Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/23/2013US20130130488 Method of Patterning a Metal Gate of Semiconductor Device
05/23/2013US20130130487 Integrated Circuit with Metal and Semi-Conducting Gate
05/23/2013US20130130486 Method of forming silicide layers
05/23/2013US20130130485 Method for fabricating schottky device
05/23/2013US20130130484 Ion implanter and ion implant method thereof
05/23/2013US20130130483 Electro-static discharge protection device, semiconductor device, and method for manufacturing electro-static discharge protection device
05/23/2013US20130130482 Method for manufacturing silicon carbide semiconductor device
05/23/2013US20130130481 METHOD AND APPARATUS FOR ATOMIC HYDROGEN SURFACE TREATMENT DURING GaN EPITAXY
05/23/2013US20130130480 Method for manufacturing a semiconductor device
05/23/2013US20130130477 Method for producing gallium trichloride gas and method for producing nitride semiconductor crystal
05/23/2013US20130130476 Method for cleaning film formation apparatus and method for manufacturing semiconductor device
05/23/2013US20130130475 Vapor transport deposition method and system for material co-deposition
05/23/2013US20130130474 Quantum Well Device
05/23/2013US20130130473 Semiconductor on glass substrate with stiffening layer and process of making the same
05/23/2013US20130130472 Semiconductor chips having guard rings and methods of fabricating the same
05/23/2013US20130130471 Manufacturing method of vertical channel transistor array
05/23/2013US20130130469 Variable-resistance material memories, processes of forming same, and methods of using same
05/23/2013US20130130468 Method For Fabricating Passive Devices For 3D Non-Volatile Memory
05/23/2013US20130130463 Manufacturing method of charging capacity structure
05/23/2013US20130130460 Semiconductor device and fabrication method thereof
05/23/2013US20130130458 Method of manufacturing semiconductor device
05/23/2013US20130130457 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
05/23/2013US20130130455 Method of manufacturing semiconductor device
05/23/2013US20130130449 Strain enhancement in transistors comprising an embedded strain-inducing semiconductor alloy by creating a patterning non-uniformity at the bottom of the gate electrode
05/23/2013US20130130448 METHOD FOR FORMING AND CONTROLLING MOLECULAR LEVEL SiO2 INTERFACE LAYER
05/23/2013US20130130446 Transistor employing vertically stacked self-aligned carbon nanotubes
05/23/2013US20130130444 Chip package and fabrication method thereof
05/23/2013US20130130443 Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process
05/23/2013US20130130442 Method of manufacturing a semiconductor device
05/23/2013US20130130441 Chip-scale semiconductor die packaging method
05/23/2013US20130130440 Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
05/23/2013US20130130439 Formed metallic heat sink substrate, circuit system, and fabrication methods
05/23/2013US20130130425 Method and Machine for Producing a Semiconductor, of the Photovoltaic or Similar Electronic Component Type
05/23/2013US20130130424 Process for minimizing chipping when separating mems dies on a wafer
05/23/2013US20130130416 Method of fabricating a micro device transfer head
05/23/2013US20130130415 Methods of testing integrated circuit devices using fuse elements
05/23/2013US20130130414 High productivity combinatorial workflow for photoresist strip applications
05/23/2013US20130130413 Apparatus and method for in-situ endpoint detection for semiconductor processing operations
05/23/2013US20130130411 Interleaf for Leadframe Identification
05/23/2013US20130130410 Method for metal correlated via split for double patterning
05/23/2013US20130130409 Etch rate detection for reflective multi-material layers etching
05/23/2013US20130130408 Manufacturing method for semiconductor integrated device
05/23/2013US20130130405 Apparatus and methods for silicon oxide cvd resist planarization
05/23/2013US20130130053 Metal Plating Using Seed Film
05/23/2013US20130130001 Laminate film, and film for use in production of semiconductor comprising same
05/23/2013US20130129050 Semiconductor Device and Method of Driving the Same
05/23/2013US20130128677 Dynamic random access memory device with improved control circuitry for the word lines
05/23/2013US20130128649 Memory cells, semiconductor devices including such cells, and methods of fabrication
05/23/2013US20130128488 Lithium Battery, Method for Manufacturing a Lithium Battery, Integrated Circuit and Method of Manufacturing an Integrated Circuit
05/23/2013US20130128409 Peripheral RF Feed and Symmetric RF Return for Symmetric RF Delivery
