| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/22/2013 | CN103117234A Chip welding device |
| 05/22/2013 | CN103117233A Rotating curing |
| 05/22/2013 | CN103117232A Wafer-level packaging method and packaging structure thereof |
| 05/22/2013 | CN103117231A Wafer-level packaging method and packaging structure thereof |
| 05/22/2013 | CN103117230A Craft for double in-line package (DIP) rectifier bridge with high response |
| 05/22/2013 | CN103117229A Methods of fabricating electronics assemblies |
| 05/22/2013 | CN103117228A Manufacturing method for COB (chip on board) packaging aluminum substrate |
| 05/22/2013 | CN103117227A Production method of multi-grid fin field-effect tube |
| 05/22/2013 | CN103117226A Production method of alloy oxide thin-film transistor |
| 05/22/2013 | CN103117225A Production method preventing body effect in trench power MOS (metal oxide semiconductor) transistors |
| 05/22/2013 | CN103117224A Manufacturing method of thin film transistor and array substrate |
| 05/22/2013 | CN103117223A Metal oxide semiconductor (MOS) transistor lightly doped drain region manufacturing method |
| 05/22/2013 | CN103117222A Method of growing high electron mobility transistor (HEMT) device of GaAs materials in ART-structure groove |
| 05/22/2013 | CN103117221A High electron mobility transistor (HEMT) component and manufacture method thereof |
| 05/22/2013 | CN103117220A Removal method for super junction sacrificial oxide layer |
| 05/22/2013 | CN103117219A Morphology-controllable etching method |
| 05/22/2013 | CN103117218A Wafer back face thinning method |
| 05/22/2013 | CN103117217A Device improving copper mechanical milling efficiency |
| 05/22/2013 | CN103117216A Manufacture method for semiconductor component preventing unfilled corner from being generated in shallow groove isolation structure |
| 05/22/2013 | CN103117215A Forming method of metallic gate electrode layer |
| 05/22/2013 | CN103117214A Manufacture method of semiconductor device provided with metal grid lamination |
| 05/22/2013 | CN103117213A Metallic grid electrode forming method |
| 05/22/2013 | CN103117212A Laser annealing method for semiconductor device of complicated structure |
| 05/22/2013 | CN103117211A Method for improving surface resistance uniformity of wafer after laser annealing |
| 05/22/2013 | CN103117210A Novel self-assembly method of ordered Ge/Si quantum dot array by nano-pore replication and sputtering deposition |
| 05/22/2013 | CN103117209A Gradient AlGaN layer preparation method and device prepared by same |
| 05/22/2013 | CN103117208A Method of removing SiGe film on wafer |
| 05/22/2013 | CN103117207A Automatic positioning method of first grain |
| 05/22/2013 | CN103117202A Endpoint detection device and method of plasma treatment process |
| 05/22/2013 | CN103117201A Plasma enhanced chemical vapor deposition (PECVD) device and forming method of semiconductor component |
| 05/22/2013 | CN103114319A Method and device for realizing deep hole uniform metal interconnection on semiconductor silicon chip |
| 05/22/2013 | CN103113972A Efficient scribing liquid for interconnection encapsulation of chip copper |
| 05/22/2013 | CN103111698A Methods for performing reflow in bonding processes |
| 05/22/2013 | CN102420201B 硅通孔结构及其制造方法 TSV structure and manufacturing method |
| 05/22/2013 | CN102386239B Indium phosphide (InP)-based PIN switching diode of planar structure and preparation method of indium phosphide-based PIN switching diode |
| 05/22/2013 | CN102376779B SiC肖特基二极管及其制作方法 SiC Schottky diode and manufacturing method thereof |
| 05/22/2013 | CN102346125B Laboratory table for real-timely observing nanoparticle movement |
| 05/22/2013 | CN102339758B Method for manufacturing copper-ceramic substrate by adopting low-temperature bonding |
| 05/22/2013 | CN102315117B Etching method for Mo base/TaN metal grid lamination structure |
| 05/22/2013 | CN102290362B Method for correcting positioning error of wafer during laser processing |
| 05/22/2013 | CN102263047B Wafer thermal buffer stack and method for realizing thermal buffer |
| 05/22/2013 | CN102244104B Flat and lug combined bidirectional diode chip and manufacturing process thereof |
| 05/22/2013 | CN102235458B Active shock absorption and vibration isolation device |
| 05/22/2013 | CN102224592B p-type SiC semiconductor |
| 05/22/2013 | CN102214685B Semiconductor structure with suspended sources and drains as well as formation method thereof |
| 05/22/2013 | CN102214586B Preparation method of silicon nano-wire field-effect transistor |
| 05/22/2013 | CN102208414B Super-junction channel metal oxide semiconductor field effect transistor and manufacturing method thereof |
| 05/22/2013 | CN102208387B Circuit board for being connected with ball grid array packaging assembly and method for forming bonding pad structure |
