| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 03/29/1994 | US5298450 Process for simultaneously fabricating isolation structures for bipolar and CMOS circuits |
| 03/29/1994 | US5298449 Semiconductor substrate having a silicon-on-insulator structure and method of fabricating the same |
| 03/29/1994 | US5298448 Method of making two-phase buried channel planar gate CCD |
| 03/29/1994 | US5298447 Method of fabricating a flash memory cell |
| 03/29/1994 | US5298446 Oxidation, nitriding to form nitride and oxide film of silicon injecting ions, removing sidewall, heat treating the substrate |
| 03/29/1994 | US5298445 Forming ohmic electrode on second semiconductor layer |
| 03/29/1994 | US5298444 Method for manufacturing a field effect transistor |
| 03/29/1994 | US5298443 Process for forming a MOSFET |
| 03/29/1994 | US5298442 Providing first and third regions of first conductivity type and second region of second conductivity type in middle |
| 03/29/1994 | US5298440 Forming silicide layer on first and second polysilicon region and maintaining third polysilicon region is silicide-free |
| 03/29/1994 | US5298439 Forming three layers, and a contact on emitter layer, forming mesa region on emitter, protective covering of mesa region |
| 03/29/1994 | US5298438 Forming multi-dopant and contact layers, selective etching |
| 03/29/1994 | US5298437 Fabrication process for Schottky barrier diodes on a single poly bipolar process |
| 03/29/1994 | US5298436 Changing at least one of the factor selected from flow rate and partial pressure of deposition gas |
| 03/29/1994 | US5298435 Application of electronic properties of germanium to inhibit n-type or p-type diffusion in silicon |
| 03/29/1994 | US5298434 Selective recrystallization to reduce P-channel transistor leakage in silicon-on-sapphire CMOS radiation hardened integrated circuits |
| 03/29/1994 | US5298433 Method for testing semiconductor devices |
| 03/29/1994 | US5298365 Size-reducing projection exposure optical system |
| 03/29/1994 | US5298364 Negative photoresists, acid crosslinking |
| 03/29/1994 | US5298363 Photolithographically patterned fluorescent coating |
| 03/29/1994 | US5298351 Patterned multilayer structure |
| 03/29/1994 | US5298328 Packing material and method of making same |
| 03/29/1994 | US5298288 Coating a heat curable liquid dielectric on a substrate |
| 03/29/1994 | US5298279 Method for connecting terminals of heat seal film substrate |
| 03/29/1994 | US5298278 Chemical vapor phase growth method and chemical vapor phase growth apparatus |
| 03/29/1994 | US5298137 Used for producing a thin film on surface of an object |
| 03/29/1994 | US5298117 Metallic electrical interconnectors of multilayer elements using hydrogen fluoride, cupric chloride and chloride salt as etchant |
| 03/29/1994 | US5298112 Method for removing composite attached to material by dry etching |
| 03/29/1994 | US5298111 Automatic wafer transfer apparatus and a method for transferring wafers and an etching drum |
| 03/29/1994 | US5298110 Trench planarization techniques |
| 03/29/1994 | US5298107 Processing method for growing thick films |
| 03/29/1994 | US5298106 Method of doping single crystal diamond for electronic devices |
| 03/29/1994 | US5298103 Electrode assembly useful in confined plasma assisted chemical etching |
| 03/29/1994 | US5298075 Furnace tube cleaning process |
| 03/29/1994 | US5297969 Electrically connectable module with embedded electrical connectors electrically connected to conductive traces |
| 03/29/1994 | US5297956 Method and apparatus for heat treating |
| 03/29/1994 | US5297910 Transportation-transfer device for an object of treatment |
| 03/29/1994 | US5297897 Single-strip molding apparatus |
| 03/29/1994 | US5297722 Wire bonding method and apparatus |
| 03/29/1994 | US5297712 System for feeding and positioning articles being processed |
| 03/29/1994 | US5297333 Packaging method for flip-chip type semiconductor device |
| 03/29/1994 | CA2051112C Semiconductor device |
| 03/29/1994 | CA2023510C Single wavelength oscillating semiconductor laser device and method for manufacturing diffraction grating |
| 03/25/1994 | CA2104247A1 Photoresist composition |
| 03/24/1994 | DE4332890A1 Raw material for vaporising dielectric thin layers - comprises organic metal cpd. dissolved in THF |
| 03/24/1994 | DE4331894A1 Semiconductor substrate with getter effect - comprises substrate having polycrystalline silicon layer and silicon nitride layer |
| 03/24/1994 | DE4331727A1 Grinding of rim of indented circular semiconductor wafer - using abrasive wheel having annular peripheral groove of trapezoidal cross-section with rounded edges at base |
| 03/24/1994 | DE4331519A1 Fine pattern prodn with high resolution using simplified efficient method - by applying first photoresist, silylating and glassifying surface, making mask with second resist layer and etching down to substrate |
