Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1993
03/16/1993US5193972 Wafer handling system
03/16/1993US5193969 Wafer transfer machine
03/16/1993US5193733 Clamping device for inner leads of lead frame
03/16/1993US5193732 Apparatus and methods for making simultaneous electrical connections
03/16/1993US5193682 Wafer basket
03/16/1993US5193316 Semiconductor wafer polishing using a hydrostatic medium
03/16/1993CA1314631C Process for fabricating integrated circuits having shallow junctions
03/14/1993CA2077161A1 Method of establishing soldered connections
03/11/1993DE4230330A1 Tape carrier package for soldering multipin chip to substrate by hf heating - comprises base film with device hose, leads having lead sections extending outwardly for bonding to substrate and lead sections extending into device hole
03/11/1993DE4229628A1 Stacked semiconductor device with high bonding precision - includes semiconductor substrates bonded together by moderate temp. heat treatment
03/11/1993DE4229574A1 FET with good current control even at low gate voltage - comprises principal surface and source and drain zones spaced apart on semiconductor substrate and nitride- and oxide-films on principal surface
03/11/1993DE4228679A1 Semiconductor device contact structure - has 1st and 2nd conductive layers contact with each other via nitrided oxide film as oxidn. barrier
03/11/1993DE4227227A1 Mfg. DRAM cell capacitor with increased capacitance value - by depositing an insulating layer and forming hole for buried contact after forming a MOS transistor on semiconductor substrate etc.
03/11/1993DE4129835A1 Leistungselektroniksubstrat und verfahren zu dessen herstellung Power electronics substrate and method for its production
03/11/1993CA2072727A1 Copper-based paste containing copper aluminate, for microstructural and shrinkage control of copper-filled vias
03/10/1993EP0531232A2 High durability mask for use in selective area, epitaxial regrowth of GaAs
03/10/1993EP0531197A1 Method of laser sealing electronic packages, in particular for hybrid packages with stress minimising
03/10/1993EP0531128A1 Semiconductor device with fuse
03/10/1993EP0531102A1 Aligner and exposure method for manufacturing semiconductor device
03/10/1993EP0531066A1 Sor exposure system and method of manufacturing semiconductor device using same
03/10/1993EP0531018A2 Method for production of dielectric-separation substrate
03/10/1993EP0530988A2 Dual port memories
03/10/1993EP0530985A2 Programmable logic array integrated circuits
03/10/1993EP0530973A1 Multiprocessing apparatus
03/10/1993EP0530928A2 Ferroelectric shadow RAM
03/10/1993EP0530897A2 Process for depositing a ferro-electric Bismuth Titanate layer on a substrate
03/10/1993EP0530834A1 Thin-film transistor and method of manufacturing the same
03/10/1993EP0530780A1 Electric joint forming sheet or tape and method for joint formation using the same
03/10/1993EP0530758A2 Semiconductor package for flip-chip mounting process
03/10/1993EP0530729A1 Method for grinding back side of semiconductor wafer and pressure-sensitive adhesive tape used in said method
03/10/1993EP0530644A2 Non-Volatile memory cell and fabrication method
03/10/1993EP0530623A2 SCR Type memory apparatus
03/10/1993EP0530497A1 Bipolar transistor
03/10/1993EP0530377A1 Semiconductor sealing resin tablet and its manufacture
03/10/1993EP0530376A1 Semiconductor memory having nonvolatile semiconductor memory cell
03/10/1993EP0530352A1 SHALLOW OHMIC CONTACTS TO N-GaAs AND METHOD OF MAKING SAME
03/10/1993EP0530236A1 Process and device for monitoring and controlling etching operations.
