Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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05/16/2013 | US20130121798 Robot system with independent arms |
05/16/2013 | US20130121792 Semiconductor manufacturing process module |
05/16/2013 | US20130121509 Sound Transducer with Interdigitated First and Second Sets of Comb Fingers |
05/16/2013 | US20130121087 Semiconductor manufacturing method |
05/16/2013 | US20130121060 Non-volatile memory elements and memory devices including the same |
05/16/2013 | US20130121056 Apparatuses and operation methods associated with resistive memory cell arrays with separate select lines |
05/16/2013 | US20130121055 Word line driver cell layout for sram and other semiconductor devices |
05/16/2013 | US20130120951 Stacked cmos chipset having an insulating layer and a secondary layer and method of forming same |
05/16/2013 | US20130120896 Electrostatic chuck |
05/16/2013 | US20130120732 Cylindrical magnetic levitation stage and lithography |
05/16/2013 | US20130120731 Stage unit, exposure apparatus, and exposure method |
05/16/2013 | US20130120699 Semiconductor device, method of manufacturing the device, and liquid crystal display |
05/16/2013 | US20130120505 Bonded silicon structure for high density print head |
05/16/2013 | US20130120327 Storage capacitor for electromechanical systems and methods of forming the same |
05/16/2013 | US20130120018 Test Structure and Method of Testing Electrical Characteristics of Through Vias |
05/16/2013 | US20130119688 Handling device for handling of a wafer |
05/16/2013 | US20130119566 Semiconductor Chip and Substrate Transfer/Processing Tunnel -arrangement Extending in a Linear Direction |
05/16/2013 | US20130119562 Semiconductor package, semiconductor package manufacturing method and semiconductor device |
05/16/2013 | US20130119560 Packaging structural member |
05/16/2013 | US20130119559 Semiconductor Device and Method of Forming EWLB Package Containing Stacked Semiconductor Die Electrically Connected through Conductive Vias Formed in Encapsulant Around Die |
05/16/2013 | US20130119555 Through-Package-Via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same |
05/16/2013 | US20130119553 Semiconductor package and method of manufacturing the same |
05/16/2013 | US20130119552 Method for Forming Chip-on-Wafer Assembly |
05/16/2013 | US20130119550 Semiconductor device and method of manufacturing the same |
05/16/2013 | US20130119549 Mold Chase Design for Package-on-Package Applications |
05/16/2013 | US20130119548 Method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technology |
05/16/2013 | US20130119546 Semiconductor device and manufacturing method |
05/16/2013 | US20130119545 Semiconductor device and method for forming the same |
05/16/2013 | US20130119543 Through silicon via for stacked wafer connections |
05/16/2013 | US20130119540 Semiconductor package and method for manufacturing the same |
05/16/2013 | US20130119539 Package Structures and Methods for Forming the Same |
05/16/2013 | US20130119538 Wafer level chip size package |
05/16/2013 | US20130119535 Flip chip packages with improved thermal performance |
05/16/2013 | US20130119533 Package for Three Dimensional Integrated Circuit |
05/16/2013 | US20130119531 Semiconductor device and method for manufacturing the same |
05/16/2013 | US20130119529 Semiconductor device having lid structure and method of making same |
05/16/2013 | US20130119528 Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
05/16/2013 | US20130119526 Lead frame, semiconductor manufacturing apparatus, and semiconductor device |
05/16/2013 | US20130119525 Power Semiconductor Unit, Power Module, Power Semiconductor Unit Manufacturing Method, and Power Module Manufacturing Method |
05/16/2013 | US20130119520 Chips with high fracture toughness through a metal ring |
05/16/2013 | US20130119519 Composite substrate, electronic component, and method for manufacturing composite substrate, and method for manufacturing electronic component |
05/16/2013 | US20130119518 Semiconductor formation by lateral diffusion liquid phase epitaxy |
05/16/2013 | US20130119516 Pnp bipolar junction transistor fabrication using selective epitaxy |
05/16/2013 | US20130119509 Forming beol line fuse structure |
05/16/2013 | US20130119508 Bipolar junction transistor with multiple emitter fingers |
05/16/2013 | US20130119507 Semiconductor device using group iii-v material and method of manufacturing the same |
05/16/2013 | US20130119505 Schottky Barrier Diodes With a Guard Ring Formed by Selective Epitaxy |
05/16/2013 | US20130119497 Magnetic tunnel junction structure |
05/16/2013 | US20130119495 Magnetic tunnel junction devices having magnetic layers formed on composite, obliquely deposited seed layers |
05/16/2013 | US20130119493 Microelectro mechanical system encapsulation scheme |
