Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/23/2013US20130126979 Integrated circuits with electrical fuses and methods of forming the same
05/23/2013US20130126978 Circuits with linear finfet structures
05/23/2013US20130126977 N/p boundary effect reduction for metal gate transistors
05/23/2013US20130126976 Selective partial gate stack for improved device isolation
05/23/2013US20130126973 Semiconductor device and method of manufacturing the same
05/23/2013US20130126972 Semiconductor device and method for fabricating the same
05/23/2013US20130126967 Semiconductor device and manufacturing method thereof
05/23/2013US20130126965 Semiconductor device and method for fabricating the same
05/23/2013US20130126962 Semiconductor device and method of manufacturing the same
05/23/2013US20130126959 Semiconductor device and method of manufacturing semiconductor device
05/23/2013US20130126955 Methods and Apparatus for Hybrid MOS Capacitors in Replacement Gate Process
05/23/2013US20130126954 Dynamic Random Access Memory Array and Method of Making
05/23/2013US20130126953 Methods and Apparatus for MOS Capacitors in Replacement Gate Process
05/23/2013US20130126952 Solid-state imaging device and method of manufacturing the same, and imaging apparatus
05/23/2013US20130126950 Semiconductor Device and Method of Formation
05/23/2013US20130126949 Mos device and method for fabricating the same
05/23/2013US20130126946 III-V Compound Semiconductor Epitaxy From a Non-III-V Substrate
05/23/2013US20130126944 Heterojunction bipolar transistor with epitaxial emitter stack to improve vertical scaling
05/23/2013US20130126929 Method for manufacturing nano-imprint mould, method for manufacturing light-emitting diode using the nano imprint mould manufactured thereby, and light-emitting diode manufactured thereby
05/23/2013US20130126916 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package
05/23/2013US20130126909 Electronic field effect devices and methods for their manufacture
05/23/2013US20130126907 Group iii nitride semiconductor device and method for manufacturing the same
05/23/2013US20130126906 Silicon carbide epitaxial wafer and manufacturing method therefor, silicon carbide bulk substrate for epitaxial growth and manufacturing method therefor and heat treatment apparatus
05/23/2013US20130126904 Silicon carbide semiconductor device and method for manufacturing the same
05/23/2013US20130126903 DIAMOND GaN DEVICES AND ASSOCIATED METHODS
05/23/2013US20130126893 Semiconductor device and method of manufacturing semiconductor device
05/23/2013US20130126892 P-Type Amorphous GaNAs Alloy as Low Resistant Ohmic Contact to P-Type Group III-Nitride Semiconductors
05/23/2013US20130126889 Manufacturable Enhancement-Mode Group III-N HEMT with a Reverse Polarization Cap
05/23/2013US20130126888 Edge Termination by Ion Implantation in GaN
05/23/2013US20130126886 Gan-based schottky barrier diode with algan surface layer
05/23/2013US20130126885 Method and system for fabricating floating guard rings in gan materials
05/23/2013US20130126884 Aluminum gallium nitride etch stop layer for gallium nitride bases devices
05/23/2013US20130126882 Thin film transistor array substrate, organic light emitting display device comprising the same, and method of manufacturing the same
05/23/2013US20130126880 Method Of Forming Polysilicon, Thin Film Transistor Using The Polysilicon, And Method Of Fabricating The Thin Film Transistor
05/23/2013US20130126873 Thin Film Transistor, Fabrication Method Thereof, and Organic Light Emitting Diode Display Having the Same
05/23/2013US20130126870 Thin Film Transistor, Array Substrate, Device and Manufacturing Method
05/23/2013US20130126868 Semiconductor element, method for manufacturing semiconductor element, and semiconductor device including semiconductor element
05/23/2013US20130126867 High yield substrate assembly
05/23/2013US20130126866 Semiconductor device and manufacturing method thereof
05/23/2013US20130126865 Graphene epitaxied on sic, with an open band gap and mobility comparable to standard graphene with zero band gap
05/23/2013US20130126864 Semiconductor junction element, semiconductor device using it, and manufacturing method of semiconductor junction element
05/23/2013US20130126861 Insulating film, formation method thereof, semiconductor device, and manufacturing method thereof
05/23/2013US20130126860 Thin film transistor substrate
05/23/2013US20130126830 Transistor employing vertically stacked self-aligned carbon nanotubes
05/23/2013US20130126823 Memory device including transistor array with shared plate channel and method for making the same
05/23/2013US20130126822 Method Arrays and Methods of Forming Memory Cells
05/23/2013US20130126819 Memory device having vertical selection transistors with shared channel structure and method for making the same
05/23/2013US20130126818 Resistive random access memory (rram) using stacked dielectrics and method for manufacturing the same
05/23/2013US20130126817 E-fuses containing at least one underlying tungsten contact for programming
05/23/2013US20130126816 Memory Arrays and Methods of Forming Memory Cells
05/23/2013US20130126573 Method of material processing by laser filamentation
05/23/2013US20130126508 Extending Radiation Tolerance By Localized Temperature Annealing Of Semiconductor Devices
05/23/2013US20130126491 Method and Device for Machining a Workpiece by Means of a Laser
05/23/2013US20130126331 Guided Wave Applicator with Non-Gaseous Dielectric for Plasma Chamber
05/23/2013US20130126093 Gas supply system, substrate processing apparatus and gas supply method
05/23/2013US20130125972 Method for fabricating p-type semiconductor substrate, solar cell and method for fabricating the same
