Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1994
03/08/1994US5292554 Deposition apparatus using a perforated pumping plate
03/08/1994US5292548 Substrates used in multilayered integrated circuits and multichips
03/08/1994US5292486 Pulling crystals from a melt
03/08/1994US5292445 Wet-etch process and composition
03/08/1994US5292402 Masking with lead perovskite material, fluorine or chlorine based plasma etch
03/08/1994US5292401 Magnetic field to maintain gap, plasma etching
03/08/1994US5292400 Method and apparatus for producing variable spatial frequency control in plasma assisted chemical etching
03/08/1994US5292399 Semiconductor wafers
03/08/1994US5292396 Plasma processing chamber
03/08/1994US5292395 ECR plasma reaction apparatus having uniform magnetic field gradient
03/08/1994US5292393 Multichamber integrated process system
03/08/1994US5292373 Immersing semiconductor wafers in washing liquid
03/08/1994US5292054 Method of manufacturing heat transfer devices, and a tool for carrying out the method
03/08/1994US5292050 Wire bonder
03/08/1994US5291994 Slide tab carrier for flatpack electronic component carriers
03/08/1994US5291923 Door opening system and method
03/08/1994US5291814 Lead frame cutting apparatus for integrated circuit packages
03/08/1994CA2039777C N-channel clamp for esd protection in self-aligned silicided cmos process
03/08/1994CA2027025C Method of manufacturing circuit board
03/08/1994CA1327646C Bipolar field-effect electrically erasable programmable read only memory cell and method of manufacture
03/06/1994CA2105448A1 Aluminum nitride circuit board and method of producing same
03/04/1994CA2104745A1 Field effect transistor
03/03/1994WO1994006529A1 Liquid gasification apparatus
03/03/1994WO1994005043A1 Semiconductor integrated circuit
03/03/1994WO1994005041A1 Antifuse structure and method for forming
03/03/1994WO1994005039A1 Semiconductor wafer for lamination applications
03/03/1994WO1994005037A1 Recessed oxide and method
03/03/1994WO1994005036A1 Improved back-side hydrogenation technique for defect passivation in silicon solar cells
03/03/1994WO1994005035A1 Hollow-anode glow discharge apparatus
03/03/1994WO1994004599A1 Polymeric substrate with polymeric microelements
03/03/1994WO1994000870A3 Chemical vapor deposition from single organometallic precursors
03/03/1994DE4329311A1 Plastics mould for semiconductor component mfr. - has bottom plunger which has lower cushion block section and lower plunger face, or drawing section
03/03/1994DE4328911A1 Logic synthesiser - produces list contg. information about logic elements and rates layout to enable generation of simplified layout
03/03/1994DE4328510A1 Semiconductor memory mfr. for DRAM prodn. - forming conductive layer pattern with depression, bounding region in individual cell unit, and etching to produce double-cylinder electrode for capacitor
03/03/1994DE4327814A1 Address decoder for repair of memory device - has voltage line connected to multiple repair connections which may be selectively removed by laser beam
03/03/1994DE4327813A1 Dual cell plate structure DRAM mfr. - has insulation films and conductor packing consisting of materials with different etching properties
03/03/1994DE4229031A1 Thermostable coating system for hexa:cyano-benzene on pure oxide free silicon - used as passivation, insulation, sub-coat, surface modifier, organic semiconductor or signal determn. in silicon substrate
03/03/1994DE4228870A1 Determination of geometry of thin, optically transparent layers e.g of mask or semiconductor wafer - simulating via computer model and using proportional relationship of intensity of reflection spectrum of thickness measurement at certain wavelength with integral of intensity distribution of densitometry measurement
03/03/1994DE4228274A1 Device contacting process for high density connections - esp. for contacting LEDs on common silicon@ chip without use of bonding techniques
03/02/1994WO1994002396A1 Article-handling system
03/02/1994WO1994002395A1 Fluid transport system for transporting articles
03/02/1994EP0585125A2 A thin film semiconductor device and method of manufacture
03/02/1994EP0585084A1 Permanent metallic bonding method
03/02/1994EP0585059A2 Vertical memory cell processing and structure manufactured by that processing
03/02/1994EP0585003A2 Group III-V compound semiconductor device including a group IV element doped region
03/02/1994EP0584905A1 Apparatus for wafer chamfer polishing
03/02/1994EP0584891A2 Method for the formation of built-up films of monomolecular layers using silane compounds having an acetylene bond
03/02/1994EP0584778A2 Semiconductor substrate and method for preparing it
03/02/1994EP0584777A1 Semiconductor device and process for producing the same
03/02/1994EP0584739A2 Semiconductor integrated circuit operative in different modes
03/02/1994EP0584726A1 Method of fabricating ceramic circuit substrate
03/02/1994EP0584676A1 Closed loop semiconductor fabrication method and system
03/02/1994EP0584483A1 Method for preparing a shield to reduce particles in a physical vapor deposition chamber
03/02/1994EP0584436A1 Process for forming buried regions, having different doping concentration, in monolitic semiconductor devices
03/02/1994EP0584356A1 Method of soldering
03/02/1994EP0584349A1 Process and device for three-dimensional interconnection of housings for electronic components
03/02/1994EP0584278A1 Pyrometer temperature measurement of plural wafers stacked in a processing chamber
03/02/1994EP0584252A1 A PROCESS FOR DEPOSITING A SIOx FILM HAVING REDUCED INTRINSIC STRESS AND/OR REDUCED HYDROGEN CONTENT
03/02/1994EP0584236A1 Blue-green laser diode.