| 05/22/2013 | CN102203955B Technique for manufacturing a solar cell |
| 05/22/2013 | CN102197493B Method of producing photoelectric conversion device, and film-forming apparatus |
| 05/22/2013 | CN102194693B Semiconductor device and manufacturing method thereof |
| 05/22/2013 | CN102187460B Multi-transistor memory cell |
| 05/22/2013 | CN102176435B Flexible type base plate structure and manufacturing method thereof |
| 05/22/2013 | CN102169814B Wafer laminator release liner protecting mechanism |
| 05/22/2013 | CN102160166B Substrate processing apparatus and substrate placing table |
| 05/22/2013 | CN102160158B Transistor with passive gate and methods of fabricating same |
| 05/22/2013 | CN102157375B Dual wavelength thermal flux laser anneal |
| 05/22/2013 | CN102150245B Film forming apparatus |
| 05/22/2013 | CN102144288B 半导体集成电路 The semiconductor integrated circuit |
| 05/22/2013 | CN102132414B Field-effect transistor, method for manufacturing same, and sputtering target |
| 05/22/2013 | CN102126612B Position correcting device |
| 05/22/2013 | CN102112651B Method for forming amorphous carbon nitride film, amorphous carbon nitride film, multilayer resist film and method for manufacturing semiconductor device |
| 05/22/2013 | CN102105971B Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein |
| 05/22/2013 | CN102077328B RF power delivery system in a semiconductor apparatus |
| 05/22/2013 | CN102067297B Adaptive clamp width adjusting device and integrated circuit processor including same |
| 05/22/2013 | CN102064175B Semiconductor structure and manufacturing method thereof |
| 05/22/2013 | CN101999168B Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 05/22/2013 | CN101996942B Semiconductor device and production method thereof |
| 05/22/2013 | CN101980358B Method for fabricating an isolation structure |
| 05/22/2013 | CN101958230B Substrate-pressing jig |
| 05/22/2013 | CN101916742B Active array substrate, liquid crystal display panel and manufacturing method thereof |
| 05/22/2013 | CN101894798B Fabrication method of semiconductor integrated circuit device |
| 05/22/2013 | CN101866874B Method for preparing silicon germanium on insulator (SGOI) by layer transfer technology |
| 05/22/2013 | CN101855596B Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device |
| 05/22/2013 | CN101852953B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacturing method thereof, as well as liquid crystal display panel |
| 05/22/2013 | CN101840886B Manufacturing method of semiconductor device |
| 05/22/2013 | CN101831632B Film deposition apparatus |
| 05/22/2013 | CN101814492B Integrated circuit having metal gate stacks and manufacture method thereof |
| 05/22/2013 | CN101807550B Array substrate and manufacturing method thereof and LCD monitor |
| 05/22/2013 | CN101779271B Structures of and methods for forming vertically aligned Si wire arrays |
| 05/22/2013 | CN101770958B Protective thin film coating in chip packaging |
| 05/22/2013 | CN101752399B Light emitting diode having a plurality of light emitting cells and method of fabricating the same |
| 05/22/2013 | CN101689530B Method for recycling a substrate, laminated wafer fabricating method and suitable recycled donor substrate |
| 05/22/2013 | CN101665921B Film deposition apparatus, substrate processing apparatus and film deposition method |
| 05/22/2013 | CN101663747B Ultra-thin chip packaging |
| 05/22/2013 | CN101657892B Specimen inspection stage implemented with processing stage coupling mechanism |
| 05/22/2013 | CN101619927B Multi-chamber type heat processing furnace |
| 05/22/2013 | CN101546685B Plasma processing apparatus and plasma etching method |
| 05/22/2013 | CN101539819B Display panel and method for manutacturing the same |
| 05/22/2013 | CN101539721B Frequency doubling using a photo-resist template mask |
| 05/22/2013 | CN101517623B Display device and method of producing display device |
| 05/22/2013 | CN101483151B Organic light emitting apparatus and forming method thereof |
| 05/22/2013 | CN101465329B Radiating plate for semiconductor package and electroplating method therefor |
| 05/22/2013 | CN101368267B Plasma CVD apparatus, manufacture of microcrystalline semiconductor layer and thin film transistor |
| 05/22/2013 | CN101330024B Resin sealing apparatus, movable member and resin sealing method |
| 05/22/2013 | CN101281879B Double-stage self-aligning contact window and manufacturing method thereof |
| 05/22/2013 | CN101266944B CMOS image sensor making method and system |
| 05/22/2013 | CN101202211B Substrate processing device and substrate conveying method |
| 05/22/2013 | CN101075045B Semi-transmissive type liquid-crystal display device and method of fabricating the same |
| 05/22/2013 | CN101064335B Organic electroluminescent device and its method of manufacture |