| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/09/1997 | CN1147150A Electrode structure, forming method and mounting body for semiconductor device, and semiconductor device |
| 04/09/1997 | CN1147149A Method for making capacitor element |
| 04/09/1997 | CN1147148A Method of manufacturing semiconductor device |
| 04/09/1997 | CN1147147A Method for forming fine patterns of semiconductor device |
| 04/09/1997 | CN1147146A Deprocessing method for analyzing failure in semiconductor device |
| 04/09/1997 | CN1147145A Method for fabricating diffusion barrier metal layer in semiconductor device |
| 04/09/1997 | CN1147144A In situ removal of contaminants from interior surfaces of ion beam implanter |
| 04/09/1997 | CN1147101A Parts testing method |
| 04/09/1997 | CN1147098A Phase shift mask |
| 04/09/1997 | CN1147032A Method for preparing molten silicon melt from polycrystalline silicon charge |
| 04/09/1997 | CN1147026A Method of cleaning vacuum processing apparatus |
| 04/09/1997 | CN1147025A Copper and copper alloy micro-etching agent |
| 04/09/1997 | CN1034533C VLSI static random access memory |
| 04/08/1997 | US5619462 Fault detection for entire wafer stress test |
| 04/08/1997 | US5619447 Ferro-electric memory array architecture and method for forming the same |
| 04/08/1997 | US5619420 Semiconductor cell having a variable transistor width |
| 04/08/1997 | US5619393 High-dielectric-constant material electrodes comprising thin ruthenium dioxide layers |
| 04/08/1997 | US5619376 Illuminating optical apparatus for uniformly illuminating a reticle |
| 04/08/1997 | US5619329 Contactless thickness measuring apparatus and measuring method for the same |
| 04/08/1997 | US5619304 Reduction exposure apparatus with improved resolution characteristic and raised light intensity |
| 04/08/1997 | US5619155 IC-chip operation inhibitor |
| 04/08/1997 | US5619124 Reference voltage generator in a semiconductor integrated device |
| 04/08/1997 | US5619071 For an integrated circuit |
| 04/08/1997 | US5619069 Bipolar device and production thereof |
| 04/08/1997 | US5619065 Semiconductor package and method for assembling the same |
| 04/08/1997 | US5619064 III-V semiconductor gate structure and method of manufacture |
| 04/08/1997 | US5619061 Micromechanical microwave switching |
| 04/08/1997 | US5619057 Complex film overlying a substrate with defined work function |
| 04/08/1997 | US5619056 SRAM semiconductor device |
| 04/08/1997 | US5619055 Semiconductor integrated circuit device |
| 04/08/1997 | US5619054 CMOS transistor and isolated back gate electrodes on an SOI substrate |
| 04/08/1997 | US5619052 Interpoly dielectric structure in EEPROM device |
| 04/08/1997 | US5619051 Semiconductor nonvolatile memory cell |
| 04/08/1997 | US5619048 Semiconductor integrated circuit device |
| 04/08/1997 | US5619045 Thin film transistor |
| 04/08/1997 | US5619044 Comprising crystallizing catalyst promoter |
| 04/08/1997 | US5619017 Microelectronic bonding with lead motion |
| 04/08/1997 | US5618892 2,4-diamino-s-triazinyl group-containing polymer and negative radiation-sensitive resist composition containing the same |
| 04/08/1997 | US5618761 Method of manufacturing a perovskite thin film dielectric |
| 04/08/1997 | US5618760 Method of etching a pattern on a substrate using a scanning probe microscope |
| 04/08/1997 | US5618759 Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof |
| 04/08/1997 | US5618757 Method for improving the manufacturability of the spin-on glass etchback process |
| 04/08/1997 | US5618756 Coating part of substrate with organic material, depositing layer of tungsten silicide which selectively deposits on uncoated part of substrate |
| 04/08/1997 | US5618755 Method of manufacturing a polycide electrode |
| 04/08/1997 | US5618754 Method of fabricating a semiconductor device having an Au electrode |
| 04/08/1997 | US5618753 Method for forming electrodes on mesa structures of a semiconductor substrate |
| 04/08/1997 | US5618752 Method of fabrication of surface mountable integrated circuits |
| 04/08/1997 | US5618751 Method of making single-step trenches using resist fill and recess |
| 04/08/1997 | US5618750 Method of making fuse with non-corrosive termination of corrosive fuse material |
| 04/08/1997 | US5618749 Method of forming a semiconductor device having a capacitor and a resistor |
| 04/08/1997 | US5618748 Manufacturing method of CMOS transistor with no reduction of punch-through voltage |
| 04/08/1997 | US5618747 Process for producing a stacked capacitor having polysilicon with optimum hemispherical grains |