| 03/24/1994 | DE4321638A1 Semiconductor element of high integration esp DRAM elements - comprises capacitor consisting of dielectric layer covering first electrode, an second electrode formed on dielectric layer |
| 03/24/1994 | DE4231392A1 Verfahren zur Bestimmung der elektronischen Eigenschaften von Halbleiterschichtstrukturen A method for determining the electronic properties of semiconductor layer structures |
| 03/24/1994 | DE4231312A1 Antireflexschicht und Verfahren zur lithografischen Strukturierung einer Schicht Anti-reflective coating and method for lithographic patterning a layer |
| 03/24/1994 | CA2106694A1 Hermetic protection of integrated circuits |
| 03/23/1994 | EP0588747A2 Method for planarizing semiconductor structure |
| 03/23/1994 | EP0588721A1 Support with network of resistive elements in conductive polymer and method of making it |
| 03/23/1994 | EP0588681A1 Method for cutting a wafer hard to cut |
| 03/23/1994 | EP0588675A1 Method of hybridization and positioning of an optoelectronic component in relation to an integral optical waveguide |
| 03/23/1994 | EP0588661A2 Semiconductor read only memory |
| 03/23/1994 | EP0588609A1 Ball contact for flip-chip devices |
| 03/23/1994 | EP0588603A2 Hermetically sealed packaged electronic system and method of fabrication |
| 03/23/1994 | EP0588577A2 Hermetically sealed integrated circuits |
| 03/23/1994 | EP0588565A2 Semiconductor device and element separation method |
| 03/23/1994 | EP0588503A2 Integrated circuit magnetic memory element and method of making same |
| 03/23/1994 | EP0588501A1 Technique for enhancing adhesion capability of heat spreaders in molded packages |
| 03/23/1994 | EP0588492A1 High aspect ratio, flexible thick film positive photoresist |
| 03/23/1994 | EP0588487A2 Method of making thin film transistors |
| 03/23/1994 | EP0588481A1 Bond pad layouts for integrated circuit semiconductor dies and forming methods |
| 03/23/1994 | EP0588402A2 A semiconductor memory device |
| 03/23/1994 | EP0588371A2 Semiconductor dynamic sensor having a thin thickness structure and its production method |
| 03/23/1994 | EP0588370A2 Manufacturing method of thin film transistor and semiconductor device utilized for liquid crystal display |
| 03/23/1994 | EP0588320A2 Semiconductor device having planar junction |
| 03/23/1994 | EP0588300A2 Semiconductor transistor |
| 03/23/1994 | EP0588296A1 Method of production of a porous silicon device |
| 03/23/1994 | EP0588260A2 Diamond semiconductor device |
| 03/23/1994 | EP0588180A1 Use of a self-adhesive tape for temporarily fixing wafers (dicing tape) |
| 03/23/1994 | EP0588093A1 Method of treating surface of wiring on circuit board |
| 03/23/1994 | EP0588092A2 Negtive photoresist composition |
| 03/23/1994 | EP0588087A2 Method of determining optimum optical conditions for an anti-reflective layer used in a method of forming a resist pattern |
| 03/23/1994 | EP0588080A1 Selective, low-temperature chemical vapor deposition of gold |
| 03/23/1994 | EP0588067A2 High withstand voltage M I S field effect transistor and semiconductor integrated circuit |
| 03/23/1994 | EP0588055A2 Method for manufacturing wafer |
| 03/23/1994 | EP0588040A2 Light source and technique for mounting light emitting diodes |
| 03/23/1994 | EP0588032A2 Process for forming implanted regions with lowered channeling risk on semiconductors |
| 03/23/1994 | EP0588026A2 Turn-off high-power semiconductor device |
| 03/23/1994 | EP0588009A2 Method of forming borderless contacts using a removable mandrel |
| 03/23/1994 | EP0587996A2 Conductive diffusion barrier |
| 03/23/1994 | EP0587990A2 Method for fabricating a semiconductive device having a conductive metal oxide |
| 03/23/1994 | EP0587889A1 Method for cleaning and apparatus thereof |
| 03/23/1994 | EP0587739A1 Anti-fuse structures and methods for making same |
| 03/23/1994 | EP0581902A4 Method and apparatus for linear magnetron sputtering. |
| 03/23/1994 | EP0462108B1 Overvoltage protection circuit for mos components |
| 03/23/1994 | EP0441810B1 Process for placing modules on a support |
| 03/23/1994 | EP0436588B1 Low stress polysilicon microstructures |
| 03/23/1994 | EP0401387B1 Process for producing single crystal |
| 03/23/1994 | EP0333838B1 GaAs ELECTRICAL CIRCUIT DEVICES WITH LANGMUIR-BLODGETT INSULATOR LAYER |
| 03/23/1994 | CN1084317A Silicon power triode core |
| 03/23/1994 | CN1084316A Semi conductor diffusion zone structure and its mfg. method |
| 03/22/1994 | US5297260 Processor having a plurality of CPUS with one CPU being normally connected to common bus |
| 03/22/1994 | US5297148 Memory card connectable to a computer system |
| 03/22/1994 | US5297104 Word line drive circuit of semiconductor memory device |
| 03/22/1994 | US5297102 Semiconductor memory device storing data and parity bit |