| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/23/1997 | CN1148275A Thin film piezoelectric arrays with enhanced coupling and fabrication methods |
| 04/23/1997 | CN1148274A Trench DMOS and method of fabricating the same |
| 04/23/1997 | CN1148273A Transistor in semiconductor device and method of making the same |
| 04/23/1997 | CN1148272A Transistor in semiconductor device and method of making the same |
| 04/23/1997 | CN1148271A Semiconductor device and method of mfg. the same |
| 04/23/1997 | CN1148270A Semiconductor package and mounting method |
| 04/23/1997 | CN1148269A Method of Mfg. Semiconductor device |
| 04/23/1997 | CN1148268A Die bonding device |
| 04/23/1997 | CN1148267A Improved method of die attach |
| 04/23/1997 | CN1148264A Method of planarizing film of semiconductor device |
| 04/23/1997 | CN1148263A Method for mfg. semiconductor device |
| 04/23/1997 | CN1148262A Semiconductor device and method for mfg. same |
| 04/23/1997 | CN1148261A Method for fabricating semiconductor device |
| 04/23/1997 | CN1148260A Method for forming contact holes of semiconductor device |
| 04/23/1997 | CN1148188A Method and compositions for diffusion patterning |
| 04/23/1997 | CN1148105A Plasma etching apparatus utilizing plasma confinement |
| 04/23/1997 | CN1148104A Cleaning system and method |
| 04/23/1997 | CN1148103A Process for eliminating dislocations in neck of silicon single crystal |
| 04/23/1997 | CN1034703C Heterojunction bipolar transistors |
| 04/23/1997 | CN1034702C Microelectronic device package contg. liquid, and method for mfg. same |
| 04/23/1997 | CN1034699C Process for simulating shapes |
| 04/22/1997 | US5623529 SOR exposure system and mask manufactured thereby |
| 04/22/1997 | US5623443 Scalable EPROM array with thick and thin non-field oxide gate insulators |
| 04/22/1997 | US5623442 Memory cells and memory devices with a storage capacitor of parasitic capacitance and information storing method using the same |
| 04/22/1997 | US5623439 For storing information in the form of ferroelectric polarization |
| 04/22/1997 | US5623343 For exposing a pattern of a photo-mask on a photosensitive substrate |
| 04/22/1997 | US5623243 Semiconductor device having polycrystalline silicon layer with uneven surface defined by hemispherical or mushroom like shape silicon grain |
| 04/22/1997 | US5623231 Push-pull power amplifier |
| 04/22/1997 | US5623215 Testing of semiconductor devices |
| 04/22/1997 | US5623214 Multiport membrane probe for full-wafer testing |
| 04/22/1997 | US5623213 Membrane probing of circuits |
| 04/22/1997 | US5623167 Semiconductor device |
| 04/22/1997 | US5623166 Interconnectors |
| 04/22/1997 | US5623165 Insulated gate field effect semiconductor device and forming method thereof |
| 04/22/1997 | US5623164 Integrated semiconductor circuit or micromechanical component and process therefore |
| 04/22/1997 | US5623163 Leadframe for semiconductor devices |
| 04/22/1997 | US5623162 Lead frame having cut-out wing leads |
| 04/22/1997 | US5623161 Electronic element and method of producing same |
| 04/22/1997 | US5623159 For a semiconductor device |
| 04/22/1997 | US5623157 Semiconductor device having a lead including aluminum |
| 04/22/1997 | US5623155 MOSFET on SOI substrate |
| 04/22/1997 | US5623154 Semiconductor device having triple diffusion |
| 04/22/1997 | US5623153 Sub-quarter micrometer channel field effect transistor having elevated source/drain areas and lightly doped drains |
| 04/22/1997 | US5623152 Insulated gate semiconductor device |
| 04/22/1997 | US5623123 Semiconductor device package with small die pad and method of making same |
| 04/22/1997 | US5623015 Blend of conjugated diene, vinyl substituted aromatic monomer, acrylamide, and n-methylolacrylamide |
| 04/22/1997 | US5623006 Solder interconnection |
| 04/22/1997 | US5622902 Passivation/patterning of PZR diamond films for high temperature operability |
| 04/22/1997 | US5622900 Wafer-like processing after sawing DMDs |
| 04/22/1997 | US5622899 Method of fabricating semiconductor chips separated by scribe lines used for endpoint detection |
| 04/22/1997 | US5622898 Process of making an integrated circuit chip composite including parylene coated wire |
| 04/22/1997 | US5622896 Method of manufacturing a thin silicon-oxide layer |
| 04/22/1997 | US5622895 Metallization for polymer-dielectric multichip modules |
