Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/1994
01/18/1994US5280187 Electrically programmable and erasable semiconductor memory and method of operating same
01/18/1994US5280185 Semiconductor with diffusion barrier
01/18/1994US5280184 Three dimensional integrated circuits with lift-off
01/18/1994US5280180 Interconnect structure for coupling semiconductor regions and method for making
01/18/1994US5280156 Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means
01/18/1994US5280154 Radio frequency induction plasma processing system utilizing a uniform field coil
01/18/1994US5280139 Multilayer; dielectric, adhesive and electroconductive layer
01/18/1994US5279992 Method of producing a wafer having a curved notch
01/18/1994US5279991 High density electronic package
01/18/1994US5279990 Method of making a small geometry contact using sidewall spacers
01/18/1994US5279989 Forming minature contacts over source and drain
01/18/1994US5279988 forming opening in dielectric, then electroconductive layer and patterning, then dielectric and magnetic material
01/18/1994US5279987 Fabricating planar complementary patterned subcollectors with silicon epitaxial layer
01/18/1994US5279985 Semiconductor device and method of fabrication thereof
01/18/1994US5279984 Method for producing a semiconductor integrated circuit device in which circuit functions can be remedied or changed
01/18/1994US5279983 Method of making a semiconductor memory device
01/18/1994US5279982 Forming strip of isolation structure on semiconductor; then overcoating with barrier structure
01/18/1994US5279981 Method of reducing the trap density of an oxide film for application to fabricating a nonvolatile memory cell
01/18/1994US5279980 Sputtering
01/18/1994US5279979 Semiconductor having diffusion region separated from the gap electrode and wiring layer
01/18/1994US5279977 Method of manufacturing a semiconductor device for extracting a signal used to monitor potential of a high voltage island
01/18/1994US5279976 Forming patterned mask of fluorinated-boron compound overlying dielectric; implanting boron
01/18/1994US5279975 Method of testing individual dies on semiconductor wafers prior to singulation
01/18/1994US5279973 In mixture of oxygen and an inert gas
01/18/1994US5279926 Method and apparatus for removing vapor from a pressurized sprayed liquid in the manufacture of semiconductor integrated circuits
01/18/1994US5279925 Masking; illuminating with scanning particle beam
01/18/1994US5279921 Pattern formation resist and pattern formation method
01/18/1994US5279888 Multilayer; silicon carbide, dielectric, electroconductive polysilicon and wiring layer
01/18/1994US5279887 Polycrystalline silicon contact structure
01/18/1994US5279869 Using laser
01/18/1994US5279865 High throughput interlevel dielectric gap filling process
01/18/1994US5279798 Silicon single crystal manufacturing apparatus
01/18/1994US5279771 Removal photoresist from substrate
01/18/1994US5279711 Chip attach and sealing method
01/18/1994US5279706 Forming metal layer, applying photoresist, exposure to radiation
01/18/1994US5279705 Using hydrogen fluoride vapors and oxidizer
01/18/1994US5279704 Etching intermetallic; forming grooves
01/18/1994US5279703 Absorbent substrate; radiating with light source
01/18/1994US5279702 Anisotropic liquid phase photochemical copper etch
01/18/1994US5279694 Chip mounting techniques for display apparatus
01/18/1994US5279687 Preparing substrates by annealing epitaxial layers in the form of nesas and substrates so prepared
01/18/1994US5279686 Polycrystalline silicon utilizing single crystal
01/18/1994US5279670 Vertical type diffusion apparatus
01/18/1994US5279661 Vaporized hydrogen silsesquioxane for depositing a coating
01/18/1994US5279623 Method of fabricating flat type electrochemical device
01/18/1994US5279316 Multiprocessing sonic bath system for semiconductor wafers
01/18/1994US5279077 Method for producing semiconductor wafer
01/18/1994US5279045 Minute particle loading method and apparatus
01/18/1994US5279029 Ultra high density integrated circuit packages method
01/18/1994CA1326155C High resolution e-beam lithographic technique
01/17/1994CA2097388A1 Topographical selective patterns
01/14/1994CA2100278A1 Curing silicon hydride containing materials by exposure to nitrous oxide
