Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/15/2013CN103103616A Improvement structure of phosphorus oxychloride remover of phosphorus diffusion furnace
05/15/2013CN103103615A Phosphorus oxychloride remover of phosphorus diffusion furnace
05/15/2013CN103103614A Furnace tube cap of phosphorus diffusion furnace
05/15/2013CN103103613A Exhaust tube device for phosphorus diffusion furnace
05/15/2013CN103103505A Chemical bath deposition system
05/15/2013CN103103504A Chemical bath deposition system and related chemical bath deposition method
05/15/2013CN103102819A Adhesive sheet with separating film
05/15/2013CN103102801A Solution composition for passivation layer, thin film transistor array panel and manufacturing method for thin film transistor array panel
05/15/2013CN103100966A Chemical mechanical lapping device and system
05/15/2013CN103100779A 焊球印刷机 Balls presses
05/15/2013CN102403202B Preparation method for strained SiGe layer with high Ge component
05/15/2013CN102394224B Preparation method of chloro silane-samaric sulfide film on single crystal silicon surface
05/15/2013CN102347251B Embedded wafer-level bonding approaches
05/15/2013CN102318038B Method and device for measuring temperature during deposition of semiconductor
05/15/2013CN102231360B Method for regulating etching gas in plasma etching cavity
05/15/2013CN102222605B Wafer conveying device with fragment detection
05/15/2013CN102172885B Substrate polishing device and polished substrate thereof
05/15/2013CN102163556B Method for electric-lead-free electroplating by adopting buried circuit substrate
05/15/2013CN102157401B High-density SIP (system in package) method of chip
05/15/2013CN102150242B Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element
05/15/2013CN102136489B Semiconductor structure and manufacture method thereof
05/15/2013CN102136435B Manufacture method for high-performance semiconductor structure
05/15/2013CN102084476B Support body and substrate storage container
05/15/2013CN102082100B Packaging method for semiconductor devices with bulged pins
05/15/2013CN102057462B Short thermal profile oven useful for screen printing
05/15/2013CN102053498B Positive photosensitive resin composition
05/15/2013CN102034720B Chip packaging method
05/15/2013CN102024722B Lead soldering method
05/15/2013CN102023439B TFT (Thin Film Transistor) array structure and manufacturing method thereof
05/15/2013CN102019248B Swing nozzle unit and substrate processing apparatus with swing nozzle unit
05/15/2013CN101971372B Semiconductor body and method for producing a semiconductor body
05/15/2013CN101971362B Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit
05/15/2013CN101930167B Pellicle frame and lithographic pellicle
05/15/2013CN101930165B Pellicle frame and lithographic pellicle
05/15/2013CN101911287B Semiconductor memory device and method for manufacturing same
05/15/2013CN101894794B Method of forming sub-lithographic features using directed self-assembly of polymers
05/15/2013CN101849190B Insert, tray and electronic component testing apparatus
05/15/2013CN101814455B Method of fabricating array substrate
05/15/2013CN101728409B Solid-state imaging device and method for fabricating same
05/15/2013CN101640171B Method for producing semiconductor device
05/15/2013CN101532126B Film formation apparatus for semiconductor process and method for using same
05/15/2013CN101527254B Rotating temperature controlled substrate pedestal for film uniformity
05/15/2013CN101501154B Adhesive tape, joint structure, and semiconductor package
05/15/2013CN101426618B Manufacturing method of polishing pad
05/15/2013CN101424883B Exposure system and device producing method
05/15/2013CN101331597B Memory cell having stressed layers
05/15/2013CN101262981B Polishing method and polishing apparatus, and program for controlling polishing apparatus
05/15/2013CN101232067B Light emitting diode and manufacturing method thereof, integrated light emitting diode, and display
05/14/2013USRE44215 Semiconductor optoelectric device and method of manufacturing the same
05/14/2013US8442364 Optical waveguide circuit and manufacturing method of optical waveguide circuit
05/14/2013US8442362 Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system
05/14/2013US8442320 Pattern inspection apparatus and pattern inspection method