05/23/2013US20130125923 Method for cleaning platinum residues on a semiconductor substrate
05/23/2013DE112007000175B4 Feldeffekttransistor eines Mehrfingertyps Field effect transistor of a multi-finger type
05/23/2013DE102012221387A1 Transistor mit vertikal gestapelten Selbstausgerichteten Kohlenstoff-Nanoröhren Transistor having vertically stacked self-aligned carbon nanotubes
05/23/2013DE102012220314A1 Transparenter Kohlenstoff-Nanoröhren-Graphen-Hybridleiter und Feldeffekttransistor Transparent carbon nanotube-graphene hybrid circuit and field effect transistor
05/23/2013DE102012204455A1 (110)-Oberflächenorientierung zum Reduzieren eines Fermi-Level-Pinnings zwischen einem HIGH-K Dielektrikum und einer Gruppe III-V Verbindungshalbleitervorrichtung (110) surface orientation to reduce a Fermi-level pinning between a high-k dielectric and a group III-V compound semiconductor device
05/23/2013DE102012111177A1 Chipträger, Verfahren zum Bilden eines Chipträgers und Verfahren zum Bilden eines Chipgehäuses Chip carrier, method of forming a chip carrier and method of forming a chip package
05/23/2013DE102012110060A1 Making semiconductor structure, comprises forming first opening in dielectric layer, forming opening in dielectric material, forming seed layer within first opening, forming masking layer, and forming fill layer over seed layer
05/23/2013DE102012003545A1 Unter-höcker-passivstrukturen bei wafer level packaging Under-bump-passive structures at wafer level packaging
05/23/2013DE102011118906A1 Roller transportation system for e.g. complete automation of transport processes in inline wet chemical plant for manufacturing silicon solar cell, has liquid deflection device for preventing liquid movement from basin wall along roller
05/23/2013DE102011090169A1 Strukturierung empfindlicher metallenthaltender Schichten mit erhöhter Maskenmaterialhaftung durch Bereitstellen einer modifizierten Oberflächenschicht Structuring sensitive metal-containing layers with increased mask material liability by providing a modified surface layer
05/23/2013DE102011086689A1 Verfahren zum herstellen eines opto-elektronischen bauelements und opto-elektronisches bauelement A method of manufacturing an opto-electronic component and opto-electronic component
05/23/2013DE102011086687A1 Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter A method for contacting a semiconductor and contact arrangement for a semiconductor
05/23/2013DE102011086610A1 Method for manufacturing silicon carbide semiconductor element e.g. MOSFET, involves doping the channel region by performing ion implantation through openings of lower mask layer
05/23/2013DE102011055604A1 Funktionalisierte Festkörperoberflächen von Metallen, Halbleitern und Isolatoren mit Nanostrukturen Functionalized solid surfaces of metals, semiconductors and insulators with nanostructures
05/23/2013DE102009051008B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
05/23/2013DE102009025242B4 Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe Method for two-sided chemical grinding a semiconductor wafer
05/23/2013DE102008056195B4 Verfahren zum Herstellen einer Epitaxieschicht und Verfahren zum Herstellen eines Halbleiterbeuelements A method of manufacturing an epitaxial layer and method for manufacturing a Halbleiterbeuelements
05/23/2013DE102008054306B4 Herstellungsverfahren für harzabgedichtete Halbleitervorrichtung Manufacturing process for harzabgedichtete semiconductor device
05/23/2013DE102007002423B4 Verfahren zum Ausbilden von Polysiliziumgebieten und Verwendung A method of forming polysilicon areas and using
05/23/2013DE102004032184B4 Laserstrahlbearbeitungsverfahren und Laserstrahlbearbeitungsmaschine bzw. -vorrichtung Laser beam machining method and laser processing machine
05/23/2013CA2856015A1 Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
05/22/2013EP2595182A1 Protective treatment for porous materials
05/22/2013EP2595181A1 Compound semiconductor device and process for production thereof
05/22/2013EP2595180A1 Etching method
05/22/2013EP2595179A1 Dry etching agent and dry etching method
05/22/2013EP2595178A2 Air knife chamber having shield member
05/22/2013EP2595177A2 Lattice-mismatched semiconductor structures with reduced dislocation defect densities related methods for device fabrication
05/22/2013EP2595176A2 Lattice-mismatched semiconductor structures with reduced dislocation defect densities related methods for device fabrication
05/22/2013EP2595175A2 Lattice-mismatched semiconductor structures with reduced dislocation defect densities related methods for device fabrication
05/22/2013EP2594882A1 Vertical Heat Treating Furnace
05/22/2013EP2594666A1 Method for producing aluminum nitride crystals
05/22/2013EP2594662A1 Aqueous composition for etching of copper and copper alloys
05/22/2013EP2594340A1 Surface treatment apparatus
05/22/2013EP2593971A2 Neutron detector with wafer-to-wafer bonding
05/22/2013EP2593967A1 Conductivity modulation in a silicon carbide bipolar junction transistor
05/22/2013EP2593964A2 Aqueous cleaner for the removal of post-etch residues
05/22/2013EP2593963A1 Semiconductor component, substrate and method for producing a semiconductor layer sequence
05/22/2013EP2593592A2 Separation of master electrode and substrate in ecpr
05/22/2013EP2593591A1 Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore
05/22/2013EP2593590A1 System for automated handling of masters and substrate
05/22/2013EP2593588A1 A contact sheet for arrangement between a chuck and a master electrode in an ecpr process
05/22/2013EP2593586A1 A chuck, and a method for bringing a first and a second substrate together
05/22/2013EP2593585A1 Leveling of master electrode and substrate in ecpr, and a chuck therefor
05/22/2013EP2593580A1 Process chamber pressure control system and method