Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/22/2013CN202948965U Light emitting diode (LED) turning machine
05/22/2013CN202948963U Elevating mechanism of silicon wafer separator
05/22/2013CN202948911U Vacuum chuck device
05/22/2013CN202948910U Sucker with protective nozzle for crystal grain filling of component
05/22/2013CN202948909U A feeding apparatus used for delivering lead wire frames
05/22/2013CN202948908U Automatic discharging frame of novel crystal fixing machine
05/22/2013CN202948907U Substrate transmission robot arm
05/22/2013CN202948906U Device for modifying electronic elements and superficially characterizing electrical properties
05/22/2013CN202948905U High-flux semiconductor processing applying architecture
05/22/2013CN202948904U Image acquisition device based on optothermal imaging
05/22/2013CN202948903U 晶体管 Transistor
05/22/2013CN1931947B Adhesive composition for circuit connection
05/22/2013CN1643143B Compositions and methods for the detection, diagnosis and therapy of hematological malignancies
05/22/2013CN103120032A System and method for current-based plasma excursion detection
05/22/2013CN103120031A Reactive species supply device and surface treatment device
05/22/2013CN103120030A Reactive species supply device and device for treating surfaces and the like
05/22/2013CN103119733A Method for producing semiconductor substrate, semiconductor device, and electric apparatus
05/22/2013CN103119732A Light emitting diodes
05/22/2013CN103119724A Method for producing semiconductor components using doping techniques
05/22/2013CN103119720A Method for producing semiconductor device, and semiconductor device
05/22/2013CN103119718A Memory cell structures and methods
05/22/2013CN103119714A Chip-to-chip communications using sub-millimeter waves and dielectric waveguide
05/22/2013CN103119712A Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
05/22/2013CN103119709A Phase change memory structures and methods
05/22/2013CN103119708A Phase change memory structures and methods
05/22/2013CN103119707A Substrate-processing apparatus and substrate-transferring method
05/22/2013CN103119706A Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
05/22/2013CN103119705A Etch-resistant coating on sensor wafers for in-situ measurement
05/22/2013CN103119704A In-line metrology system and method
05/22/2013CN103119703A Integrated passives and power amplifier
05/22/2013CN103119702A Semiconductor chip device with polymeric filler trench
05/22/2013CN103119701A Liquid resin composition and semiconductor device
05/22/2013CN103119700A Liquid chemical deposition apparatus and process and products therefrom
05/22/2013CN103119699A Thin film transistor, manufacturing method therefor and image display device
05/22/2013CN103119698A Method of manufacturing semiconductor device
05/22/2013CN103119697A Thin film manufacturing method and thin film manufacturing apparatus
05/22/2013CN103119696A Thin film production process and thin film production device
05/22/2013CN103119695A Plasma-activated deposition of conformal films
05/22/2013CN103119694A Removal of masking material
05/22/2013CN103119693A Method for producing transistor
05/22/2013CN103119692A Smooth silicon-containing films
05/22/2013CN103119691A Photo-curable nanoimprint composition, method for forming pattern using the composition, and nanoimprint replica mold comprising cured product of composition
05/22/2013CN103119656A Nonvolatile semiconductor memory device
05/22/2013CN103119518A Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
05/22/2013CN103119517A Automated warehouse and article removal method
05/22/2013CN103119197A Amorphous silicon nitride film and method for producing same
05/22/2013CN103119196A Depositing conformal boron nitride films
05/22/2013CN103119195A Unit for the treatment of an object, in particular the surface of a polymer object
05/22/2013CN103119192A Film-forming apparatus
05/22/2013CN103119112A Adhesive film and wafer-processing tape
05/22/2013CN103118962A Transfer system
05/22/2013CN103118839A Wire saw
05/22/2013CN103118502A Mechanism facilitating installation of ball grid array (BGA) repair workstation hot wind nozzle
05/22/2013CN103117329A Heterojunction MWT (metal wrap through) battery and manufacturing method thereof and carrier boat