| 04/22/1997 | US5622894 Vapor depositing a tungsten layer using tunsten hexafluoride and silane to fill the hole, selective dry etching to remove most of tungsten layer form areas out side the contact hole forming a tungsten plug in contact hole without seam |
| 04/22/1997 | US5622893 Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes |
| 04/22/1997 | US5622892 Buried under quartz and polyimide |
| 04/22/1997 | US5622891 Method of manufacturing semiconductor device with reduced side gate effect |
| 04/22/1997 | US5622890 Method of making contact regions for narrow trenches in semiconductor devices |
| 04/22/1997 | US5622889 High capacitance capacitor manufacturing method |
| 04/22/1997 | US5622888 Method of manufacturing a semiconductor device |
| 04/22/1997 | US5622886 Method of making a high voltage rectifier for an integrated circuit chip |
| 04/22/1997 | US5622884 Method for manufacturing a semiconductor memory cell and a polysilicon load resistor of the semiconductor memory cell |
| 04/22/1997 | US5622883 Method for manufacturing semiconductor memory device having landing pad |
| 04/22/1997 | US5622882 Method of making a CMOS dynamic random-access memory (DRAM) |
| 04/22/1997 | US5622881 Packing density for flash memories |
| 04/22/1997 | US5622880 Method of making a low power, high performance junction transistor |
| 04/22/1997 | US5622879 Methods for fabricating and operating electrically erasable and programmable integrated circuit memory |
| 04/22/1997 | US5622878 Method of making an integration of high voltage lateral MOS devices in low voltage CMOS architecture using CMOS-compatible process steps |
| 04/22/1997 | US5622877 Nickel barrier |
| 04/22/1997 | US5622875 Method for reclaiming substrate from semiconductor wafers |
| 04/22/1997 | US5622873 Process for manufacturing a resin molded image pick-up semiconductor chip having a window |
| 04/22/1997 | US5622814 Effective photolithographic process without accuracy adjustment photomasks |
| 04/22/1997 | US5622796 Process for producing metrological structures particularly for direct measurement of errors introduced by alignment systems |
| 04/22/1997 | US5622788 Multilayer bonding pad |
| 04/22/1997 | US5622787 Mask for transferring a pattern for use in a semiconductor device and method of manufacturing the same |
| 04/22/1997 | US5622731 Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor |
| 04/22/1997 | US5622653 Mixed oxide containing indium; radiation transparent; liquid crystal displays |
| 04/22/1997 | US5622636 Etch-ending point measuring method for wet-etch process |
| 04/22/1997 | US5622635 Method for enhanced inductive coupling to plasmas with reduced sputter contamination |
| 04/22/1997 | US5622608 Depositing copper and magnesium on substrate, annealing to form inert magnesium oxide layer |
| 04/22/1997 | US5622607 Method of forming an oxide insulating film |
| 04/22/1997 | US5622606 Gas inlet arrangement |
| 04/22/1997 | US5622596 Semiconductors |
| 04/22/1997 | US5622593 Plasma processing apparatus and method |
| 04/22/1997 | US5622590 Semiconductor device and method of manufacturing the same |
| 04/22/1997 | US5622588 Methods of making multi-tier laminate substrates for electronic device packaging |
| 04/22/1997 | US5622586 Method of fabricating device made of thin diamond foil |
| 04/22/1997 | US5622566 Semiconductors |
| 04/22/1997 | US5622565 Reduction of contaminant buildup in semiconductor apparatus |
| 04/22/1997 | US5622559 Method of preparing compound semiconductor |
| 04/22/1997 | US5622400 Apparatus and method for handling semiconductor wafers |
| 04/22/1997 | US5622305 Laser device |
| 04/22/1997 | US5622304 Tape bonding apparatus |
| 04/22/1997 | US5621982 Electronic substrate processing system using portable closed containers and its equipments |
| 04/22/1997 | CA2105236C Method for cutting a wafer hard to cut |
| 04/20/1997 | CA2188196A1 Reticle container with corner holding |
| 04/20/1997 | CA2184629A1 Method and apparatus for ion beam formation in an ion implanter |
| 04/17/1997 | WO1997014185A1 Semiconductor device with a planarized interconnect with poly-plug and self-aligned contacts |
| 04/17/1997 | WO1997014182A1 Process for producing trench insulation in a substrate |
| 04/17/1997 | WO1997014181A1 Process for the production of semi-insulating iron-doped indium phosphide wafers |