| 04/08/1997 | US5618746 Forming gate insulation film and electrodes, ion implanting, forming insulating film, plug film, diffusing blocking film, conductive layer, dielectric layer |
| 04/08/1997 | US5618745 Method of manufacturing a one transistor one-capacitor memory cell structure with a trench containing a conductor penetrating a buried insulating film |
| 04/08/1997 | US5618743 MOS transistor having adjusted threshold voltage formed along with other transistors |
| 04/08/1997 | US5618742 Method of making flash EPROM with conductive sidewall spacer contacting floating gate |
| 04/08/1997 | US5618741 Manufacture of electronic devices having thin-film transistors |
| 04/08/1997 | US5618739 Method of making light valve device using semiconductive composite substrate |
| 04/08/1997 | US5618738 Manufacturing method for magnetoresistance elements |
| 04/08/1997 | US5618688 Method of forming a monolithic semiconductor integrated circuit having an N-channel JFET |
| 04/08/1997 | US5618655 Solvent extraction using cyclohexane and isopropyl acetate, separating aqueous and organic phases |
| 04/08/1997 | US5618575 Control oxidation of vapor deposition |
| 04/08/1997 | US5618461 Reflectance method for accurate process calibration in semiconductor wafer heat treatment |
| 04/08/1997 | US5618446 Method for forming a step on a deposition surface of a substrate for a superconducting device utilizing an oxide superconductor |
| 04/08/1997 | US5618397 High density, large scale integrated circuits |
| 04/08/1997 | US5618384 Method for forming residue free patterned conductor layers upon high step height integrated circuit substrates using reflow of photoresist |
| 04/08/1997 | US5618383 Narrow lateral dimensioned microelectronic structures and method of forming the same |
| 04/08/1997 | US5618381 Multiple step method of chemical-mechanical polishing which minimizes dishing |
| 04/08/1997 | US5618379 Selective deposition process |
| 04/08/1997 | US5618351 Thermal processing apparatus and process |
| 04/08/1997 | US5618350 Processing apparatus |
| 04/08/1997 | US5618349 Thermal treatment with enhanced intra-wafer, intra-and inter-batch uniformity |
| 04/08/1997 | US5618348 Air elimination system |
| 04/08/1997 | US5618345 Method of producing self-supporting thin film of silicon single crystal |
| 04/08/1997 | US5618227 Apparatus for polishing wafer |
| 04/08/1997 | US5617991 Method for electrically conductive metal-to-metal bonding |
| 04/08/1997 | US5617945 Device transfer mechanism for IC test handler |
| 04/08/1997 | CA2094407C Propylene carbonate recovery process |
| 04/03/1997 | WO1997012504A1 Method for surface mounting a heatsink to a printed circuit board |
| 04/03/1997 | WO1997012502A1 Methods and apparatus for generating plasma |
| 04/03/1997 | WO1997012401A1 A silicide agglomeration fuse device |
| 04/03/1997 | WO1997012399A1 Metal stack for integrated circuit having two thin layers of titanium with dedicated chamber depositions |
| 04/03/1997 | WO1997012396A1 Electrostatic clamping method and apparatus for dielectric workpieces in vacuum processors |
| 04/03/1997 | WO1997012395A1 Circuit having trim pads formed in scribe channel |
| 04/03/1997 | WO1997012394A1 Method of electrically connecting a semiconductor chip to at least one contact surface |
| 04/03/1997 | WO1997012393A1 Capped interlayer dielectric for chemical mechanical polishing |
| 04/03/1997 | WO1997012392A1 Process for cleaning and drying semiconductors and equipment therfor |
| 04/03/1997 | WO1997012391A1 Improved interface between titanium and aluminum-alloy in metal stack for integrated circuit |
| 04/03/1997 | WO1997012390A1 Method of producing a gate electrode |
| 04/03/1997 | WO1997012389A1 Double-spacer technique for forming a bipolar transistor with a very narrow emitter |
| 04/03/1997 | WO1997012388A1 Apparatus and method for making laminated electrical and electronic devices |
| 04/03/1997 | WO1997012341A1 Chip module |
| 04/03/1997 | WO1997012281A1 Process for producing surfactant having a low metal ion level and developer produced therefrom |
| 04/03/1997 | WO1997012082A1 Preparation of a semiconductor thin film |
| 04/03/1997 | WO1997012079A1 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
| 04/03/1997 | WO1997012030A1 Apparatus and methods for active programmable matrix devices |
| 04/03/1997 | WO1997011791A1 Apparatus for cleaning semiconductor wafers |
| 04/03/1997 | WO1997011623A1 Modular system |
| 04/03/1997 | WO1997007536A3 Ridge-shaped laser in a channel |
| 04/03/1997 | WO1996018194A3 Semiconductor memory with non-volatile memory transistor |