Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/30/2013US20130137265 Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
05/30/2013US20130137264 Semiconductor device manufacturing method
05/30/2013US20130137263 Electrically assisted chemical-mechanical planarization (eacmp) system and method thereof
05/30/2013US20130137262 Tungsten film forming method
05/30/2013US20130137261 Method of modifying a low k dielectric layer having etched features and the resulting product
05/30/2013US20130137260 Multi-stage silicidation process
05/30/2013US20130137259 Process for Making Contact with and Housing Integrated Circuits
05/30/2013US20130137258 Method for fabricating buried gates using pre landing plugs
05/30/2013US20130137257 Method of Forming a Semiconductor Device by Using Sacrificial Gate Electrodes and Sacrificial Self-Aligned Contact Structures
05/30/2013US20130137256 Semiconductor process
05/30/2013US20130137255 Method for manufacturing semiconductor device
05/30/2013US20130137254 Method for manufacturing semiconductor device
05/30/2013US20130137253 Semiconductor device and method of fabricating the same
05/30/2013US20130137252 Pattern forming method
05/30/2013US20130137251 Uniform Shallow Trench Isolation Regions and the Method of Forming the Same
05/30/2013US20130137250 Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation
05/30/2013US20130137249 Remote radical hydride dopant incorporation for delta doping in silicon
05/30/2013US20130137248 Doping Carbon Nanotubes and Graphene for Improving Electronic Mobility
05/30/2013US20130137247 Thermalization of gaseous precursors in cvd reactors
05/30/2013US20130137246 Method of producing group iii nitride semiconductor growth substrate
05/30/2013US20130137245 Method for making a structure comprising at least one multi-thick active part
05/30/2013US20130137244 Method and apparatus for reconditioning a carrier wafer for reuse
05/30/2013US20130137243 Semiconductor process
05/30/2013US20130137242 Dynamic current distribution control apparatus and method for wafer electroplating
05/30/2013US20130137241 Method for the preparation of a multi-layered crystalline structure
05/30/2013US20130137240 Methods for fabricating semiconductor devices
05/30/2013US20130137239 Semiconductor storage device and method of manufacturing the same
05/30/2013US20130137238 Method for forming high mobility channels in iii-v family channel devices
05/30/2013US20130137234 Methods for forming semiconductor devices
05/30/2013US20130137232 Method for forming oxide semiconductor film and method for manufacturing semiconductor device
05/30/2013US20130137231 Semiconductor device and method of manufacturing same
05/30/2013US20130137230 Semiconductor Device with Field Electrode
05/30/2013US20130137227 Logic and non-volatile memory (nvm) integration
05/30/2013US20130137225 Method and system for carbon doping control in gallium nitride based devices
05/30/2013US20130137224 Manufacturing methods for laterally diffused metal oxide semiconductor devices
05/30/2013US20130137223 Insulated gate type semiconductor device and method for fabricating the same
05/30/2013US20130137222 Method for Stacking Semiconductor Dies
05/30/2013US20130137220 METHOD OF MANUFACTURING GaN-BASED SEMICONDUCTOR DEVICE
05/30/2013US20130137219 Method for producing semiconductor device
05/30/2013US20130137218 Under-fill material and method for producing semiconductor device
05/30/2013US20130137217 Method of manufacturing semiconductor device
05/30/2013US20130137216 Method of manufacturing semiconductor device having plural semiconductor chips stacked one another
05/30/2013US20130137215 Die Fixing Method and Apparatus
05/30/2013US20130137214 METHOD FOR REMOVING RESIDUAL EXTRINSIC IMPURITIES IN AN N TYPE ZnO OR ZnMgO SUBSTRATE, FOR P-TYPE DOPING OF THIS SUBSTRATE
05/30/2013US20130137204 Crystallization apparatus, crystallizing method, and method of manufacturing organic light-emitting display apparatus
05/30/2013US20130137199 Systems and methods for monitoring heterojunction bipolar transistor processes
05/30/2013US20130137198 Method for manufacturing silicon carbide semiconductor device
05/30/2013US20130137197 Methods for quantitative measurement of a plasma immersion process
05/30/2013US20130137196 Method for monitoring devices in semiconductor process
05/30/2013US20130137195 Etching apparatus and methods
