Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1992
11/17/1992US5164907 Computer aided design system capable of placing functional blocks with a circuit constraint satisfied
11/17/1992US5164905 Production system with order of processing determination
11/17/1992US5164888 Method and structure for implementing dynamic chip burn-in
11/17/1992US5164881 Highly integrated semiconductor memory device and the fabrication method thereof
11/17/1992US5164814 Semiconductor device with customized wiring
11/17/1992US5164813 New diode structure
11/17/1992US5164810 High temperature applications
11/17/1992US5164808 Platinum electrode structure for use in conjunction with ferroelectric materials
11/17/1992US5164807 Charge-coupled devices with locally widened electrodes
11/17/1992US5164806 Element isolating structure of semiconductor device suitable for high density integration
11/17/1992US5164803 Cmos semiconductor device with an element isolating field shield
11/17/1992US5164802 Power vdmosfet with schottky on lightly doped drain of lateral driver fet
11/17/1992US5164801 A p channel mis type semiconductor device
11/17/1992US5164686 High-frequency oscillator having a field-effect transistor with a stepwise increasing active layer carrier concentration
11/17/1992US5164666 Method and apparatus for analyzing errors in integrated circuits
11/17/1992US5164664 Method for the optical measurement of electrical potentials
11/17/1992US5164617 High speed bicmos logic circuit
11/17/1992US5164599 Ion beam neutralization means generating diffuse secondary emission electron shower
11/17/1992US5164596 Focused ion beam irradiating apparatus
11/17/1992US5164566 Method and apparatus for fluxless solder reflow
11/17/1992US5164359 Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate
11/17/1992US5164340 Structure and method for contacts in cmos devices
11/17/1992US5164338 Method of manufacturing a polycrystalline semiconductor resistance layer of silicon on a silicon body and silicon pressure sensor having such a resistance layer
11/17/1992US5164337 Method of fabricating a semiconductor device having a capacitor in a stacked memory cell
11/17/1992US5164336 Bonding bumps by thermocompression
11/17/1992US5164335 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
11/17/1992US5164334 Reduced wiring parasitic capacitance
11/17/1992US5164333 Silicide diffusion barrier
11/17/1992US5164331 Trifluoromethane and oxygen
11/17/1992US5164330 Etchback process for tungsten utilizing a NF3/AR chemistry
11/17/1992US5164329 Doping, confinement layer in two sections
11/17/1992US5164327 Method of manufacturing a mis-type semiconductor
11/17/1992US5164326 Complementary bipolar and CMOS on SOI
11/17/1992US5164325 Method of making a vertical current flow field effect transistor
11/17/1992US5164324 Etching, semiconductors, to reduce background signal on CCD's, charge coupled devices
11/17/1992US5164323 Process for the surface treatment of semiconductor slices
11/17/1992US5164278 Speed enhancers for acid sensitized resists
11/17/1992US5164246 For semiconductors, aluminum nitride ceramics, electroconduc-tive coating, metal nitride, tungsten and molybdenum
11/17/1992US5164222 Chemical vapor deposition of tungsten
11/17/1992US5164218 Semiconductor device and a method for producing the same
11/17/1992US5164093 Apparatus and method for removing metallic contamination from fluids using silicon beads
11/17/1992US5164037 Apparatus for removing semiconductor devices from high density multichip modules
11/17/1992US5164034 Apparatus and method for processing substrate
11/17/1992US5164012 Heat treatment apparatus and method of forming a thin film using the apparatus
11/17/1992US5164010 Solder coating method and apparatus for semiconductor devices
11/17/1992US5163802 Automatic handling of different magazines by standardized pick-ups and identification codes
11/17/1992US5163728 For grasping and manipulating fragile articles
11/17/1992US5163551 Integrated circuit device carrier
11/17/1992US5163499 Method of forming electronic packages
11/17/1992US5163363 Device for multiple-point application of equal forces
11/17/1992US5163312 Wafer proximity sensor
11/17/1992US5163222 Method and apparatus for loading metal leadframes with electronic components
11/17/1992CA1310433C Non-rectifying contacts to iii-v semiconductors
11/17/1992CA1310297C System and method for depositing plural thin film layers on a substrate
11/17/1992CA1310296C P and n-type microcrystalline semiconductor alloy material including band gap widening elements devices utilizing same