03/02/1994EP0584143A1 Process and device for manufacturing plastic mouldings having wall regions of reduced thickness.
03/02/1994EP0584077A1 Wafer processing cluster tool batch preheating and degassing method and apparatus
03/02/1994EP0407457B1 Precursors for metal fluoride deposition and use thereof
03/02/1994EP0406351B1 Ultrasonic laser soldering
03/02/1994EP0253691B1 Silicon die bonding process
03/02/1994CN1083267A Large ceramic article and method of manufacturing
03/02/1994CN1083266A Epitaxial growth method for obtaining low surface segregated silicon/germanium-silicon heterogeneous structure
03/02/1994CA2137921A1 Article-handling system
03/02/1994CA2137920A1 Fluid transport system for transporting articles
03/01/1994US5291536 X-ray mask, method for fabricating the same, and pattern formation method
03/01/1994US5291447 Semiconductor memory device having function of controlling sense amplifiers
03/01/1994US5291441 Electrically programmable read only memory device with timing detector for increasing address decoding signal
03/01/1994US5291439 Semiconductor memory cell and memory array with inversion layer
03/01/1994US5291438 Transistor and a capacitor used for forming a vertically stacked dynamic random access memory cell
03/01/1994US5291435 Read-only memory cell
03/01/1994US5291433 Semiconductor memory with leak-resistant bit lines
03/01/1994US5291432 Semiconductor memory device
03/01/1994US5291415 Method to determine tool paths for thinning and correcting errors in thickness profiles of films
03/01/1994US5291371 Thermal joint
03/01/1994US5291292 Image sensor and method of driving the same
03/01/1994US5291222 Image exposure apparatus
03/01/1994US5291127 Chip-lifetime testing instrument for semiconductor devices
03/01/1994US5291059 Resin-molded semiconductor device and lead frame employed for fabricating the same
03/01/1994US5291058 Semiconductor device silicon via fill formed in multiple dielectric layers
03/01/1994US5291057 Rectangular shaped laser diode and symmetrically inverted triangular shaped emitting and receiving photodiodes on the same substrate
03/01/1994US5291052 CMOS semiconductor device with (LDD) NMOS and single drain PMOS
03/01/1994US5291051 ESD protection for inputs requiring operation beyond supply voltages
03/01/1994US5291049 Mosfet with buried element isolation regions
03/01/1994US5291048 Non-volatile storage device with impurities in nitride toward source side
03/01/1994US5291047 Floating gate type electrically programmable read only memory cell with variable threshold level in erased state
03/01/1994US5291046 Semiconductor memory device
03/01/1994US5291033 Semiconductor light-emitting device having substantially planar surfaces
03/01/1994US5291025 In-line non-contact wafer boat inspection apparatus
03/01/1994US5291023 Position detecting system utilizing a weight coefficient to determine a gravity center of light
03/01/1994US5290993 Microwave plasma processing device
03/01/1994US5290971 Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same
03/01/1994US5290736 Method of forming interlayer-insulating film using ozone and organic silanes at a pressure above atmospheric
03/01/1994US5290734 Depositing a conductive, conforming protective coating and forming spacers
03/01/1994US5290733 Corrosion resistance
03/01/1994US5290732 Process for making semiconductor electrode bumps by metal cluster ion deposition and etching
03/01/1994US5290731 Aluminum metallization method