03/10/1993EP0333803B1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds
03/10/1993EP0324002B1 Rotatable pick and place vacuum sense head for die bonding apparatus
03/10/1993EP0309593B1 Ceramic base and process for its production
03/10/1993EP0290501B1 Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer
03/09/1993US5193017 Reflective-type active matrix liquid crystal display device
03/09/1993US5192994 N-type junctions on gold layers and alloying
03/09/1993US5192992 Bicmos device and manufacturing method thereof
03/09/1993US5192991 Crystallized polycrystalline semiconductor device
03/09/1993US5192988 Semiconductor integrated circuit device produced by charged-particle etching
03/09/1993US5192908 Semiconductor device testing apparatus with positioning mechanism
03/09/1993US5192879 MOS transistor output circuit
03/09/1993US5192871 Voltage variable capacitor having amorphous dielectric film
03/09/1993US5192849 Multipurpose low-thermal-mass chuck for semiconductor processing equipment
03/09/1993US5192835 Bonding of solid state device to terminal board
03/09/1993US5192717 Process for the formation of a polycrystalline semiconductor film by microwave plasma chemical vapor deposition method
03/09/1993US5192716 Packaging
03/09/1993US5192715 Process for avoiding spin-on-glass cracking in high aspect ratio cavities
03/09/1993US5192714 Semiconducotrs
03/09/1993US5192713 Method of manufacturing semiconductor devices having multi-layered structure
03/09/1993US5192712 Integrated circuits
03/09/1993US5192709 Nanoscale modulation doping method
03/09/1993US5192708 Sub-layer contact technique using in situ doped amorphous silicon and solid phase recrystallization
03/09/1993US5192707 Encapsulation with silicon nitride
03/09/1993US5192706 Filling trenches
03/09/1993US5192705 Method for manufacturing semiconductor stacked CMOS devices
03/09/1993US5192703 Method of making tungsten contact core stack capacitor
03/09/1993US5192701 Semiconductor
03/09/1993US5192700 Method of making field effect transistor
03/09/1993US5192699 Semiconductors
03/09/1993US5192698 Making staggered complementary heterostructure FET
03/09/1993US5192697 SOG curing by ion implantation
03/09/1993US5192696 Field effect transistor and method of fabricating
03/09/1993US5192682 Manufacturing method for thin semiconductor device assemblies
03/09/1993US5192680 Alignment
03/09/1993US5192643 Pattern-forming method and radiation resist for use when working this pattern-forming method
03/09/1993US5192610 Corrosion-resistant protective coating on aluminum substrate and method of forming same
03/09/1993US5192589 Low-pressure chemical vapor deposition process for depositing thin titanium nitride films having low and stable resistivity
03/09/1993US5192588 Electroformed method for fabricating round mesa millimeter wave waffleline structure
03/09/1993US5192419 Semiconductor
03/09/1993US5192393 Crystallization of silicon by neutralization and activation
03/09/1993US5192370 Method and apparatus for forming thin film
03/09/1993US5192087 Device for supporting a wafer
03/09/1993US5192018 Wire bonding method
03/09/1993US5191908 Dipping type surface treatment apparatus
03/09/1993US5191708 Manufacturing method of a probe head for semiconductor LSI inspection apparatus
03/09/1993CA1314311C Mos ic reverse battery protection
03/09/1993CA1314197C Process for removing contaminant
03/04/1993WO1993004506A1 Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom
03/04/1993WO1993004503A1 Process for the production of electroluminescent silicon features
03/04/1993WO1993004501A1 High performance passivation for semiconductor devices
03/04/1993WO1993004497A1 Method and apparatus for cleaving semiconductor wafers
03/04/1993WO1993004484A1 An apparatus for positioning a stage
03/04/1993WO1993004406A1 Double-layer resist and method of and device for making said resist
03/04/1993WO1993004375A1 Burn-in technologies for unpackaged integrated circuits
03/04/1993WO1993004214A1 Process for forming low resistivity titanium nitride films
03/04/1993WO1993004211A1 Apparatus and method for multiple ring sputtering from a single target
03/04/1993WO1993004210A1 Method for forming oxide film
03/04/1993WO1993003880A1 Palladium welding of a semiconductor body
03/04/1993WO1992021170A3 Blue-green laser diode
03/04/1993WO1992019790A3 Primary flow cvd apparatus and method
03/04/1993DE4228529A1 Passivation of semiconductor wafers to minimise stress and thin film cracking - using 1st layer which after planarisation encloses the metallisation pattern and further layers to provide specific protection
03/04/1993DE4129206A1 Etching of structures in wafers or single crystalline material - using masking layers in which structures are etched at different depths corresp. with depth required in silicon@ substrate
03/04/1993DE4129123A1 Verfahren zur reinigung von harten oberflaechen insbesondere in reinraeumen A method for cleaning hard surfaces, especially in reinraeumen
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