| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/30/2013 | US20130134504 Semiconductor device and method of manufacturing the same |
| 05/30/2013 | US20130134502 Wafer level chip scale package |
| 05/30/2013 | US20130134498 Memory device and method for fabricating the same |
| 05/30/2013 | US20130134497 Memory device and method for fabricating the same |
| 05/30/2013 | US20130134496 Semiconductor devices and methods of manufacturing the semiconductor devices |
| 05/30/2013 | US20130134495 Flash memory and method for forming the same |
| 05/30/2013 | US20130134494 Semiconductor devices and methods of manufacturing the same |
| 05/30/2013 | US20130134491 Polysilicon/metal contact resistance in deep trench |
| 05/30/2013 | US20130134490 Low resistance embedded strap for a trench capacitor |
| 05/30/2013 | US20130134488 Semiconductor Device and Manufacturing Method thereof |
| 05/30/2013 | US20130134487 Power transistor device with super junction and manufacturing method thereof |
| 05/30/2013 | US20130134486 Methods of Patterning Features in a Structure Using Multiple Sidewall Image Transfer Technique |
| 05/30/2013 | US20130134485 Semiconductor device and manufacturing method thereof |
| 05/30/2013 | US20130134483 Bipolar transistor with a raised collector pedastal for reduced capacitance and a method of forming the transistor |
| 05/30/2013 | US20130134482 Substrate breakdown voltage improvement for group iii-nitride on a silicon substrate |
| 05/30/2013 | US20130134481 Split-Channel Transistor and Methods for Forming the Same |
| 05/30/2013 | US20130134480 Formation of Devices by Epitaxial Layer Overgrowth |
| 05/30/2013 | US20130134477 Back gate triggered silicon controlled rectifiers |
| 05/30/2013 | US20130134440 High-resolution Parallel-detection Sensor Array Using Piezo-Phototronics Effect |
| 05/30/2013 | US20130134439 Epitaxial substrate for semiconductor element, semiconductor element, pn junction diode, and method for manufacturing an epitaxial substrate for semiconductor element |
| 05/30/2013 | US20130134435 High electron mobility transistor structure with improved breakdown voltage performance |
| 05/30/2013 | US20130134432 Semiconductor device, and method of fabricating the same |
| 05/30/2013 | US20130134431 Thin-film transistor array manufacturing method, thin-film transistor array, and display device |
| 05/30/2013 | US20130134429 Thin-film transistor and thin-film transistor manufacturing method |
| 05/30/2013 | US20130134425 Array substrate and manufacturing method thereof |
| 05/30/2013 | US20130134424 Thin film transistor array substrate, organic light emitting display device comprising the same, and method of manufacturing the thin film transistor array substrate |
| 05/30/2013 | US20130134412 Semiconductor device and method for manufacturing the same |
| 05/30/2013 | US20130134394 Integrated Circuits Based on Aligned Nanotubes |
| 05/30/2013 | US20130134393 Nanotube Field Effect Devices and Methods of Making Same |
| 05/30/2013 | US20130134392 Doping Carbon Nanotubes and Graphene for Improving Electronic Mobility |
| 05/30/2013 | US20130134391 Reducing Contact Resistance for Field-Effect Transistor Devices |
| 05/30/2013 | US20130134384 Method of post treating graphene and method of manufacturing graphene using the same |
| 05/30/2013 | US20130134381 Semiconductor device and manufacturing method thereof |
| 05/30/2013 | US20130134376 Atomic layer deposition of zirconium oxide for forming resistive-switching materials |
| 05/30/2013 | US20130134375 SEMICONDUCTOR DEVICE STRUCTURES COMPRISING CRYSTALLINE Pr1-xCaxMnO3 (PCMO) MATERIAL AND METHODS OF FORMING CRYSTALLINE PCMO MATERIAL |
| 05/30/2013 | US20130134372 Semiconductor device and method of manufacturing the same |
| 05/30/2013 | US20130134148 Substrate support device |
| 05/30/2013 | US20130134147 Substrate support device |
| 05/30/2013 | US20130134128 Device and method for treating wafer-shaped articles |
| 05/30/2013 | US20130133938 Dicing Sheet and a Production Method of a Semiconductor Chip |
