Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/30/2013WO2013078465A1 Bypass capacitors for high voltage bias power in the mid frequency rf range
05/30/2013WO2013078434A1 Plasma processing chamber with flexible symmetric rf return strap
05/30/2013WO2013078420A2 Symmetric rf return path liner
05/30/2013WO2013078346A1 Peripheral rf feed and symmetric rf return for symmetric rf delivery
05/30/2013WO2013078341A1 Enhancement-mode group iii-n high electronic mobility transistor with reverse polarization cap
05/30/2013WO2013078267A1 Semiconductor device with low-conducting buried and/or surface layers
05/30/2013WO2013078249A1 Method of making quantum dots
05/30/2013WO2013078245A1 Method of making quantum dots
05/30/2013WO2013078239A1 Spectral matching based calibration
05/30/2013WO2013078219A1 Method of growing high quality, thick sic epitaxial films by eliminating silicon gas phase nucleation and suppressing parasitic deposition
05/30/2013WO2013078211A1 Assist layers for euv lithography
05/30/2013WO2013078152A1 Peripheral rf feed and symmetric rf return with rf strap input
05/30/2013WO2013078141A1 Processing for electromechanical systems and equipment for same
05/30/2013WO2013078136A1 Semiconductor substrate and method of forming
05/30/2013WO2013078066A1 Radiation shielding for a substrate holder
05/30/2013WO2013078065A1 Chamber sealing member
05/30/2013WO2013077994A1 Apparatus and methods for improving reliability of rf grounding
05/30/2013WO2013077988A1 Etch rate detection for reflective multi-material layers etching
05/30/2013WO2013077984A1 Triode reactor design with multiple radiofrequency powers
05/30/2013WO2013077975A1 Plasma processing of metal oxide films for resistive memory device applications
05/30/2013WO2013077954A1 Improving metal contacts to group iv semiconductors by inserting interfacial atomic monolayers
05/30/2013WO2013077671A1 Test socket provided with stopper portion
05/30/2013WO2013077580A1 Etchant composition for copper/molybdenum alloy film
05/30/2013WO2013077564A1 Probe card comprising signal branch substrate
05/30/2013WO2013077430A1 Reflective mask blank for euv lithography and production method thereof
05/30/2013WO2013077386A1 Imprinting device and imprinting method
05/30/2013WO2013077372A1 Polishing composition
05/30/2013WO2013077371A1 Polishing composition
05/30/2013WO2013077370A1 Polishing composition
05/30/2013WO2013077369A1 Polishing composition
05/30/2013WO2013077368A1 Polishing composition
05/30/2013WO2013077322A1 Work transfer system
05/30/2013WO2013077321A1 Apparatus for manufacturing semiconductor device, method for manufacturing semiconductor device, and recoding medium
05/30/2013WO2013077289A1 Film forming device and method for installing vaporizer
05/30/2013WO2013077266A1 Thermally reactive resist material, method for producing mold, mold, developing method, and pattern-forming material
05/30/2013WO2013077261A1 Concentration control method and concentration control device
05/30/2013WO2013077191A1 Processing device group controller, manufacturing process system, processing device group control method, manufacturing optimization system, manufacturing optimization device, and manufacturing optimization method
05/30/2013WO2013077188A1 Production processing system, control device for production processing, method for controlling production processing and control program for production processing
05/30/2013WO2013077145A1 Pressurization disc, bonding device, and bonding method
05/30/2013WO2013077144A1 Semiconductor package and method for manufacturing same
05/30/2013WO2013077125A1 Defect inspection method and device for same
05/30/2013WO2013077098A1 Cadmium telluride powder for solar cells, cadmium telluride film for solar cells, and solar cell
05/30/2013WO2013077089A1 Method for manufacturing silicon carbide semiconductor device
05/30/2013WO2013077078A1 Semiconductor device and method for manufacturing same
05/30/2013WO2013077075A1 Semiconductor substrate etching method and etching device
05/30/2013WO2013077068A1 Method for manufacturing semiconductor device
05/30/2013WO2013077066A1 Imprinting mold and manufacturing method therefor
05/30/2013WO2013077064A1 Silicon carbide semiconductor device and method for manufacturing same
05/30/2013WO2013076966A1 Plasma generation source and vacuum plasma processing apparatus provided with same
05/30/2013WO2013076932A1 Production method for circuit device
05/30/2013WO2013076928A1 Nonvolatile latch circuit, nonvolatile flip-flop circuit and nonvolatile signal processing device
05/30/2013WO2013076905A1 Band saw cutting device and ingot cutting method