05/23/2013US20130128362 Micro/nano combined structure, manufacturing method of micro/nano combined structure, and manufacturing method of an optical device having a micro/nano combined structure integrated therewith
05/23/2013US20130128270 Lateral shift measurement using an optical technique
05/23/2013US20130128256 Lithographic apparatus and device manufacturing method
05/23/2013US20130128244 Exposure Apparatus and Device Manufacturing Method Having Lower Scanning Speed to Expose Peripheral Shot Area
05/23/2013US20130128199 Methods for fabricating a semiconductor device
05/23/2013US20130128169 LCD Device, LCD Module and Manufacturing Method Thereof
05/23/2013US20130127879 Glass-encapsulated pressure sensor
05/23/2013US20130127694 Amorphous oxide semiconductor thin film transistor fabrication method
05/23/2013US20130127364 Front facing piggyback wafer assembly
05/23/2013US20130127295 Piezoelectric micro power generator and fabrication method thereof
05/23/2013US20130127065 Cmut devices and fabrication methods
05/23/2013US20130127064 Method and apparatus to improve reliability of vias
05/23/2013US20130127063 Semiconductor device heat dissipation structure
05/23/2013US20130127060 Under bump passives in wafer level packaging
05/23/2013US20130127059 Adjusting Sizes of Connectors of Package Components
05/23/2013US20130127058 Liner-free tungsten contact
05/23/2013US20130127055 Mechanisms of forming damascene interconnect structures
05/23/2013US20130127052 Methods and Apparatus of Packaging Semiconductor Devices
05/23/2013US20130127047 Conductive structure and method for forming the same
05/23/2013US20130127046 Reduced susceptibility to electrostatic discharge during 3d semiconductor device bonding and assembly
05/23/2013US20130127045 Mechanisms for forming fine-pitch copper bump structures
05/23/2013US20130127044 Micro surface mount device packaging
05/23/2013US20130127043 Micro surface mount device packaging
05/23/2013US20130127042 Semiconductor Device and Method of Forming Conductive Layer Over Substrate with Vents to Channel Bump Material and Reduce Interconnect Voids
05/23/2013US20130127039 Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface
05/23/2013US20130127036 Novel mechanism for mems bump side wall angle improvement
05/23/2013US20130127035 Thick bond pad for chip with cavity package
05/23/2013US20130127032 Semiconductor device and manufacturing method thereof
05/23/2013US20130127031 Chip-carrier, a method for forming a chip-carrier and a method for forming a chip package
05/23/2013US20130127030 Semiconductor device packaging having substrate with pre-encapsulation through via formation
05/23/2013US20130127029 Two level leadframe with upset ball bonding surface and device package
05/23/2013US20130127025 Semiconductor package and manufacturing method thereof
05/23/2013US20130127023 Method for producing a graphene sheet on a platinum silicide, structures obtained using said method and uses thereof
05/23/2013US20130127021 Methods for adhering materials, for enhancing adhesion between materials, and for patterning materials, and related semiconductor device structures
05/23/2013US20130127018 Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure
05/23/2013US20130127017 Bipolar Junction Transistor For Current Driven Synchronous Rectifier
05/23/2013US20130127014 Hermetic packaging of integrated circuit components
05/23/2013US20130127012 Semiconductor Devices and Methods of Manufacturing the Same
05/23/2013US20130127009 Defected ground plane inductor
05/23/2013US20130127008 Thermally efficient integrated circuit package
05/23/2013US20130127006 Gan-based schottky barrier diode with field plate
05/23/2013US20130126998 Radiation detectors and methods of fabricating radiation detectors
05/23/2013US20130126995 Semiconductor memory device and method of manufacturing the same
05/23/2013US20130126993 Electromechanical transducer and method of producing the same
05/23/2013US20130126990 Sensor manufacturing method and microphone structure made by using the same
05/23/2013US20130126988 Semiconductor sensor device with footed lid
05/23/2013US20130126987 Physical quantity sensor and method of making the same
05/23/2013US20130126986 Germanium oxide free atomic layer deposition of silicon oxide and high-k gate dielectric on germanium containing channel for cmos devices
05/23/2013US20130126985 (110) surface orientation for reducing fermi-level-pinning between high-k dielectric and group iii-v compound semiconductor substrate
05/23/2013US20130126984 Patterning of Sensitive Metal-Containing Layers With Superior Mask Material Adhesion by Providing a Modified Surface Layer
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