| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 04/20/1993 | US5203445 Carrier conveying apparatus |
| 04/20/1993 | US5203443 Conveying apparatus used in assembling semicondutors |
| 04/20/1993 | US5203360 Disc washing system |
| 04/20/1993 | US5203143 Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system |
| 04/20/1993 | US5203076 Vacuum infiltration of underfill material for flip-chip devices |
| 04/15/1993 | WO1993007736A1 Silver-rich conductor compositions for high thermal cycled and aged adhesion |
| 04/15/1993 | WO1993007644A1 Structure for suppression of field inversion caused by charge build-up in the dielectric |
| 04/15/1993 | WO1993007643A1 Gallium arsenide mesfet imager |
| 04/15/1993 | WO1993007642A1 Dipolar monolithically integrated circuit |
| 04/15/1993 | WO1993007641A1 Semiconductor integrated circuit device and manufacture thereof |
| 04/15/1993 | WO1993007640A1 Method and compositions for diffusion patterning |
| 04/15/1993 | WO1993007639A1 Process for generating excited neutral particles for etching and separation processes in semiconductor technology |
| 04/15/1993 | WO1993007629A1 Integrated deposited vertical resistor in a sequential multilayer substrate |
| 04/15/1993 | WO1993007550A1 Heating plate for heating an object on its surface and chemical treatment reactor provided with said plate |
| 04/15/1993 | WO1993007538A1 Photocurable polyimide coated glass fiber |
| 04/15/1993 | WO1993007470A1 Analyzer |
| 04/15/1993 | WO1993006964A1 Method for forming solder bump interconnections to a solder-plated circuit trace |
| 04/15/1993 | DE4234528A1 IGFET with epitaxial layer on substrate - has layered gate electrode of lower and top parts, with top one of greater gate length |
| 04/15/1993 | DE4233792A1 Substrate fox matrix liquid crystal element - has insulation layer covering switch element and image element electrode, and separating second image element electrode |
| 04/15/1993 | DE4233790A1 Electronically-erasable programmable read-only memory - has selection transistor in semiconductor substrate between 2 memory transistors |
| 04/15/1993 | DE4233486A1 Trench capacitor memory cell mfr. - + with active zone providing transistor and field region in which trench capacitor is provided in substrate surface |
| 04/15/1993 | DE4232817A1 Semiconductor memory cell with capacitor - set between end and primary metallising film above bit line |
| 04/15/1993 | DE4205576A1 Substrate cleaner using ultrasonics - has inner container with substrate supported in cleaning chemicals within outer container of ultrasonic carrier medium |
| 04/15/1993 | DE4133897A1 Connecting two plates by anodic bonds - using one plate having layer circuit with passivating layer and the other having glass layer |
| 04/15/1993 | DE4133820A1 Verfahren zur herstellung von halbleiterelementen A process for producing semiconductor elements |
| 04/15/1993 | DE4133245A1 Bipolare monolithisch integrierte schaltung Bipolar monolithically integrated circuit |
| 04/14/1993 | EP0537099A1 Control of large scale topography on silicon wafers |
| 04/14/1993 | EP0537049A1 Process for the growth of heteroepitaxial layers |
| 04/14/1993 | EP0537001A1 Forming dielectrics in semiconductor devices |
| 04/14/1993 | EP0536992A2 Semiconductor planarization process and product made thereby |
| 04/14/1993 | EP0536972A2 An integrated circuit device having improved substrate capacitance isolation |
| 04/14/1993 | EP0536968A2 Process for forming contact holes in the fabrication of semi-conducteur devices |
| 04/14/1993 | EP0536958A1 Process for producing a semiconductor wafer |
| 04/14/1993 | EP0536902A1 Interconnect and resistor for integrated circuits |
| 04/14/1993 | EP0536869A2 Method of fabricating P-buried layers for PNP devices |
| 04/14/1993 | EP0536862A1 A method of forming a body with buried channels |
| 04/14/1993 | EP0536842A1 X-ray alignment system |
| 04/14/1993 | EP0536834A2 Charge-coupled device |
| 04/14/1993 | EP0536802A2 Multilayer circuit board with repaired I/O pin and process for repairing I/O pin on multilayer circuit board |
| 04/14/1993 | EP0536790A2 Method for producing semiconductor articles |
| 04/14/1993 | EP0536788A1 Method of producing semiconductor substrate |
| 04/14/1993 | EP0536752A2 Process for cleaning integrated circuits during the fabrication |
| 04/14/1993 | EP0536747A2 Halogenated carboxylic acid cleaning agents for fabricating integrated circuits and a process for using the same |
| 04/14/1993 | EP0536688A2 MOS transistor and charge detector using same |
| 04/14/1993 | EP0536682A2 Semi-conductor device, method of fabrication and device used for the fabrication |
| 04/14/1993 | EP0536664A1 A method for forming a thin film |
| 04/14/1993 | EP0536635A1 X-ray mask structure, manufacturing method, x-ray exposure method using same, and device manufactured by using same |
| 04/14/1993 | EP0536606A2 An adhesive layer in multilevel packaging and organic material as a metal diffusion barrier |