01/13/1994DE4321609A1 Integrated semiconductor circuit with pass transistor circuit - responds to control signal applied to pass transistor circuit to select input signal on one of multiple input connections
01/13/1994DE4320062A1 Insulating elements in silicon@ semiconductor device - for prodn. of switch of CMOS type and avoiding danger of crystal imperfection
01/13/1994DE4223914A1 Vertical power component manufacturing method - interrupting epitaxial growth of lightly-doped semiconductor drift layer for implantation of non-doped ions
01/13/1994DE4222512A1 Epitaxial deposition method for producing components on semiconductor substrate - forming components while substrate is placed on support substrate with test, measurement or adjustment structures
01/13/1994DE4221564A1 Solder connection method for joining e.g. LED chip and flat copper component - preheating solder, positioning chip, melting solder by short-term temp. increase and lowering chip into position before cooling
01/13/1994DE4220875A1 Connecting semiconductor body to contact plates - placing spaced strips of solder foil between contact plate and semiconductor body, and heating parts to melt solder
01/13/1994DE4220827A1 Anlage zur Behandlung von Objekten unter Reinluftraum-Bedingungen Plant for the treatment of objects under clean air room conditions
01/12/1994EP0578562A1 Procedure for determining the focus of a photolithographic exposure apparatus
01/12/1994EP0578507A2 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
01/12/1994EP0578505A2 Method of adjusting concentration of developer
01/12/1994EP0578410A2 Programmable die identification circuits
01/12/1994EP0578351A1 Elastic foamed sheet and wafer-polishing jig using the sheet
01/12/1994EP0578307A2 Chip carrier with protective coating for circuitized surface
01/12/1994EP0578254A2 Epaxial crowth method of a carbon doped A III - B V compound semiconductor layer
01/12/1994EP0578252A2 Semiconductor sensor device
01/12/1994EP0578177A2 Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern
01/12/1994EP0578061A1 Device to withdraw, superimpose and anchor foils for green-tape circuits
01/12/1994EP0578040A2 Fluid treatment apparatus and method
01/12/1994EP0578028A1 High frequency semiconductor device
01/12/1994EP0578011A1 Multi-electrode plasma processing apparatus
01/12/1994EP0578010A1 Multi-zone plasma processing method
01/12/1994EP0577985A1 Amorphous semiconductor solar module having improved passivation
01/12/1994EP0577906A1 Structure preventing a parasitic diode from being switched on in an epitaxial tub of integrated circuits
01/12/1994EP0577779A1 Multichip integrated circuit module and method of fabrication
01/12/1994EP0577776A1 Graded collector for inductive loads
01/12/1994EP0577766A1 Apparatus and method for high throughput sputtering
01/12/1994EP0577762A1 Cleaning brush for semiconductor wafer.
01/12/1994EP0577743A1 Photodefinable interlevel dielectrics
01/12/1994EP0577667A1 Arc source macroparticle filter
01/12/1994EP0577623A1 Thyristor with adjustable breakover voltage, and a process for manufacturing it
01/12/1994EP0470957B1 Etchant solution for photoresist-patterned metal layers
01/12/1994EP0229757B1 A method of bonding two substrates using arylcyclobutene monomeric compositions
01/12/1994CN1023450C Method and arrangement for drying substrates aftes treatment in liquid
01/11/1994US5278861 Method of treating metals by deposition of materials and furnace for implementing said method
01/11/1994US5278799 Semiconductor memory circuit
01/11/1994US5278798 Semiconductor memory device
01/11/1994US5278787 Semiconductor device and method of manufacturing the same
01/11/1994US5278785 Non-volatile memory circuits and architecture
01/11/1994US5278784 Non-volatile memory
01/11/1994US5278726 Method and apparatus for partially overmolded integrated circuit package
01/11/1994US5278704 Information processing apparatus including magnetic material having a predetermined magnetization pattern with respect to a recording medium
01/11/1994US5278526 Laminated LC element and method for manufacturing the same
01/11/1994US5278494 Wafer probing test machine
01/11/1994US5278459 Static semiconductor memory using thin film FET
01/11/1994US5278450 Semiconductor contact with discontinuous noble metal
01/11/1994US5278449 Alloy having a low eutectic point
01/11/1994US5278448 Multilayer of vapor deposited refractory and aluminum
01/11/1994US5278442 Electronic packages and smart structures formed by thermal spray deposition