Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/16/2013DE112008003337B4 Eigenschaftsanalysegerät Feature analyzer
05/16/2013DE112008003262B4 Prüfvorrichtung und Prüfverfahren für Substratoberflächen Tester and test methods for substrate surfaces
05/16/2013DE10295972B4 Nicht in einer Form hergestellte Packung für eine Halbleiteranordnung und Verfahren zur Herstellung Not manufactured in a mold package for a semiconductor device and method for producing
05/16/2013DE102012110961A1 Gehäuse für eine Chipanordnung und Verfahren zum Herstellen eines Gehäuses A housing for a chip arrangement and method for manufacturing a housing
05/16/2013DE102012109941A1 Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterfertigungssystem A process for producing a semiconductor device, and semiconductor manufacturing system
05/16/2013DE102012108116A1 Messvorrichtung und Verfahren zum Messen einer Chip-zu-Chip-Träger-Verbindung Measuring apparatus and method for measuring a chip-to-chip-carrier connection
05/16/2013DE102012102783A1 Rippenfeldeffekttransistoren und Verfahren zur Herstellung derselben Ribs field effect transistors and methods for producing same
05/16/2013DE102011118561A1 Preparing or cutting of silicon wafers from silicon ingot which is crystallized by specific crystallization method
05/16/2013DE102011118441A1 Plant, useful for continuously treating flat substrates, comprises bath container, which is filled up to fluid level with liquid treatment medium, transport device, by which substrates are guided by guiding elements, and inflow elements
05/16/2013DE102011086351A1 Verfahren zur Herstellung einer Solarzelle mit PECVD-Kombinationsschicht und Solarzelle mit PECVD-Kombinationsschicht A method for manufacturing a solar cell with PECVD layer and combination solar cell with PECVD layer combination
05/16/2013DE102011079833B4 Verfahren zur Bildung einer vergrabenen Ätzstoppschicht in einem Transistor mit eingebettetem verformungsinduzierenden Material, das in Aussparungen mit geneigten Seitenwänden hergestellt ist, und Halbleiterbauelement A method of forming a buried etch stop layer in a transistor with an embedded strain-inducing material which is prepared in recesses with inclined side walls, and the semiconductor component
05/16/2013DE102009044474B4 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
05/16/2013DE102007027378B4 Verfahren zur Herstellung eines elektronischen Bauelements A method of manufacturing an electronic component
05/16/2013DE102007015295B4 Leistungshalbleiterbauelement mit Temperatursensor und Verfahren zur Herstellung eines Leistungshalbleiterbauelements mit einem integrierten Temperatursensor Power semiconductor component with the temperature sensor and method for manufacturing a power semiconductor device with an integrated temperature sensor
05/16/2013DE102007012986B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
05/16/2013DE102006012007B4 Leistungshalbleitermodul mit oberflächenmontierbaren flachen Außenkontakten und Verfahren zur Herstellung desselben und dessen Verwendung The power semiconductor module of the same with flat outer surface mount contacts and methods of making and use thereof
05/16/2013DE102005011159B4 Halbleiterbauteil mit oberflächenmontierbaren Außenkontaktflächen und Verfahren zur Herstellung desselben Of the same semiconductor device with surface-mountable external contact surfaces and methods for preparing
05/16/2013DE102005002526B9 Wärmeunterstützte Magnetspeichervorrichtung mit gesteuerter Temperatur Heat-assisted magnetic memory device with controlled temperature
05/16/2013DE102004057764B4 Verfahren zur Herstellung eines Substrats mit kristallinen Halbleitergebieten mit unterschiedlichen Eigenschaften, die über einem kristallinen Vollsubstrat angeordnet sind und damit hergestelltes Halbleiterbauelement A method for producing a substrate having crystalline semiconductor regions with different properties, which are arranged over a crystalline solid substrate, and thus semiconductor component produced
05/16/2013DE102004040765B4 Halbleiterspeicher und Verfahren zur Herstellung des Halbleiterspeichers A semiconductor memory and method of manufacturing the semiconductor memory
05/15/2013EP2592910A1 Atomic flux measurement device
05/15/2013EP2592658A1 Panel, panel production method, solar cell module, printing device and printing method
05/15/2013EP2592655A1 Fabrication of single or multiple gate field plates
05/15/2013EP2592649A1 Methods, structures and designs for self-aligning local interconnects used in integrated circuits
05/15/2013EP2592648A1 Methods, structures and designs for self-aligning local interconnects used in integrated circuits
05/15/2013EP2592647A1 Manufacturing method for channel plate, channel plate, temperature adjustment plate, cold plate, and shower plate
05/15/2013EP2592646A2 Etching Apparatus and Methods
05/15/2013EP2592476A1 Antireflective coating forming composition containing vinyl ether compound and polyimide
05/15/2013EP2592178A1 Processing method for photochemical/electrochemical planishing-polishing in nano-precision and device thereof
05/15/2013EP2592131A2 Aqueous cerium-containing solution having an extended bath lifetime for removing mask material
05/15/2013EP2592126A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
05/15/2013EP2592122A1 Polishing liquid for polishing process based on metal co and use thereof
05/15/2013EP2591506A1 Microelectronic device having metal interconnection levels connected by programmable vias
05/15/2013EP2591501A1 Microelectronic package with dual or multiple - etched flip -chip connectors and corresponding manufacturing method
05/15/2013EP2591499A1 Radiation-hardened roic with tdi capability, multi-layer sensor chip assembly and method for imaging
05/15/2013EP2591498A1 Method for assembling a chip in a flexible substrate