05/16/2013 | US20130119491 Integrated semiconductor devices with amorphous silicon beam, methods of manufacture and design structure |
05/16/2013 | US20130119490 Integrated semiconductor devices with single crystalline beam, methods of manufacture and design structure |
05/16/2013 | US20130119487 Structure and Method for MOSFETS with High-K and Metal Gate Structure |
05/16/2013 | US20130119482 Fin field effect transistors and methods for fabricating the same |
05/16/2013 | US20130119481 Finfet device |
05/16/2013 | US20130119480 Integrated circuit resistor |
05/16/2013 | US20130119478 Semiconductor device and manufacturing method thereof |
05/16/2013 | US20130119477 Semiconductor device and manufacturing method thereof |
05/16/2013 | US20130119474 Trench silicide and gate open with local interconnect with replacement gate process |
05/16/2013 | US20130119473 Gate structures and methods of manufacture |
05/16/2013 | US20130119470 Semiconductor device and method of manufacturing the same |
05/16/2013 | US20130119468 Thin film transistor and method of fabricating the same |
05/16/2013 | US20130119465 Dual channel trench ldmos transistors and transistors integrated therewith |
05/16/2013 | US20130119462 Semiconductor device for increasing bit line contact area, and module and system including the same |
05/16/2013 | US20130119460 Trench type power transistor device and fabricating method thereof |
05/16/2013 | US20130119456 Semiconductor device and method for manufacturing the same |
05/16/2013 | US20130119455 Nand flash with non-trapping switch transistors |
05/16/2013 | US20130119451 Interlayer polysilicon dielectric cap and method of forming thereof |
05/16/2013 | US20130119446 Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
05/16/2013 | US20130119445 Cmos device for reducing radiation-induced charge collection and method for fabricating the same |
05/16/2013 | US20130119444 Semiconductor device and method of manufacturing the same |
05/16/2013 | US20130119442 Junction field-effect transistor with raised source and drain regions formed by selective epitaxy |
05/16/2013 | US20130119440 Biosensors integrated with a microfluidic structure |
05/16/2013 | US20130119436 Interface control in a bipolar junction transistor |
05/16/2013 | US20130119435 Dielectric dummification for enhanced planarization with spin-on dielectrics |
05/16/2013 | US20130119434 Bipolar transistor with a collector having a protected outer edge portion for reduced based-collector junction capacitance and a method of forming the transistor |
05/16/2013 | US20130119419 Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods |
05/16/2013 | US20130119408 Display Device and Method for Fabricating the Same |
05/16/2013 | US20130119407 Method for manufacturing semiconductor device, and semiconductor device |
05/16/2013 | US20130119406 Silicon carbide substrate, semiconductor device, and methods for manufacturing them |
05/16/2013 | US20130119404 Device structure including high-thermal-conductivity substrate |
05/16/2013 | US20130119401 Large area nitride crystal and method for making it |
05/16/2013 | US20130119394 Termination Structure for Gallium Nitride Schottky Diode |
05/16/2013 | US20130119393 Vertical Gallium Nitride Schottky Diode |
05/16/2013 | US20130119392 Organic light-emitting display device and method of manufacturing the same |
05/16/2013 | US20130119383 Semiconductor device and electronic unit |
05/16/2013 | US20130119382 Plating Process and Structure |
05/16/2013 | US20130119377 Semiconductor device and method of manufacturing semiconductor device |
05/16/2013 | US20130119375 Semiconductor device and method for manufacturing semiconductor device |
05/16/2013 | US20130119349 Graphene transistor having air gap, hybrid transistor having the same, and methods of fabricating the same |
05/16/2013 | US20130119347 Semiconductor device including group iii-v barrier and method of manufacturing the semiconductor device |
05/16/2013 | US20130119251 Method and apparatus for charged particle beam inspection |
05/16/2013 | US20130118895 Apparatus and method for reactive ion etching |
05/16/2013 | US20130118688 Etching apparatus |
05/16/2013 | US20130118536 Ultrasonic precision cleaning apparatus |
05/16/2013 | US20130118404 Methods and Systems for Forming Thin Films |
05/16/2013 | DE112011102417T5 Herstellung von polykristallinem Silizium Producing polycrystalline silicon |
05/16/2013 | DE112011102300T5 Verfahren zur elektrolytischen Abscheidung von Gallium- und Galliumlegierungs-Dünnschichten und zugehöriger Photovoltaikstrukturen A method for the electrolytic deposition of gallium and Galliumlegierungs thin films and related photovoltaic structures |
05/16/2013 | DE112011101976T5 Verfahren für das selektive Ätzen eines Isolatorstapels für einen Metallverbinder Method for the selective etching of an insulator stack for a metal connector |
05/16/2013 | DE112010005681T5 Leistungshalbleiterbauteil Power semiconductor component |