Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1994
02/09/1994EP0582086A1 Method for mounting components and an apparatus therefor
02/09/1994EP0582084A2 Semiconductor leadframe and package
02/09/1994EP0582076A1 Emitter coupled logic semiconductor device
02/09/1994EP0582039A1 Continuous heat treatment system of semiconductor wafers for eliminating thermal donor
02/09/1994EP0582019A1 Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers
02/09/1994EP0582018A1 Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment
02/09/1994EP0582017A1 Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers
02/09/1994EP0582016A1 Pressurized sealable transportable containers for storing a semiconductor wafer in a protective gaseous environment
02/09/1994EP0581902A1 Method and apparatus for linear magnetron sputtering
02/09/1994EP0581867A1 Method of laser trimming and resulting ic
02/09/1994EP0581833A1 A method for manufacturing solar cells.
02/09/1994EP0386190B1 Elemental mercury source for metal-organic chemical vapor deposition
02/09/1994CN1081789A Semiconductor device and method for forming the same
02/09/1994CN1081787A Chip carrier with protective coating for circuitized surface
02/08/1994WO1994003931A1 Nitride based semiconductor device and manufacture thereof
02/08/1994USRE34535 Oxide/nitride stack formed over polysilicon control gate; high capacitance
02/08/1994US5285463 Semiconductor device
02/08/1994US5285418 Semiconductor device having a temperature detection circuit
02/08/1994US5285259 Position detecting method
02/08/1994US5285258 Method of and an apparatus for detecting alignment marks
02/08/1994US5285142 Electromagnetic alignment apparatus
02/08/1994US5285122 Variable delay device
02/08/1994US5285110 Interconnection structure in semiconductor device
02/08/1994US5285107 Hybrid integrated circuit device
02/08/1994US5285105 Semiconductor die packages having lead support frame
02/08/1994US5285103 Structure and method for contacts in CMOS devices
02/08/1994US5285102 Formed with active ambient to create an internal stress
02/08/1994US5285101 Semiconductor device
02/08/1994US5285097 Semiconductor sensor of electrostatic capacitance type
02/08/1994US5285095 Semiconductor integrated circuit with input protective transistor effective against electric surge
02/08/1994US5285094 Vertical insulated gate semiconductor device with less influence from the parasitic bipolar effect
02/08/1994US5285092 Semiconductor memory device having a stacked type capacitor and manufacturing method therefor
02/08/1994US5285088 Semiconductor device
02/08/1994US5285087 Heterojunction field effect transistor
02/08/1994US5285086 Semiconductor devices with low dislocation defects
02/08/1994US5285082 Integrated test circuits having pads provided along scribe lines
02/08/1994US5285075 Electron beam lithography method
02/08/1994US5285074 Dynamic compensation of non-linear electron beam landing angle in variable axis lenses
02/08/1994US5284805 Rapid-switching rotating disk reactor
02/08/1994US5284804 Global planarization process
02/08/1994US5284803 Metod of manufacturing a semiconductor body using a carrier wafer and a monocrystalline semiconducting top layer
02/08/1994US5284802 Container for semiconductor wafer sample and method of preparing sample
02/08/1994US5284801 Methods of moisture protection in semiconductor devices utilizing polyimides for inter-metal dielectric
02/08/1994US5284800 Method for preventing the exposure of borophosphosilicate glass to the ambient and stopping phosphorus ions from infiltrating silicon in a semiconductor process
02/08/1994US5284799 Forming connection hole in insulating film, depositing adhesion layer, depositing metal layer, and etching
02/08/1994US5284798 Method for forming an electrode for a compound semiconductor
02/08/1994US5284797 Semiconductor bond pads
02/08/1994US5284796 Mating solder bumps on semiconductor chip and corresponding solder bumps on circuit board, heating and breaking away outer peripheral portion
02/08/1994US5284795 Thermal annealing of semiconductor devices
02/08/1994US5284794 Trimmed by laser
02/08/1994US5284793 Method of manufacturing radiation resistant semiconductor device
02/08/1994US5284789 Method of forming silicon-based thin film and method of manufacturing thin film transistor using silicon-based thin film
02/08/1994US5284788 Forming first conduction element, forming antifuse material of monocrystalline silicone and depant, forming second conduction element
02/08/1994US5284787 Method of making a semiconductor memory device having improved electrical characteristics