05/30/2013WO2013076895A1 Flip chip bonding device
05/30/2013WO2013076890A1 Semiconductor device and method for manufacturing same
05/30/2013WO2013076874A1 Wafer transport apparatus and wafer assembly line
05/30/2013WO2013076799A1 Delay measurement device, method, and program for electronic circuit, as well as medium
05/30/2013WO2013076647A1 Device and method for processing wafer shaped articles
05/30/2013WO2013076543A2 Method for preventing an electrical shortage in a semiconductor layer stack, thin substrate cpv cell, and solar cell assembly
05/30/2013WO2013076064A1 Method for making contact with a semiconductor and contact arrangement for a semiconductor
05/30/2013WO2013075952A1 Aqueous composition for etching of copper and copper alloys
05/30/2013WO2013075947A1 Semiconductor device with through-substrate via covered by a solder ball and related method of production
05/30/2013WO2013075712A1 Solid body surfaces from two and multiple material systems with composite nanostructures from metals, semiconductors or insulators
05/30/2013WO2013075650A1 Encapsulation method for image sensor chip and camera module
05/30/2013WO2013075591A1 Array substrate, preparing method thereof and display device
05/30/2013WO2013075424A1 Method for forming and controlling molecular scale interface sio2
05/30/2013WO2013075405A1 Method for preparing superfine line
05/30/2013WO2013075390A1 Hydride vapor phase epitaxy device
05/30/2013WO2013075384A1 Ball grid array (bga) packaging structures and method for manufacruring the same
05/30/2013WO2013075383A1 Quad flat no-lead (qfn) packaging structures and method for manufacturing the same
05/30/2013WO2013075375A1 Copper interconnect structure and method for manufacturing the same
05/30/2013WO2013075349A1 Semiconductor structure and method for manufacturing same
05/30/2013WO2013075209A1 Oxidation of metallic films
05/30/2013WO2013052215A3 Substrate containing aperture and methods of forming the same
05/30/2013WO2013051877A3 Vacuum processing apparatus having a means for preventing counter-pressure between chambers
05/30/2013WO2013046050A3 Dry cleaning method for recovering etch process condition
05/30/2013WO2013045367A3 Electronic assembly comprising a high temperature-stable substrate basic material, method for the production thereof and use thereof in a power electronics
05/30/2013WO2013045345A3 Layer composite for connecting electronic components, comprising a compensation layer, bonding layers and connection layers, method for making same, and circuit arrangement containing same
05/30/2013WO2013042959A3 Vacuum drying apparatus
05/30/2013WO2013025072A3 Device for manufacturing semiconductor or metallic oxide ingot
05/30/2013WO2013024971A3 Cmp slurry composition for tungsten polishing
05/30/2013WO2013021869A9 Novel cyanic acid ester compound, method for producing same, curable resin composition containing novel cyanic acid ester compound, and cured product of curable resin composition
05/30/2013WO2013019541A4 Low-stress vias
05/30/2013WO2013016273A3 High voltage mosfet and method of making the same
05/30/2013WO2013013959A3 High-voltage transistor component and production method
05/30/2013WO2012152672A3 Method for producing reconstituted wafers with support of the chips during their encapsulation
05/30/2013WO2012061436A4 Dry etching method of surface texture formation on silicon wafer
05/30/2013US20130137279 Exhaust Unit, Substrate Processing Apparatus, and Method of Manufacturing Semiconductor Device
05/30/2013US20130137278 Texture-etchant composition for crystalline silicon wafer and method for texture-etching (2)
05/30/2013US20130137277 Critical Concentration in Etching Doped Poly Silicon With HF/HNO3
05/30/2013US20130137276 Method and apparatus for preventing native oxide regrowth
05/30/2013US20130137275 Methods for selective etching of a multi-layer substrate
05/30/2013US20130137274 Substrate processing method
05/30/2013US20130137273 Semiconductor Processing System
05/30/2013US20130137272 Method of manufacturing semiconductor device and substrate processing apparatus
05/30/2013US20130137271 Silicon-containing resist underlayer film-forming composition and patterning process
05/30/2013US20130137270 Method for forming contact hole
05/30/2013US20130137269 Patterning method for fabrication of a semiconductor device
05/30/2013US20130137268 Method for pattern formation
05/30/2013US20130137267 Methods for Atomic Layer Etching
05/30/2013US20130137266 Manufacturing techniques to limit damage on workpiece with varying topographies
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