11/17/1992CA1310188C Apparatus for removing minute particles from a substrate
11/16/1992CA2234517A1 Blue-green lase diode
11/12/1992WO1992020109A1 A plug contact with antifuse and method of manufacture thereof
11/12/1992WO1992020103A1 A method for manufacturing solar cells
11/12/1992WO1992020102A1 Oxides and nitrides of metastabile groupe iv alloys and nitrides of group iv elements and semiconductor devices formed thereof
11/12/1992WO1992020101A1 Method for mounting an integrated circuit chip on a wiring substrate
11/12/1992WO1992020100A1 A ceramic substrate having a protective coating and method of protection
11/12/1992WO1992020099A1 Stabilization of the interface between aluminum and titanium nitride
11/12/1992WO1992020098A1 Liquid film interface cooling chuck for semiconductor wafer processing
11/12/1992WO1992020095A1 Programmable interconnect structures and programmable integrated circuits
11/12/1992WO1992020094A1 Direct substrate bonding
11/12/1992WO1992020093A1 Ceramic electrostatic chuck
11/12/1992WO1992019944A1 Non-contact optical techniques for measuring surface conditions
11/12/1992WO1992019462A1 Process for the manufacture of an interconnect circuit
11/12/1992WO1992019396A1 Formation of shapes in a metal workpiece
11/12/1992WO1992019391A1 Method of forming metal oxide coatings
11/12/1992DE4215471A1 Semiconductor package e.g. lead-on-chip, small outline J-lead type - has chip with several solder points which are soldered to numerous inner lines of conductor frame
11/12/1992DE4215467A1 Integration of two semiconductor chips inside standard outline package - uses solder bumps on both dice which are bonded face-to-face in lead-on-chip configuration to lead frame
11/12/1992DE4215210A1 Optical phase shifting mask mfr. - has sidewall phase shifting layer on both sides of each phase shifting layer for spatial frequency modulation
11/12/1992DE4215010A1 High density integrated MOS circuit with reduced narrow channel effect - uses vertical channel structure with epitaxial silicon or pattern etched into the substrate with circular or elliptical walls
11/12/1992DE4214993A1 Semiconductor disc prepn. - by forming layer of polycrystalline silicon on substrate, forming dielectric by oxidn. of substrate, and then doping
11/12/1992DE4214391A1 Integrated semiconductor switching circuit - comprising substrate contg. electronic cpd., electrically insulating layer and electrically conducting cpd.
11/12/1992DE4212861A1 FET contg. potential barriers - has source-drain regions on substrate, gate electrode on insulation layer, channel region between substrate, source-drain and semiconductor layers
11/12/1992DE4115046A1 Direktes substratbonden Direct bonding substrate
11/11/1992EP0512936A1 Temperature cycling ceramic electrostatic chuck
11/11/1992EP0512880A1 Process for the treatment of the engraved surface of a semi-conducting or a semi-insulating body, integrated circuits obtained by such a process and anodising apparatus for performing such a process
11/11/1992EP0512878A1 Photosensitive device with read registers placed side by side
11/11/1992EP0512692A1 Photosensitive materials and process for making them
11/11/1992EP0512677A2 Plasma treatment method and apparatus
11/11/1992EP0512607A2 Method of manufacturing a semiconductor device using ion implantation
11/11/1992EP0512605A1 Power device having reverse-voltage protection
11/11/1992EP0512579A1 Packaging of semiconductor elements
11/11/1992EP0512546A1 Anisotropically conductive material and method for connecting integrated circuits by using the same
11/11/1992EP0512516A1 Magnetic drive device
11/11/1992EP0512463A1 Process for manufacturing dynamic random access memories
11/11/1992EP0512386A1 High adhesion performance roll sputtered strike layer
11/11/1992EP0512339A1 High temperature stable positive resists and process for the production of high temperature stable relief structure
11/11/1992EP0512296A1 Method of depositing conductors in high aspect ratio apertures under high temperature conditions
11/11/1992EP0324810B1 Quartz glass reactor for mocvd installations
11/11/1992EP0319571B1 router for integrated circuits
11/11/1992CN1019031B Apparatus for manufacturing silicon single crystals
11/10/1992US5163180 Low voltage programming antifuse and transistor breakdown method for making same
11/10/1992US5163178 Semiconductor device having enhanced impurity concentration profile
11/10/1992US5162975 Integrated circuit demountable TAB apparatus
11/10/1992US5162901 Active-matrix display device with added capacitance electrode wire and secondary wire connected thereto
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