Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/09/2013US20130115779 Conical Sleeves For Reactors
05/09/2013US20130115778 Dry Etch Processes
05/09/2013US20130115777 Manufacturing method for semiconductor structures
05/09/2013US20130115776 Pressure control valve assembly of plasma processing chamber and rapid alternating process
05/09/2013US20130115775 Method of forming wide trenches using a sacrificial silicon slab
05/09/2013US20130115774 Method for chemical planarization and chemical planarization apparatus
05/09/2013US20130115773 Prevention of ILD Loss in Replacement Gate Technologies by Surface Treatmen
05/09/2013US20130115772 Etching Method
05/09/2013US20130115771 Method of making semiconductor device
05/09/2013US20130115770 Etching composition, method of forming a metal pattern and method of manufacturing a display substrate
05/09/2013US20130115769 Method for forming an air gap around a through-silicon via
05/09/2013US20130115768 Methods for depositing nickel films and for making nickel silicide and nickel germanide
05/09/2013US20130115767 Metal Alloy Cap Integration
05/09/2013US20130115766 Method of manufacturing semiconductor device
05/09/2013US20130115764 Substrate processing system and method
05/09/2013US20130115763 Methods for forming doped silicon oxide thin films
05/09/2013US20130115762 Method for doping a semiconductor material
05/09/2013US20130115761 Methods of Forming a Semiconductor Device
05/09/2013US20130115760 Method of forming a thin layer structure
05/09/2013US20130115759 Methods of Fabricating Semiconductor Devices
05/09/2013US20130115758 Method for manufacturing silicon carbide schottky barrier diode
05/09/2013US20130115757 Method for separating a plurality of dies and a processing device for separating a plurality of dies
05/09/2013US20130115756 Processing method for semiconductor wafer having passivation film on the front side thereof
05/09/2013US20130115755 Method of separating semiconductor die using material modification
05/09/2013US20130115754 Micro machining method for a substrate on an underlay
05/09/2013US20130115753 Method of manufacturing thin film-bonded substrate
05/09/2013US20130115752 Pick-and-Place Tool for Packaging Process
05/09/2013US20130115751 Boron-containing hydrogen silsesquioxane polymer, integrated circuit device formed using the same, and associated methods
05/09/2013US20130115750 Blocking layers for leakage current reduction in dram devices
05/09/2013US20130115748 Method for fabricating semiconductor device
05/09/2013US20130115746 Method for Fabricating a Vertical LDMOS Device
05/09/2013US20130115745 Methods of manufacturing semiconductor devices including device isolation trenches self-aligned to gate trenches
05/09/2013US20130115743 Semiconductor device and method for forming the same
05/09/2013US20130115742 Method of manufacturing semiconductor device using stress memorization technique
05/09/2013US20130115741 PROCESS TO REMOVE Ni AND Pt RESIDUES FOR NiPtSi APPLICATIONS USING AQUA REGIA WITH MICROWAVE ASSISTED HEATING
05/09/2013US20130115739 Systems and Methods Integrating Trench-Gated Thyristor With Trench-Gated Rectifier
05/09/2013US20130115738 Packaging substrate and fabrication method thereof
05/09/2013US20130115736 Method for separating a plurality of dies and a processing device for separating a plurality of dies
05/09/2013US20130115735 Apparatus and Methods for Molded Underfills in Flip Chip Packaging
05/09/2013US20130115734 Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice
05/09/2013US20130115733 Etchant composition and method for manufacturing thin film transistor using the same
05/09/2013US20130115730 Low-Temperature Wafer Level Processing for MEMS Devices
05/09/2013US20130115728 Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer
05/09/2013US20130115726 Crystallization apparatus, crystallization method, organic light-emitting display apparatus and method of manufacturing organic light-emitting display apparatus
05/09/2013US20130115725 Light emitting diode having a transparent substrate
05/09/2013US20130115724 Method of fabricating an integrated orifice plate and cap structure
05/09/2013US20130115723 Method of manufacturing semiconductor device and semiconductor manufacturing system
05/09/2013US20130115722 Method for manufacturing a semiconductor device
05/09/2013US20130115721 Epitaxial film growth in retrograde wells for semiconductor devices