05/30/2013US20130137193 Systems and methods for preparation of samples for sub-surface defect review
05/30/2013US20130135930 Nonvolatile memory apparatus and method for fabricating the same
05/30/2013US20130135784 Electrostatic Chuck Robotic System
05/30/2013US20130135596 Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
05/30/2013US20130135395 Silicon substrate, method of manufacturing the same, and inkjet print head
05/30/2013US20130135032 Semiconductor device and method of forming same for temperature compensating active resistance
05/30/2013US20130134624 Composite substrate carrier
05/30/2013US20130134602 Flip chip package for dram with two underfill materials
05/30/2013US20130134601 Semiconductor device having shielded conductive vias and method for manufacturing the same
05/30/2013US20130134600 Semiconductor device and method for manufacturing the same
05/30/2013US20130134598 Semiconductor Device and Method of Forming a Power MOSFET With Interconnect Structure to Achieve Lower RDSON
05/30/2013US20130134597 Chip on film, and method of manufacture thereof
05/30/2013US20130134596 Wafer Level Semiconductor Package
05/30/2013US20130134594 Semiconductor device, semiconductor element, and method for manufacturing semiconductor device
05/30/2013US20130134593 Semiconductor device manufacturing method, semiconductor device, and semiconductor element
05/30/2013US20130134589 Chip-package and a method for forming a chip-package
05/30/2013US20130134583 Semiconductor device and manufacturing method thereof
05/30/2013US20130134582 Novel bump structures for multi-chip packaging
05/30/2013US20130134581 Planarized bumps for underfill control
05/30/2013US20130134580 Semiconductor Device and Method of Forming RDL Under Bump for Electrical Connection to Enclosed Bump
05/30/2013US20130134578 Device having multiple wire bonds for a bond area and methods thereof
05/30/2013US20130134577 Ribbon bonding in an electronic package
05/30/2013US20130134576 Semiconductor apparatus, semiconductor-apparatus manufacturing method and electronic equipment
05/30/2013US20130134575 Packaged die for heat dissipation and method therefor
05/30/2013US20130134574 Semiconductor device and method for fabricating the same
05/30/2013US20130134573 Semiconductor device and methods of manufacturing semiconductor devices
05/30/2013US20130134572 Semiconductor device including cladded base plate
05/30/2013US20130134565 System-in-package module and method of fabricating the same
05/30/2013US20130134564 Semiconductor device and manufacturing method of the same
05/30/2013US20130134563 Electrical Connection Structure
05/30/2013US20130134562 Semiconductor device and method for fabricating semiconductor buried layer
05/30/2013US20130134561 Backside thermal patterning of buried oxide (box)
05/30/2013US20130134559 Chip-on-Wafer Structures and Methods for Forming the Same
05/30/2013US20130134558 Self Aligned Silicide Device Fabrication
05/30/2013US20130134554 Vertical capacitors and methods of forming the same
05/30/2013US20130134552 Semiconductor device and semiconductor device manufacturing method
05/30/2013US20130134546 High density multi-electrode array
05/30/2013US20130134545 Self-limiting oxygen seal for high-k dielectric, related method and design structure
05/30/2013US20130134544 Energy harvesting in integrated circuit packages
05/30/2013US20130134531 Fully embedded micromechanical device, system on chip and method for manufacturing the same
05/30/2013US20130134530 Method of fabricating isolated semiconductor structures
05/30/2013US20130134529 Electric device and method of manufacturing the same
05/30/2013US20130134526 Semiconductor device and method of fabricating the same
05/30/2013US20130134518 Noble gas implantation region in top silicon layer of semiconductor-on-insulator substrate
05/30/2013US20130134514 Thin film transistor and method for fabricating the same
05/30/2013US20130134513 Finfet with improved gate planarity
05/30/2013US20130134512 Power MOSFETs and Methods for Forming the Same
05/30/2013US20130134511 Semiconductor Device with Self-Biased Isolation
05/30/2013US20130134506 Semiconductor device and manufacturing method of same
05/30/2013US20130134505 Semiconductor device for power and method of manufacture thereof
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