02/08/1994US5284786 Method of making a split floating gate EEPROM cell
02/08/1994US5284785 Diffusionless source/drain conductor electrically-erasable, electrically-programmable read-only memory and methods for making and using the same
02/08/1994US5284784 Formed to allow it to be utilized in a virtual ground buried bit-line array
02/08/1994US5284783 Semiconductor material dopes with beryllium
02/08/1994US5284782 Process for formation of delta-doped quantum well field effect transistor
02/08/1994US5284781 Method of forming light emitting diode by LPE
02/08/1994US5284780 Method for increasing the electric strength of a multi-layer semiconductor component
02/08/1994US5284737 Process of developing an image utilizing positive-working radiation sensitive mixtures containing alkali-soluble binder, o-quinonediazide photoactive compound and blankophor FBW actinic dye
02/08/1994US5284736 Flame-resistant photo-curable resin composition
02/08/1994US5284725 Photo-mask for manufacture of two-layer tab
02/08/1994US5284724 Phase mask for projection lithography and method for the manufacture thereof comprising a selectively etchable phase shift layer directly on substrate
02/08/1994US5284615 Method for making injection molded soft magnetic material
02/08/1994US5284549 Reactive ion etching using chloroform and nitrogen gas under pressure
02/08/1994US5284547 Etching semiconductor wafer surfaces, detecting end point by monitoring concentration of gases generated
02/08/1994US5284544 Neutral beam etching apparatus to improve etching rate
02/08/1994US5284413 Apparatus for loading and unloading thin integrated circuits into and from carriers
02/08/1994US5284412 Stock unit for storing carriers
02/08/1994US5284411 Conveyor for conveying workpieces in a vacuum chamber
02/08/1994US5284287 Method for attaching conductive balls to a substrate
02/08/1994US5284179 Valve and semiconductor fabricating equipment using the same
02/08/1994US5283989 Apparatus for polishing an article with frozen particles
02/08/1994US5283946 Method and apparatus for forming metal leads
02/08/1994CA1326887C Standard cell output driver connection system
02/08/1994CA1326789C Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
02/03/1994WO1994003036A1 Semiconductor connection components and methods with releasable lead support
02/03/1994WO1994002885A1 Hexahydroxybenzophenone sulfonate esters of diazonaphthoquinone sensitizers and positive photoresists employing same
02/03/1994WO1994002860A1 Structure and method for testing wiring segments in an integrated circuit device
02/03/1994WO1994002665A1 Semimetal-semiconductor heterostructures and multilayers
02/03/1994WO1994002425A2 Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same
02/03/1994WO1994002299A1 Method and apparatus for separating circuit dies from a wafer
02/03/1994WO1993014250A3 Process for surface treatment with ions
02/03/1994DE4324638A1 Electric contact prodn. for integrated circuit - by self aligned process, esp. in ULSI mfr.
02/03/1994DE4228442C1 Electroless nickel@ coating of metallised ceramic - using treatment to activate only the metallised areas and avoid unwanted coating of ceramic areas
02/03/1994DE4225382A1 Producing boundary surface of III-V semiconductor material at 45 deg. w.r.t. grating plane - epitaxially growing semiconductor material in grating plane of crystal orientation and using mask to align at 45 deg.
02/03/1994DE4225171A1 Mfg. semiconductor element with differently doped layers - by wafer silicon@ bonding and wafer thinning
02/03/1994DE4225169A1 Generating agglomerate jets - with the nozzle divergence angle between 3 and 30 degrees and vapour pressure in nozzle chamber at least 200 hecto pascals
02/03/1994DE4225154A1 Chip-Modul Chip module
02/03/1994CA2140450A1 Semimetal-semiconductor heterostructures and multilayers
02/02/1994EP0581712A2 MLC conductor pattern off-set design to eliminate line to via cracking
02/02/1994EP0581703A1 Method for testing sheet resistivity of diffused layers
02/02/1994EP0581702A1 CMOS technology capacitor
02/02/1994EP0581588A1 Metal plane support for a multi-layer lead frame and a process for manufacturing it
02/02/1994EP0581556A2 Non-contact type probe and non-contact type voltage measuring apparatus
02/02/1994EP0581496A2 Molecular beam epitaxy (MBE) effusion source utilizing heaters to achieve temperature gradients
02/02/1994EP0581475A1 Method of forming electrodes for trench capacitors
02/02/1994EP0581440A1 Ion beam scanning system