05/15/2013EP2591497A2 Method to form solder deposits on substrates
05/15/2013EP2591496A1 Symmetric ldmos transistor and method of production
05/15/2013EP2591495A1 Method and device for producing an edge structure of a semiconductor component
05/15/2013CN202940265U Crystal silicon solar cell for epicyclic vehicle
05/15/2013CN202940264U Silicon chip polishing system
05/15/2013CN202940239U Multi-transistor structure and semiconductor device with same
05/15/2013CN202940224U Vacuum chuck
05/15/2013CN202940223U Silicon wafer lifting module
05/15/2013CN202940222U Transfer device for solar cells
05/15/2013CN202940221U Quartz boat for diffusion
05/15/2013CN202940220U Bearing frame for silicon chip velvet preparation
05/15/2013CN202940219U Quartz boat
05/15/2013CN202940218U Die bonding equipment
05/15/2013CN202933910U Blanking and sheet-loading device of poly-crystal washing machine
05/15/2013CN103109379A Neutron detector with wafer-to-wafer bonding
05/15/2013CN103109372A Method for manufacturing semiconductor device and method for growing graphene
05/15/2013CN103109371A Integrated fin-based field effect transistor (FINFET) and method of fabrication of same
05/15/2013CN103109369A Semiconductor device
05/15/2013CN103109367A Stackable molded microelectronic packages
05/15/2013CN103109365A Seed layer deposition in microscale features
05/15/2013CN103109364A Plate glass conveyance device and chamfering device provided with same
05/15/2013CN103109363A Vacuum processing device
05/15/2013CN103109362A Integrated circuits with through-substrate vias
05/15/2013CN103109360A Thin film transistor array fabrication method, thin film transistor array, and display device
05/15/2013CN103109359A Transparent reflector plate for rapid thermal processing chamber
05/15/2013CN103109358A Embedded catalyst for atomic layer deposition of silicon oxide
05/15/2013CN103109357A Quartz showerhead for nanocure uv chamber
05/15/2013CN103109356A Silicon etching fluid and method for producing transistor using same
05/15/2013CN103109355A Polishing pad for CMP
05/15/2013CN103109354A Method for manufacturing electronic component
05/15/2013CN103109353A Dicing / die bonding integral film, dicing / die bonding integral film manufacturing method, and semiconductor chip manufacturing method
05/15/2013CN103109352A Pecvd oxide-nitride and oxide-silicon stacks for 3d memory application
05/15/2013CN103109351A Epitaxial substrate for semiconductor element, method for producing epitaxial substrate for semiconductor element, and semiconductor element
05/15/2013CN103109350A Methods for processing a semiconductor wafer, a semiconductor wafer and a semiconductor device
05/15/2013CN103109349A Microelectronic elements with rear contacts connected with via first or via middle structures
05/15/2013CN103108992A Texture-etchant composition for crystalline silicon wafer and method for texture-etching (2)
05/15/2013CN103108945A Processes and compositions for removing substances from substrates
05/15/2013CN103108929A Adhesive composition and semiconductor device using the same
05/15/2013CN103107248A Apparatus and method for die bonding
05/15/2013CN103107244A Preparation method for electroconductive film with cadmium oxide base light-transmitting waveband adjustable
05/15/2013CN103107203A Diode and manufacturing method thereof
05/15/2013CN103107202A Thin film transistor structure, liquid crystal display device and manufacturing method
05/15/2013CN103107201A Semiconductor device and method for manufacturing the same
05/15/2013CN103107200A Semiconductor device
05/15/2013CN103107199A Patterning contacts in carbon nanotube devices
05/15/2013CN103107198A Structure and method for MOSFETs with high-k and metal gate structure
05/15/2013CN103107197A Semiconductor device with enhanced strain
05/15/2013CN103107196A Fin field effect transistors and methods for fabricating the same
05/15/2013CN103107195A Strained structures of semiconductor devices
05/15/2013CN103107194A Trench type power transistor device and fabricating method thereof
05/15/2013CN103107192A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/15/2013CN103107191A High-voltage P-type laterally diffused metal oxide semiconductor (LDMOS) structure and manufacturing method thereof
05/15/2013CN103107190A InAs epitaxial materials for high-speed high electron mobility transistor (HEMT) components and preparation method thereof
05/15/2013CN103107189A Insulated gate bipolar translator (IGBT) back structure and preparing method thereof
05/15/2013CN103107188A Parasitic plug-and-play (PNP) component structure and manufacturing method thereof in a silicon germanium (SiGe) heterojunction bipolar transistor (HBT) process
05/15/2013CN103107187A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/15/2013CN103107186A Parasitic N-I-P type PIN device structure in bipolar junction transistor complementary metal oxide semiconductor (Bi CMOS) process and manufacturing method thereof
05/15/2013CN103107185A Germanium-silicon power heterojunction bipolar transistor (HBT), manufacturing method thereof and germanium-silicon power HBT multi-pointing device
05/15/2013CN103107184A Organic light emitting display panel and method of manufacturing the same
05/15/2013CN103107182A Organic light-emitting display device and method of manufacturing the same
05/15/2013CN103107181A Organic light-emitting display device and method of manufacturing the same
05/15/2013CN103107174A Liquid crystal display device, EL display device, and manufacturing method thereof
05/15/2013CN103107173A Storage device and manufacturing method thereof
05/15/2013CN103107161A Pinboard structure using conducting resin as signal return plane and preparation method thereof
1 ... 605 606 607 608 609 610 611 612 613 614 615 616 617 618 619 620 621 622 623 624 625 ... 6590