05/09/2013US20130115720 Surface measurement
05/09/2013US20130115719 Method for manufacturing integrated circuit structure with magnetoresistance component
05/09/2013US20130115419 Optical element, lithographic apparatus including such optical element and device manufacturing method, and device manufactured thereby
05/09/2013US20130115110 Processing chamber integrated pressure control
05/09/2013US20130115028 Robot systems, apparatus, and methods adapted to transport dual substrates in electronic device manufacturing
05/09/2013US20130114633 Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device
05/09/2013US20130114336 Three port mtj structure and integration
05/09/2013US20130114333 Semiconductor memory device and fabrication process thereof
05/09/2013US20130114235 Emi shield
05/09/2013US20130114181 Substrate Clamping System and Method for Operating the Same
05/09/2013US20130114017 Array substrate and method for manufacturing the same, and display device
05/09/2013US20130113765 Flat panel display
05/09/2013US20130113448 Coil inductor for on-chip or on-chip stack
05/09/2013US20130113169 Power input device and vacuum processing apparatus using the same
05/09/2013US20130113147 Substrate processing apparatus and substrate processing method
05/09/2013US20130113122 Epoxy resin composition and semiconductor device
05/09/2013US20130113120 Semiconductor device and manufacturing method of semiconductor device
05/09/2013US20130113118 Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer
05/09/2013US20130113116 Contact and Method of Formation
05/09/2013US20130113115 System in package process flow
05/09/2013US20130113114 Device Including Two Power Semiconductor Chips and Manufacturing Thereof
05/09/2013US20130113111 Semiconductor devices and methods of manufacturing the same
05/09/2013US20130113110 Semiconductor Structure Having Lateral Through Silicon Via And Manufacturing Method Thereof
05/09/2013US20130113108 System in package process flow
05/09/2013US20130113106 Three-dimensional (3d) integrated circuit with enhanced copper-to-copper bonding
05/09/2013US20130113105 Barrier For Through-Silicon Via
05/09/2013US20130113104 Structure for picking up a buried layer and method thereof
05/09/2013US20130113103 DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS
05/09/2013US20130113102 Semiconductor interconnect structure having a graphene-based barrier metal layer
05/09/2013US20130113101 Use of Gas Cluster Ion Beam To Reduce Metal Void Formation In Interconnect Structures
05/09/2013US20130113100 Semiconductor structure and manufacturing method thereof
05/09/2013US20130113099 Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
05/09/2013US20130113098 Through via package
05/09/2013US20130113097 Methods of and semiconductor devices with ball strength improvement
05/09/2013US20130113095 Packaging substrate and fabrication method thereof
05/09/2013US20130113094 Post-passivation interconnect structure and method of forming the same
05/09/2013US20130113093 Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package
05/09/2013US20130113092 Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
05/09/2013US20130113091 Method of packaging semiconductor die
05/09/2013US20130113088 Chip packaging structure, chip packaging method, and electronic device
05/09/2013US20130113087 Semiconductor component
05/09/2013US20130113086 Self-leveling planarization materials for microelectronic topography
05/09/2013US20130113085 Atomic Layer Deposition Of Films Using Precursors Containing Hafnium Or Zirconium
05/09/2013US20130113084 Semiconductor substrate with molded support layer
05/09/2013US20130113083 Resin composition, resin film, semiconductor device, and production method thereof
05/09/2013US20130113081 Quantum capacitance graphene varactors and fabrication methods
05/09/2013US20130113080 Non-volatile semiconductor storage device
05/09/2013US20130113078 Polysilicon-insulator-silicon capacitor in a sige hbt process and manufacturing method thereof
05/09/2013US20130113076 Metal-semiconductor wafer bonding for high-q devices
05/09/2013US20130113075 Metal-insulator-metal capacitor structure and method for manufacturing the same
05/09/2013US20130113073 Integrated Circuit having a MOM Capacitor and Method of Making Same
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