| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/25/1994 | US5281840 High mobility integrated drivers for active matrix displays |
| 01/25/1994 | US5281839 Semiconductor device having a short gate length |
| 01/25/1994 | US5281837 Semiconductor memory device having cross-point DRAM cell structure |
| 01/25/1994 | US5281834 Non-silicon and silicon bonded structure and method of manufacture |
| 01/25/1994 | US5281828 Thin film transistor with reduced leakage current |
| 01/25/1994 | US5281827 Charged particle beam exposure apparatus |
| 01/25/1994 | US5281794 Heater block for use in a bonder utilizing vacuum suction attachment means |
| 01/25/1994 | US5281772 Electrical connector having energy-formed solder stops and methods of making and using the same |
| 01/25/1994 | US5281769 Circuit means in an integrated circuit |
| 01/25/1994 | US5281759 Semiconductor package |
| 01/25/1994 | US5281723 Feeding propylene carbonate effluent to a separation means, separating water and volatiles, recovering, evaporating to separate propylene carbonate from high boiling materials |
| 01/25/1994 | US5281684 Solder bumping of integrated circuit die |
| 01/25/1994 | US5281557 Controlling plasma power density, silicon dioxide with high wet etch rate |
| 01/25/1994 | US5281556 Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane |
| 01/25/1994 | US5281555 Method for alleviating the step difference in a semiconductor and a semiconductor device |
| 01/25/1994 | US5281554 Method for producing a semiconductor device having a tantalum thin film |
| 01/25/1994 | US5281553 Method for controlling the state of conduction of an MOS transistor of an integrated circuit |
| 01/25/1994 | US5281552 MOS fabrication process, including deposition of a boron-doped diffusion source layer |
| 01/25/1994 | US5281551 Gallium arsenide heteroepitaxial buffer layer |
| 01/25/1994 | US5281550 Method for etching a deep groove in a silicon substrate |
| 01/25/1994 | US5281549 Maximizing storage cell surface area |
| 01/25/1994 | US5281547 Method for manufacturing a field effect transistor |
| 01/25/1994 | US5281546 Method of fabricating a thin film transistor using hydrogen plasma treatment of the intrinsic silicon/doped layer interface |
| 01/25/1994 | US5281544 Method of manufacturing planar type polar transistors and combination bipolar/MIS type transistors |
| 01/25/1994 | US5281543 Fabrication method for quantum devices in compound semiconductor layers |
| 01/25/1994 | US5281541 Voltage discharge from electrode positioned above pinhole defect, large area semiconductors such as solar cells |
| 01/25/1994 | US5281500 Providing photomask, providing phase shifting features raised from surface, terminating in optically clear edge, tapering edge, the edge formed such that null formed by clear edge is spread out and not printed onto photoresist |
| 01/25/1994 | US5281485 Structure and method of making Alpha-Ta in thin films |
| 01/25/1994 | US5281449 Coating and curing then development with alkali |
| 01/25/1994 | US5281389 Vaporizable liquid vehicle, sinterable palladium powder dispersed in vehicle, titanium dioxide, strontium calcium titanate compound |
| 01/25/1994 | US5281350 Ammonium bifluoride in glycerin and ferric chloride |
| 01/25/1994 | US5281320 Wafer coating system |
| 01/25/1994 | US5281318 Process for processing a waste etching solution containing a fluorine component and an ammonia component to recover valuables therefrom |
| 01/25/1994 | US5281304 Modifying surface of copper film to copper sulfide, etching to patternize wiring, reducing copper sulfide to copper, forming insulation |
| 01/25/1994 | US5281302 Fluoridated carbon compounds and ozone and oxygen |
| 01/25/1994 | US5281297 Applying plastic tape to large wafers |
| 01/25/1994 | US5281295 Semiconductor fabrication equipment |
| 01/25/1994 | US5281283 Substrate has non-nucleation surface and amorphous nucleation surface with different nucleation densities adjacent to each other |
| 01/25/1994 | US5280983 Semiconductor processing system with robotic autoloader and load lock |
| 01/25/1994 | US5280979 Tip for a vacuum pipette with improved electrostatic discharge properties |
| 01/25/1994 | US5280894 Fixture for backside wafer etching |
| 01/25/1994 | US5280850 Method of manufacturing circuit board |
| 01/25/1994 | CA1326568C2 Profile tailored trench etch using a sf_-0_ etching composition wherein both isotropic and anisotropic etching is achieved by varying the amount of oxygen |
| 01/25/1994 | CA1326567C2 Topographic pattern delineated power mosfet with profile tailored recessed source |
| 01/25/1994 | CA1326391C Photonic-integrated-circuit fabrication process |
| 01/21/1994 | CA2100277A1 Sealing porous electronic substrates |
| 01/20/1994 | WO1994001986A1 Electronic package having controlled epoxy flow |
| 01/20/1994 | WO1994001892A1 Triple-gate flash eeprom memory and method for making same |
| 01/20/1994 | WO1994001891A1 Process for producing storage capacitors for dram cells |
| 01/20/1994 | WO1994001887A1 High density memory and method of forming the same |
| 01/20/1994 | WO1994001886A1 Electronic package with stress relief channel |
| 01/20/1994 | WO1994001885A1 A method of treating a semiconductor wafer |
| 01/20/1994 | WO1994001875A1 Submicron isolated, released resistor structure |