| 05/30/2013 | US20130133834 Plasma Processing Chamber With Flexible Symmetric RF Return Strap |
| 05/30/2013 | US20130133833 Symmetric RF Return Path Liner |
| 05/30/2013 | US20130133825 Pattern formation method and polymer alloy base material |
| 05/30/2013 | US20130133703 Vaporized material supply apparatus, substrate processing apparatus having same and vaporized material supply method |
| 05/30/2013 | US20130133696 Substrate processing apparatus |
| 05/30/2013 | US20130133571 Film forming apparatus |
| 05/29/2013 | EP2597687A2 Method for producing a GaN LED device |
| 05/29/2013 | EP2597677A1 Semiconductor device with through-substrate via covered by a solder ball and related method of production |
| 05/29/2013 | EP2597675A1 Encapsulated semiconductor device and method for producing same |
| 05/29/2013 | EP2597674A1 Method for producing a floating gate memory structure |
| 05/29/2013 | EP2597673A2 Low thermal mass semiconductor wafer boat |
| 05/29/2013 | EP2597672A2 Low thermal mass semiconductor wafer plate |
| 05/29/2013 | EP2597671A2 Method for permanently connecting two metal surfaces |
| 05/29/2013 | EP2597670A2 Method for permanently connecting two metal surfaces |
| 05/29/2013 | EP2596530A2 Stackable molded microelectronic packages with area array unit connectors |
| 05/29/2013 | EP2596529A2 Stackable molded microelectronic packages |
| 05/29/2013 | EP2596527A2 Hermetically sealed electronic device using solder bonding |
| 05/29/2013 | EP2596526A2 Metal-contamination -free through-substrate via structure |
| 05/29/2013 | EP2596525A1 Handling device for handling a wafer |
| 05/29/2013 | EP2596524A2 Process for direct bonding two elements comprising copper portions and dielectric materials |
| 05/29/2013 | EP2596523A1 Device and process for forming, on a nanowire made of a semiconductor, an alloy of this semiconductor with a metal or metalloid |
| 05/29/2013 | EP2596522A1 Method of fabrication of semiconductor device |
| 05/29/2013 | EP2596521A1 Electronic device structure including a buffer layer on a base layer |
| 05/29/2013 | EP2596520A1 Microelectronic elements with rear contacts connected with via first or via middle structures |
| 05/29/2013 | EP2596091A2 Aqueous alkaline cleaning compositions and methods of their use |
| 05/29/2013 | EP2595940A1 Polycrystalline aluminum nitride material and method of production thereof |
| 05/29/2013 | DE112011102840T5 Halbleiter, der durch elastische Kantenrelaxation eines Stressors in Kombination mit einer vergrabenen Isolierschicht verspannt wird Semiconductor, which is braced by elastic Kantenrelaxation of a stressor in combination with a buried insulating layer |
| 05/29/2013 | DE112011102261T5 Leitfähige Pastenzusammensetzung für eine Solarzelle A conductive paste composition for a solar cell |
| 05/29/2013 | DE112011101519T5 Epitaxialfilmbildungsverfahren, Vakuumprozessierungsapparat, Herstellungsverfahren eines halbleitertechnischen Licht emittierenden Elements, halbleitertechnisches Licht emittierendes Element und Beleuchtungsvorrichtung Epitaxialfilmbildungsverfahren, Vakuumprozessierungsapparat, manufacturing method of a semiconductor light emitting element technology, semiconductor light emitting element and technical lighting device |
| 05/29/2013 | DE112011101518T5 Verfahren zum Polieren von Siliziumwafern und Beschreibung der entsprechenden Polierflüssigkeit A method for polishing of silicon wafers and description of the respective polishing liquid |
| 05/29/2013 | DE112010005265T5 DMOS-Transistor mit erhöhter Durchbruchsspannung und Verfahren zur Herstellung. DMOS transistor with an increased breakdown voltage and process for preparing. |
| 05/29/2013 | DE112010005257T5 Einkristallkühler und Einkristallzüchter, der denselben enthält Einkristallkühler and Einkristallzüchter containing the same |
| 05/29/2013 | DE102012221620A1 Verfahren zum Strukturieren von Merkmalen in einer Struktur unter Verwendung einer Mehrfachseitenwandbildübertragungstechnik Method for patterning of features in a structure using a multiple sidewall image transfer technique |
