0517439A1 Apparatus and method for assembling circuit structures
12/09/1992	EP0517438A2 Bipolar fabrication method
12/09/1992	EP0517408A1 Sram cell and structure with polycrystalline p-channel load devices
12/09/1992	EP0517391A1 ESD protection circuit
12/09/1992	EP0517369A2 Process of manufacturing opto-electronic hybrid modules
12/09/1992	EP0517368A2 Local interconnect for integrated circuits
12/09/1992	EP0517353A2 Non-volatile memory
12/09/1992	EP0517294A1 Double-gated integrating scheme for electron beam tester
12/09/1992	EP0517288A1 Diffusion barrier enhancement in metallization structure for semiconductor device fabrication
12/09/1992	EP0517264A1 Electronic circuits and their fabrication
12/09/1992	EP0517255A2 Semiconductor memory device having a memory cell capacitor and a fabrication process thereof
12/09/1992	EP0517165A1 Dry etching method utilizing (SN)x polymer mask
12/09/1992	EP0517164A1 Solid-state image sensor
12/09/1992	EP0517071A1 Chip device bonding machine
12/09/1992	EP0517042A1 Plasma-chemical vapor-phase epitaxy system
12/09/1992	EP0517033A1 Cleaning device for wafer mount plate
12/09/1992	EP0517023A1 Isothermal capacitance transient spectroscopy
12/09/1992	EP0517010A1 BICMOS driver circuits with improved low output level
12/09/1992	EP0517002A2 Diamines and photosensitive polyimides made therefrom
12/09/1992	EP0516847A1 Semiconductor device
12/09/1992	EP0516765A1 Methods of forming electronic packages.
12/09/1992	CN1066936A Blue-green laser diode
12/09/1992	CN1019434B Method for making cmos integrated circuit having top-side substrate contact
12/08/1992	WO1992021790A1 Fabricating metal articles from printed images
12/08/1992	US5170444 Method of inspecting jointed portion
12/08/1992	US5170418 X-ray exposure apparatus
12/08/1992	US5170328 Packaging for molded carriers of integrated circuits
12/08/1992	US5170293 Exposure mechanism

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