| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/26/1993 | US5182071 Method of molding a carrier ring to leads |
| 01/26/1993 | US5181986 Plasma generator, microwaves, resonance |
| 01/26/1993 | US5181985 Process for the wet-chemical surface treatment of semiconductor wafers |
| 01/26/1993 | US5181964 Single ended ultra-high vacuum chemical vapor deposition (uhv/cvd) reactor |
| 01/26/1993 | US5181819 Apparatus for processing semiconductors |
| 01/26/1993 | US5181646 Lead frame holding apparatus for use in wire bonders |
| 01/26/1993 | US5181317 Method of making an engineering change to a printed wiring board |
| 01/26/1993 | CA1313223C Electro-optic measurements of voltage waveforms on electrical conductors |
| 01/26/1993 | CA1313107C Growth of semi-insulating indium phosphide by liquid phase epitaxy |
| 01/25/1993 | CA2074575A1 Packaging structure for one or more ic chips |
| 01/24/1993 | CA2047642A1 Positive type, photosensitive resinous composition |
| 01/21/1993 | WO1993001620A1 A gto-thyristor and a method for the manufacture of a gto-thyristor |
| 01/21/1993 | WO1993001619A1 Moisture relief for chip carriers |
| 01/21/1993 | WO1993001618A1 Arrangement and process for contacting conductive layers |
| 01/21/1993 | WO1993001617A1 Method for the manufacture of a semiconductor component |
| 01/21/1993 | WO1993001616A1 Method and mould for the manufacture of an injection moulded electronics module |
| 01/21/1993 | WO1993001615A1 Silicon wafer and its cleaning method |
| 01/21/1993 | WO1993001614A1 Compound semiconductor and manufacturing method therefor |
| 01/21/1993 | WO1993001527A1 Developing solution and developing method |
| 01/21/1993 | WO1993001328A1 Rapid-switching rotating disk reactor |
| 01/21/1993 | WO1993001134A1 Method of producing pure water, system therefor and cleaning method |
| 01/21/1993 | WO1993001133A1 System for supplying pure water and cleaning method therefor |
| 01/21/1993 | DE4223658A1 Test appts. for semiconductor chips with relatively many connectors - uses tape automated bonding band with adhesive surface for connecting lines to test card and dendritically grown metal test points |
| 01/21/1993 | DE4223479A1 High integration master-slice circuit with fault detection - has decoder, interrogation amplifier and shift register incorporated in each semiconductor element row |
| 01/21/1993 | DE4223280A1 Switching circuit carrier component - comprising appts. arranged between electrodes of two carriers |
| 01/21/1993 | DE4223133A1 Rapid thermal processing of sensitive devices - using heat source programme control to avoid defects in e.g. semiconductor devices |
| 01/21/1993 | DE4222584A1 Hyperfine structure mfr. to increase capacitor area in IC - by anisotropic etching of a doped poly:silicon layer or matrix layer using a deposited poly:silicon@ layer consisting of isolated hemispheres as masking aid |
| 01/21/1993 | DE4221039A1 Power integrated circuit device with vertical output element - has peripheral circuit and vertical power element formed on different surface zones of substrate |
| 01/21/1993 | DE4216211A1 Redundancy circuit for semiconductor memory - has reference voltage circuit coupled to reserve signal reference line and HV circuits for FLOTOX transistors |
| 01/21/1993 | DE4210880A1 Heating block for semiconductor chip wire bonding machine - has inner heating stage and chip heating stage at two different temps. |
| 01/21/1993 | DE4123900A1 Protective coating for wafers - is of lacquer contg. polymer soluble in water or alcohol e.g. acrylate] or acrylamide] |
| 01/21/1993 | DE4123512A1 Werkzeugmaschine mit kurvengetriebe, insbesondere zum stanzen und formen der anschlussbeinchen von integrierten schaltkreisen Machine tool with winding gear, especially to the punch and shaping the lead of integrated switching circuits |
| 01/21/1993 | DE4123414A1 Leistungs-halbleiterbauelement und verfahren zu dessen herstellung Power semiconductor component and process for its manufacture |
| 01/20/1993 | EP0524112A1 Tip, in particular for a vacuum pipette |
| 01/20/1993 | EP0524073A1 Apparatus for injecting a product into a chamber such as a reactor for microelectronics |
| 01/20/1993 | EP0524067A1 High definition active matrix liquid crystal screen |
| 01/20/1993 | EP0524038A1 Method of wiring the external leads of a housing and the hybrid elements |
| 01/20/1993 | EP0524030A2 Semiconductor device equipped with a high-voltage misfet |
| 01/20/1993 | EP0524025A2 High-value resistors and methods for making same |
| 01/20/1993 | EP0523983A1 An Ion Beam Neutralizer and an Ion Implantation System using the same. |