05/22/2013CN103117309A Horizontal power device structure and preparation method thereof
05/22/2013CN103117308A Groove MOSFET (metal-oxide-semiconductor field-effect transistor) power rectifier and manufacturing method thereof
05/22/2013CN103117306A Tunnel FET and methods for forming the same
05/22/2013CN103117304A Gallium nitride field effect transistor structure with composite space layer and manufacture method thereof
05/22/2013CN103117303A Nitride power device and manufacturing method thereof
05/22/2013CN103117301A Vertical parasitic P-type semiconductor N-type semiconductor P-type semiconductor (PNP) transistor in germanium-silicon hetero junction bipolar transistor (HBT) process and preparation method
05/22/2013CN103117300A Parasitically transversal type PNP device and manufacture method
05/22/2013CN103117299A Self-alignment bipolar transistor and preparation method thereof
05/22/2013CN103117298A Ohmic electrode structure of silicon carbide and manufacturing method thereof
05/22/2013CN103117297A Structure of semiconductor and manufacture process of semiconductor
05/22/2013CN103117296A Metallic oxide semiconductor transistor and forming method thereof
05/22/2013CN103117294A Nitride high-voltage device and manufacturing method thereof
05/22/2013CN103117293A 3-D nonvolatile memory devices and methods of manufacturing the same
05/22/2013CN103117285A Array substrate, display device and manufacturing method for array substrate
05/22/2013CN103117284A Array substrate and manufacturing method thereof and display device
05/22/2013CN103117283A Array substrate and manufacturing method thereof and display device
05/22/2013CN103117282A Three-dimensional non-volatile memory device, memory system including the same, and method of manufacturing the same
05/22/2013CN103117281A Semiconductor memory device and method of manufacturing the same
05/22/2013CN103117279A Method for forming chip-on-wafer assembly
05/22/2013CN103117275A Chip packaging structure and chip packaging method
05/22/2013CN103117269A Fuse wire assembly, fuse wire assembly manufacturing method and equipment
05/22/2013CN103117268A MOM capacitor having electrodes made from local interconnects and manufacturing method thereof
05/22/2013CN103117267A Semiconductor arrangement for galvanically isolated signal transmission and method for producing such an arrangement
05/22/2013CN103117266A Electric conduction plug and forming method
05/22/2013CN103117264A Wiring substrate and manufacturing method of the same
05/22/2013CN103117262A Electrical device with connection interface, circuit board thereof, and method for manufacturing the same
05/22/2013CN103117261A Package structures and methods for forming the same
05/22/2013CN103117256A Ceramic bonding copper substrate and manufacture method thereof
05/22/2013CN103117252A Method for three-dimensionally folding and packaging two-dimensional flexible package substrate
05/22/2013CN103117251A Preparing method for complementary metal oxide semiconductor (CMOS) field effect transistor
05/22/2013CN103117250A Methods for de-bonding carriers
05/22/2013CN103117249A Method for manufacturing passivation layer on pixel electrode, liquid crystal display and manufacturing method thereof
05/22/2013CN103117248A Array substrate and manufacture method thereof and display device
05/22/2013CN103117247A Forming method of semiconductor component
05/22/2013CN103117246A Manufacturing method of metal interconnection structure
05/22/2013CN103117245A Formation method of air-gap interconnection structure
05/22/2013CN103117244A Air gap forming method between integrated circuit (IC) interconnector and interlevel dielectric layer
05/22/2013CN103117243A Reverse tone STI formation
05/22/2013CN103117242A Installation fixture for elastomer bands and methods of using the same
05/22/2013CN103117241A Coating method in physical etching technology
05/22/2013CN103117240A Chip picking device
05/22/2013CN103117239A Navigating piece used for dry etching equipment and navigating method
05/22/2013CN103117238A Chip point-reverse device
05/22/2013CN103117237A Transfer device for diode arc-shaped pole piece
05/22/2013CN103117236A Producing process of imaging gold bump
05/22/2013CN103117235A Plasma-assisted bonding method