| 01/20/1994 | WO1994001808A1 System for detecting a latent image using an alignment apparatus |
| 01/20/1994 | WO1994001807A1 Metal ion reduction in top anti-reflective coatings for photoresists |
| 01/20/1994 | WO1994001805A1 Positive-acting radiation-sensitive mixture and recording material produced therewith |
| 01/20/1994 | WO1994001597A1 Apparatus and method for treating a wafer of semiconductor material |
| 01/20/1994 | WO1994001354A1 Magnetically levitated carrying apparatus |
| 01/20/1994 | DE4328628A1 Electrolytic production of standard oxide layer on silicon bodies - using focussed laser beam to heat areas where oxide is to be produced |
| 01/20/1994 | DE4323964A1 Treating semiconductor substrate in gas atmos. - to suppress formation of bulk micro defects |
| 01/20/1994 | DE4323961A1 Stacked capacitor DRAM - has wiring layer which is used for top electrode of storage capacitor and for connecting to peripheral circuit in region separate from that contg. memory cell |
| 01/20/1994 | DE4323799A1 Semiconductor module coupled to pcb by face-down technology - has contact bumps of solder for connecting chip electrodes to circuit board electrodes, with wall piece not in contact with bumps |
| 01/20/1994 | DE4323363A1 Mfg. capacitor for DRAM memory cell - forming conductive structure on substrate, forming inner and outer etch masks, anisotropically etching structure to produce first electrode having double-cylinder structure, and forming dielectric and second electrode layers |
| 01/20/1994 | DE4321590A1 Thin film transistor for active matrix display drive circuit - has first TFT with source and drain electrodes on substrate, and second TFT with common gate electrode |
| 01/20/1994 | DE4223371A1 Electronic component mounting method for circuit board assembly - with openings in cover layer overlapping each component receiving conductive paste providing required electrical connections |
| 01/20/1994 | DE4223215A1 Processing silicon@ wafer having deformable micro mechanical structure - comprising adhering foil to lower side of wafer and removing foil after processing |
| 01/20/1994 | DE4222968A1 Positiv-arbeitendes strahlungsempfindliches Gemisch und damit hergestelltes Aufzeichnungsmaterial Positive-working radiation-sensitive mixture and thus produced recording material |
| 01/20/1994 | CA2140154A1 Electronic package having controlled epoxy flow |
| 01/19/1994 | EP0579566A2 High-density dram structure on SOI |
| 01/19/1994 | EP0579562A1 Gripping device for holders of silicium discs |
| 01/19/1994 | EP0579464A2 Metal insert and a surface roughening treatment method for it |
| 01/19/1994 | EP0579456A2 Curing silicon hydride containing materials by exposure to nitrous oxide |
| 01/19/1994 | EP0579438A2 Solder self-alignment methods |
| 01/19/1994 | EP0579413A1 Dynamic control of individual spot exposure in an optical output device |
| 01/19/1994 | EP0579380A1 Apparatus and method for scanning a two-dimensional surface of one or more objects |
| 01/19/1994 | EP0579286A2 Method of fabricating a semiconductor device with Schottky barrier |
| 01/19/1994 | EP0579227A1 Method and apparatus for slicing semiconductor wafer |
| 01/19/1994 | EP0579099A1 Container for plate-like objects |
| 01/19/1994 | EP0579018A1 Process for production of a metal oxide layer, vacuum treatment apparatus for the process and article coated with at least one metal oxide layer |
| 01/19/1994 | EP0578996A1 Method of doping a semiconductor surface by gaseous diffusion |
| 01/19/1994 | EP0578991A1 Bidirectional semiconductor switch |
| 01/19/1994 | EP0578973A1 Method of forming short-circuiting regions for insulated gate semiconductor devices |
| 01/19/1994 | EP0578970A2 Fabrication method for an integrated semi-conductor memory with a predetermined storage capacity |
| 01/19/1994 | EP0578926A1 A semiconductor device with sidewall channel and method of formation |
| 01/19/1994 | EP0578915A2 Two-port ram cell |
| 01/19/1994 | EP0578899A1 Process for measuring the planarity degree of a dielectric layer in an integrated circuit and integrated circuit including means for performing said process |
| 01/19/1994 | EP0578858A1 AC interconnect test of integrated circuit chips |
| 01/19/1994 | EP0578856A1 Micro-capacitor |
| 01/19/1994 | CN1081027A Ii-vi laser diodes with quantum wells gorwn by atomic layer epitaxy and migration enhanced epitaxy |
| 01/19/1994 | CN1081022A Semiconductor device and method for forming the same |
| 01/18/1994 | US5280454 Electrically erasable programmable read-only memory with block-erase function |
| 01/18/1994 | US5280444 Dram comprising stacked-type capacitor having vertically protruding part and method of manufacturing the same |
| 01/18/1994 | US5280442 Read-only memory |
| 01/18/1994 | US5280437 Structure and method for direct calibration of registration measurement systems to actual semiconductor wafer process topography |
| 01/18/1994 | US5280236 IC test instrument |
| 01/18/1994 | US5280228 Inverter circuit |
| 01/18/1994 | US5280219 Cluster tool soft etch module and ECR plasma generator therefor |
| 01/18/1994 | US5280193 Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate |
| 01/18/1994 | US5280190 Self aligned emitter/runner integrated circuit |
| 01/18/1994 | US5280188 Method of manufacturing a semiconductor integrated circuit device having at least one bipolar transistor and a plurality of MOS transistors |