| 04/14/1993 | EP0536410A1 Method for forming vapor phase grown film and apparatus for producing semiconductor devices |
| 04/14/1993 | EP0536382A1 Non-contact optical techniques for measuring surface conditions |
| 04/14/1993 | EP0536227A1 Process for manufacturing pmos-transistors and pmos-transistors thus produced. |
| 04/14/1993 | EP0536160A1 Moisture-free sog process |
| 04/14/1993 | EP0527194A4 High density local interconnect in a semiconductor circuit using metal silicide |
| 04/14/1993 | EP0493520A4 Hot-carrier suppressed sub-micron misfet device |
| 04/14/1993 | EP0279814B1 Thermally insulative and electrically conductive interconnect and process for making same |
| 04/14/1993 | CN1071031A Method and compositions for diffusion patterning |
| 04/14/1993 | CN1020317C Electric device and mfg. method of same |
| 04/14/1993 | CN1020290C CVD apparatus |
| 04/13/1993 | US5203005 Cell structure for linear array wafer scale integration architecture with capability to open boundary i/o bus without neighbor acknowledgement |
| 04/13/1993 | US5202907 Solid-state image sensor output mosfet amplifier with mosfet load |
| 04/13/1993 | US5202848 Read only memory device |
| 04/13/1993 | US5202716 Resist process system |
| 04/13/1993 | US5202591 Dynamic circuit disguise for microelectronic integrated digital logic circuits |
| 04/13/1993 | US5202588 Substrate bias circuit |
| 04/13/1993 | US5202579 Semiconductor device having multilayer interconnection structure |
| 04/13/1993 | US5202577 Leadframe having a particular dam bar |
| 04/13/1993 | US5202576 Asymmetrical non-volatile memory cell, arrays and methods for fabricating same |
| 04/13/1993 | US5202575 TFT-driven image sensor including a reduced-size capacitor structure |
| 04/13/1993 | US5202574 Semiconductor having improved interlevel conductor insulation |
| 04/13/1993 | US5202573 Dual anode mos scr with anti crosstalk collecting region |
| 04/13/1993 | US5202572 Thin film transistor |
| 04/13/1993 | US5202291 Etching with a plasma mixture of chlorine gas; process control |
| 04/13/1993 | US5202290 Anodizing aluminum or aluminum alloy in acid bath to form microporous oxide film, electrodepositing metal in pore, etching some oxide film away, futher reacting the exposed metal |
| 04/13/1993 | US5202289 Method of plastically deforming a semiconductor device lead frame in preparation for ultrasonic bonding |
| 04/13/1993 | US5202288 Method of manufacturing an electronic circuit component incorporating a heat sink |
| 04/13/1993 | US5202287 Method for a two step selective deposition of refractory metals utilizing SiH4 reduction and H2 reduction |
| 04/13/1993 | US5202286 Method of forming three-dimensional features on substrates with adjacent insulating films |
| 04/13/1993 | US5202284 Minimizing defects in silicon-germanium layer |
| 04/13/1993 | US5202283 Heating substrate and dopant source in chamber, introducing organic gas which is a precursor of semiconductor material to be deposited on substrate |
| 04/13/1993 | US5202282 Method for producing a self-alignment type CCD sensor |
| 04/13/1993 | US5202280 Method for fabricating a semiconductor device |
| 04/13/1993 | US5202279 Etching trenches into face of semiconductor, forming storage nodes surrounding trenches, forming polysilicon layer on trench walls; reduced leakage current |
| 04/13/1993 | US5202278 Method of forming a capacitor in semiconductor wafer processing |
| 04/13/1993 | US5202277 Method of fabricating a semiconductor device |
| 04/13/1993 | US5202276 Method of forming a low on-resistance DMOS vertical transistor structure |
| 04/13/1993 | US5202275 Forming insulation films, doping gate electrodes of random memory cells |
| 04/13/1993 | US5202274 Method of fabricating thin film transistor |
| 04/13/1993 | US5202273 Method of manufacturing a vertical semiconductor device |
| 04/13/1993 | US5202272 Vapor deposition, masking, etching, doping |
| 04/13/1993 | US5202222 Selective and precise etching and plating of conductive substrates |
| 04/13/1993 | US5202216 Containing water insoluble polymer and aromatic sulfonic acid salt of an onium compound |
| 04/13/1993 | US5202204 Process of producing exposure mask |
| 04/13/1993 | US5202153 Method for making thick film/solder joints |
| 04/13/1993 | US5202152 Applying solutions containing hydrolyzed condensed titanium alkoxides to substrate surface to form gel, then controlled heating with ammonia |
| 04/13/1993 | US5202018 Process for electrochemical dissolution of semiconductors |
| 04/13/1993 | US5201996 Patterning method for epitaxial lift-off processing |
| 04/13/1993 | US5201995 Creating a vapor phase chemical equilibrium system capable of deposition and etching the material deposited |
| 04/13/1993 | US5201994 Dry etching method |
| 04/13/1993 | US5201993 Exposing dielectric layer to mixture of perfluoroethylene, carbon tetrafluoride, fluoroform, inert gases in parallel plate reactor |
| 04/13/1993 | US5201992 Exposing tapered silicon protuberance to dry oxidizing environment at relatively low temperature |