| 01/20/1993 | EP0523981A1 Method of making electronic packages and smart structures formed by thermal spray deposition |
| 01/20/1993 | EP0523957A1 Radiation-sensitive composition |
| 01/20/1993 | EP0523917A2 Atomic layer epitaxy of compound semiconductor |
| 01/20/1993 | EP0523856A2 Method of via formation for multilevel interconnect integrated circuits |
| 01/20/1993 | EP0523836A1 A wafer etching drum and an automatic wafer transfer apparatus |
| 01/20/1993 | EP0523830A1 A stacked CMOS SRAM cell with polysilicon transistor load |
| 01/20/1993 | EP0523817A2 Improved programmable logic device |
| 01/20/1993 | EP0523800A1 An overvoltage protected semiconductor switch |
| 01/20/1993 | EP0523768A2 Thin-film transistor manufacture |
| 01/20/1993 | EP0523731A2 Field effect transistor and method for manufacturing the same |
| 01/20/1993 | EP0523730A1 Coaxial wire for bonding semiconductors |
| 01/20/1993 | EP0523701A2 Method of forming electrodes of semiconductor device |
| 01/20/1993 | EP0523658A2 Method for making injection molded soft magnetic material |
| 01/20/1993 | EP0523651A2 Method for making high strength injection molded ferrous material |
| 01/20/1993 | EP0523639A2 Method for patterning metallo-organic precursor film and film products |
| 01/20/1993 | EP0523593A1 Field effect transistor |
| 01/20/1993 | EP0523547A2 Electroless nickel plated DCB substrate and method of connecting the same with fine wires |
| 01/20/1993 | EP0523450A1 Inductance element |
| 01/20/1993 | EP0523414A1 Wafer mounting device |
| 01/20/1993 | EP0523314A1 Apparatus for evaporation of liquid |
| 01/20/1993 | EP0523303A1 Ringfield lithography |
| 01/20/1993 | EP0523223A1 Power metal-oxide-semiconductor field effect transistor |
| 01/20/1993 | EP0523042A1 Ultrafast electro-dynamic x, y and theta positioning stage. |
| 01/20/1993 | EP0414852A4 Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
| 01/20/1993 | CA2072848A1 Diffuse secondary emission electron shower |
| 01/19/1993 | US5181096 Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer |
| 01/19/1993 | US5181092 Input protection resistor used in input protection circuit |
| 01/19/1993 | US5181090 High voltage cmos devices |
| 01/19/1993 | US5181087 Filed effect transistor, recessed gate electrode |
| 01/19/1993 | US5181085 Compound semiconductor device with bipolar transistor and laser diode |
| 01/19/1993 | US5181083 Pin diode with a low peak-on effect |
| 01/19/1993 | US5180977 Membrane probe contact bump compliancy system |
| 01/19/1993 | US5180975 Positioning device and IC conveyor utilizing the same |
| 01/19/1993 | US5180920 Method and apparatus for making charged particle beam exposure |
| 01/19/1993 | US5180918 Method and apparatus for measuring ion beam collimation, shaping the ion beam and controlling scanning thereof |
| 01/19/1993 | US5180692 Method for the manufacture of boron-containing films by CVD or epitaxial techniques using boron trifluoride |
| 01/19/1993 | US5180691 Silicone ladder polymer |
| 01/19/1993 | US5180690 Method of forming a layer of doped crystalline semiconductor alloy material |
| 01/19/1993 | US5180689 Semiconductors |
| 01/19/1993 | US5180687 Electroconductive |
| 01/19/1993 | US5180684 Semiconductor growth process |
| 01/19/1993 | US5180680 Semiconductors |
| 01/19/1993 | US5180477 Thin film deposition apparatus |
| 01/19/1993 | US5180476 Method for producing transparent conductive films |
| 01/19/1993 | US5180469 Method for slicing a semiconductor silicon single crystal |
| 01/19/1993 | US5180468 Doping a silicon substrate and heat treatment |
| 01/19/1993 | US5180466 Sulfur hexafluoride and difluoromethane, nondestructive to silicon oxide layer |
| 01/19/1993 | US5180464 Dry etching method |
| 01/19/1993 | US5180432 Microelectronics, silicides |
| 01/19/1993 | US5180431 Apparatus for applying liquid agent on surface of rotating substrate |
| 01/19/1993 | US5180276 Articulated arm transfer device |
| 01/19/1993 | US5180273 Apparatus for transferring semiconductor wafers |
| 01/19/1993 | US5180230 Rolling element cage constraint |
| 01/19/1993 | US5180226 Method and apparatus for precise temperature measurement |
| 01/19/1993 | US5180150 Apparatus for providing consistent registration of semiconductor wafers |
| 01/19/1993 | US5180094 Wire bonder with bonding arm angle sensor |
| 01/19/1993 | US5180048 Magnetic levitating transportation system |
| 01/19/1993 | US5180000 Workpiece carrier with suction slot for a disk-shaped workpiece |
| 01/19/1993 | US5179863 Method and apparatus for setting the gap distance between a mask and a wafer at a predetermined distance |
| 01/19/1993 | CA1312964C Low stress polysilicon microstructures |