| 05/29/2013 | DE102012220731A1 Verringern des Kontaktwiderstands für Feldeffekttransistoreinheiten Reduce the contact resistance of the field effect transistor units |
| 05/29/2013 | DE102012206758B3 Method for manufacturing substrate for power semiconductor component such as MOSFET of power semiconductor module, involves performing galvanic isolation of metal film on broad strip conductor |
| 05/29/2013 | DE102012111520A1 Chipgehäuse und Verfahren zum Bilden eines Chipgehäuses Chip package and method of forming a chip package |
| 05/29/2013 | DE102012111115A1 Gehäuse einer lichtabgebenden Diode und Verfahren zur Herstellung eines Gehäuses einer lichtabgebenden Diode Housing a light emitting diode and method of manufacturing a housing of a light emitting diode |
| 05/29/2013 | DE102012110604A1 Einrichtung für die Montage von Halbleiterchips Means for the mounting of semiconductor chips |
| 05/29/2013 | DE102012109928A1 Pastenzusammensetzung für eine Solarzellenelektrode, unter Verwendung derselben hergestellte Elektrode sowie diese enthaltende Solarzelle Paste composition for a solar cell electrode using the same electrode, as well as those prepared containing solar cell |
| 05/29/2013 | DE102012109924A1 Halbleiter-Verarbeitungssystem Semiconductor processing system |
| 05/29/2013 | DE102012108112A1 Messvorrichtung und Verfahren zum Messen einer Chip-zu-Chip-Träger-Verbindung Measuring apparatus and method for measuring a chip-to-chip-carrier connection |
| 05/29/2013 | DE102012107620A1 Display panel for display device e.g. LED display device has one of any two adjacent signal lines connected to at least one of main signal transmission lines and other one of two adjacent signal lines maintained in floating state |
| 05/29/2013 | DE102012103176B3 Vorrichtung und Verfahren zum Einbringen von Trennrissen in ein Substrat Apparatus and method for introducing separation cracks in a substrate |
| 05/29/2013 | DE102011119497A1 Band zu Band Tunnel-Feldeffekttransistor mit gradierter Halbleiterheterostruktur im Tunnelübergang und Verfahren zu dessen Herstellung Band to band tunneling field effect transistor having a graded semiconductor heterostructure in the tunnel junction and process for its preparation |
| 05/29/2013 | DE102011088714B4 Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement A process for producing a semiconductor device and semiconductor device |
| 05/29/2013 | DE102011087348A1 Method for drying substrates of semiconductor component, involves lifting support at predetermined angle in vertical direction |
| 05/29/2013 | DE102009061250B3 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 05/29/2013 | DE102009037487B4 Halbleitervorrichtung Semiconductor device |
| 05/29/2013 | DE102008064715B4 Verfahren zur Herstellung eines Transistors A method of manufacturing a transistor |
| 05/29/2013 | DE102006015686C5 Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine Method for transporting printing material and printing table for flat-bed printing machine |
| 05/29/2013 | DE102004031877B4 Verfahren zum Untersuchen einer Maske oder eines Retikels zum Erkennen eines Defekts und Masken- oder Retikeluntersuchungssystem A method of inspecting a mask or a reticle for detecting a defect and mask or Retikeluntersuchungssystem |
| 05/29/2013 | CN202957281U LED chip support clipping device used for LED die bonder |
| 05/29/2013 | CN202957280U Loading and unloading mechanical arm |
| 05/29/2013 | CN202957230U Sleeving piece fixture |
| 05/29/2013 | CN202957229U Calibration device |
| 05/29/2013 | CN202957228U Wafer-carrying basket and solar silicon wafer washing device provided with same |
| 05/29/2013 | CN202957227U Silicon wafer box |
| 05/29/2013 | CN202957226U Combination construction of abutting pushing device of wafer box |
| 05/29/2013 | CN202957225U 12-cun wafer frame |
| 05/29/2013 | CN202957224U Adhesive film expansion device |