05/14/2013US8441809 Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
05/14/2013US8441772 Substrate for electrostatic chuck and electrostatic chuck
05/14/2013US8441627 Surface inspection apparatus and surface inspection method
05/14/2013US8441612 LED light source, its manufacturing method, and LED-based photolithography apparatus and method
05/14/2013US8441131 Strain-compensating fill patterns for controlling semiconductor chip package interactions
05/14/2013US8441112 Method of manufacturing layered chip package
05/14/2013US8441111 Stub minimization for multi-die wirebond assemblies with parallel windows
05/14/2013US8441106 Apparatus and method for defining laser cleave alignment
05/14/2013US8441105 Semiconductor device, wafer structure and method for fabricating semiconductor device
05/14/2013US8441102 Semiconductor device having a capacitor
05/14/2013US8441101 Semiconductor device and method for manufacturing the same
05/14/2013US8441100 Capacitor with pillar type storage node and method for fabricating the same
05/14/2013US8441097 Methods to form memory devices having a capacitor with a recessed electrode
05/14/2013US8441096 Fuse of semiconductor device and method for forming the same
05/14/2013US8441095 Semiconductor device having a ring oscillator and MISFET for converting voltage fluctuation to frequency fluctuation
05/14/2013US8441092 Thermoelectric cooler system, method and device
05/14/2013US8441078 Semiconductor device including SiON gate dielectric with portions having different nitrogen concentrations
05/14/2013US8441077 Method for forming a ruthenium metal layer and a structure comprising the ruthenium metal layer
05/14/2013US8441073 Semiconductor device and manufacturing method for the same
05/14/2013US8441063 Memory with extended charge trapping layer
05/14/2013US8441056 NROM memory cell, memory array, related devices and methods
05/14/2013US8441055 Methods for forming strained channel dynamic random access memory devices
05/14/2013US8441054 Driver for driving a load using a charge pump circuit
05/14/2013US8441053 Vertical capacitor-less DRAM cell, DRAM array and operation of the same
05/14/2013US8441050 Fin transistor structure and method of fabricating the same
05/14/2013US8441049 Flat panel display device comprising polysilicon thin film transistor and method of manufacturing the same
05/14/2013US8441048 Horizontally depleted metal semiconductor field effect transistor
05/14/2013US8441043 Maskless process for suspending and thinning nanowires
05/14/2013US8441042 BEOL compatible FET structure
05/14/2013US8441033 Semiconductor device and method of manufacturing semiconductor device
05/14/2013US8441021 Display device and manufacturing method thereof
05/14/2013US8441013 TFT substrate including divided display screens and/or separated data lines, display panel including the TFT substrate, and method for manufacturing the TFT substrate
05/14/2013US8441012 Array substrate, method for manufacturing array substrate, and display device
05/14/2013US8441009 Semiconductor device and manufacturing method thereof
05/14/2013US8440991 Phase change memory device having a heater with a temperature dependent resistivity, method of manufacturing the same, and circuit of the same
05/14/2013US8440941 Heat treatment apparatus, heat treatment method and method for manufacturing semiconductor device
05/14/2013US8440908 Solar cell and method for preparation thereof
05/14/2013US8440903 Method and structure for forming module using a powder coating and thermal treatment process
05/14/2013US8440581 Systems and methods for non-periodic pulse sequential lateral solidification
05/14/2013US8440580 Method of fabricating silicon nitride gap-filling layer
05/14/2013US8440579 Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification
05/14/2013US8440578 GCIB process for reducing interfacial roughness following pre-amorphization
05/14/2013US8440577 Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same
05/14/2013US8440576 Method for pitch reduction in integrated circuit fabrication
05/14/2013US8440575 Method of fabricating semiconductor device
05/14/2013US8440574 Post chromium alloy plasma etch ashing process
05/14/2013US8440573 Method and apparatus for pattern collapse free wet processing of semiconductor devices
05/14/2013US8440572 Si etching method
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