Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1997
03/25/1997US5614025 Plasma processing apparatus
03/25/1997US5614019 Masking, etching, vapor deposition
03/25/1997US5614018 Doped barium strontium titanate layer
03/25/1997US5613861 Photolithographically patterned spring contact
03/25/1997US5613821 Cluster tool batchloader of substrate carrier
03/25/1997US5613296 Method for concurrent formation of contact and via holes
03/25/1997CA2080094C Multilayer circuit board with repaired i/o pin and process for repairing i/o pin on multilayer circuit board
03/25/1997CA2066125C Electronic circuits and their fabrication
03/20/1997WO1997010688A1 Method and apparatus for plasma cvd
03/20/1997WO1997010614A1 Enhanced electromigration lifetime of metal interconnection lines
03/20/1997WO1997010613A1 Grinding method of grinding device
03/20/1997WO1997010612A1 Damascene process for reduced feature size
03/20/1997WO1997010606A1 A polysilicon resistor and a method of manufacturing it
03/20/1997WO1997010282A1 Beta-substituted organosilsesquioxanes and use thereof
03/20/1997WO1997010088A2 Process for improving the contrast in the structuring of 3-dimensional surfaces
03/20/1997WO1997010082A1 Wafer gripper
03/20/1997WO1997010079A1 Concentric dual elbow
03/20/1997WO1997006559A3 Process for producing a non-volatile memory cell
03/20/1997WO1997006554A3 Semiconductor device provided with transparent switching element
03/20/1997WO1997004478A3 Plasma treatment apparatus for large area substrates
03/20/1997WO1996038858A3 Method and probe card for testing semiconductor devices
03/20/1997DE19638180A1 Semiconductor on insulator memory device, e.g. DRAM
03/20/1997DE19638160A1 Semiconductor component, e.g. DRAM, manufacturing method
03/20/1997DE19637458A1 Verfahren zur Herstellung eines Zwischenschichtisolationsfilms einer Halbleitervorrichtung A process for preparing an interlayer insulation film of a semiconductor device
03/20/1997DE19637189A1 Semiconductor component, e.g. MISFET
03/20/1997DE19534780A1 Verfahren zum Erzeugen sehr kleiner Strukturweiten auf einem Halbleitersubstrat A method for generating very small feature sizes on a semiconductor substrate
03/20/1997DE19534574A1 Dotierverfahren zur Herstellung von Homoübergängen in Halbleitersubstraten Doping for the production of homo-junctions in semiconductor substrates
03/20/1997DE19534515A1 Identification of faulty parts in a complete layout of components
03/20/1997DE19522923A1 Mfr. of crystalline, amorphous and epitaxial semiconductor layers on substrate
03/20/1997CA2229451A1 A polysilicon resistor and a method of manufacturing it
03/19/1997EP0763894A2 Semiconductor device controllable by field effect with several temperature sensors
03/19/1997EP0763855A2 Asymmetrical FET and method of fabrication
03/19/1997EP0763851A2 Method of forming an asymmetric, graded-channel semiconductor device using a disposable spacer
03/19/1997EP0763850A1 Etch process for forming contacts over a silicide layer
03/19/1997EP0763849A1 Process for preparing thin semiconductor films
03/19/1997EP0763848A2 Refrigeration system and method for cooling a susceptor using a refrigeration system
03/19/1997EP0763829A2 Method for programming a nonvolatile memory
03/19/1997EP0763790A2 Level shifter capable of stably producing a level shifted voltage
03/19/1997EP0763781A2 Antihalation compositions
03/19/1997EP0763735A1 Method for analyzing impurities within silicon wafer
03/19/1997EP0763259A1 Punch-through field effect transistor
03/19/1997EP0763257A2 Method of manufacturing a semiconductor device with a bicmos circuit
03/19/1997EP0763256A2 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH BiCMOS CIRCUIT
03/19/1997EP0763255A1 Substrate anchor for undercut silicon on insulator microstructures
03/19/1997EP0763149A1 Method and apparatus for low temperature deposition of cvd and pecvd films
03/19/1997EP0763147A1 Method and apparatus for producing thin films
03/19/1997EP0763146A1 LOW TEMPERATURE PLASMA-ENHANCED FORMATION OF TiN FILMS
03/19/1997EP0680624B1 Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging and method of fabricating phase shifters with absorbing/attenuating sidewalls
03/19/1997EP0546178B1 Equipment for neutralizing charged material
03/19/1997EP0506926B1 Method and apparatus for forming diffusion junctions in solar cell substrates
03/19/1997EP0497896B1 Non-photographic method for patterning organic polymer films
03/19/1997EP0382360B1 Event qualified testing architecture for integrated circuits
03/19/1997CN1145693A Silicon nitride circuit substrate
03/19/1997CN1145692A Clampless vacuum heat transfer station
03/19/1997CN1145691A Process and device for chemically treating substrates
03/19/1997CN1145534A Flash eeprom cell and manfacturing methods thereof
03/19/1997CN1145533A Method for forming electric circuit
03/19/1997CN1145532A Method for fabricating field oxide layer in semiconductor device
03/19/1997CN1145531A Method and appts. for making silicon chip
03/19/1997CN1145530A Method for forming tungsten wiring
03/19/1997CN1145529A Method of using Ge for silicon/silicon link and preparing silicon components lining chip
03/19/1997CN1145350A Method for reducing shrinkage during firing of ceramic bodies
03/19/1997CN1145336A Method of forming boron phosphorous silicate glass film
03/18/1997US5613181 Co-sintered surface metallization for pin-join, wire-bond and chip attach
03/18/1997US5613140 Quantum dot-tunnel device which can be selectively excited by a first light emitting source and the information thus stored can be read with a second light emitting source
03/18/1997US5613077 Method and circuit for communication between a module and a bus controller in a wafer-scale integrated circuit system
03/18/1997US5613000 Method and apparatus for changing the data setting modes in a bonding machine
03/18/1997US5612914 Asymmetrical non-volatile memory cell, arrays and methods for fabricating same
03/18/1997US5612913 Byte erasable EEPROM fully compatible with a single power supply flash-EPROM process
03/18/1997US5612886 Method and system for dynamic dispatching in semiconductor manufacturing plants
03/18/1997US5612853 Package for a power semiconductor device
03/18/1997US5612851 Guard ring electrostatic chuck
03/18/1997US5612850 Releasing a workpiece from an electrostatic chuck
03/18/1997US5612739 Charge transfer device
03/18/1997US5612643 Semiconductor integrated circuit which prevents malfunctions caused by noise
03/18/1997US5612633 Circuit for simultaneously inputting and outputting signals on a single wire
03/18/1997US5612626 System using induced current for contactless testing of wiring networks
03/18/1997US5612575 Method of connecting the output pads on an integrated circuit chip, and multichip module thus obtained
03/18/1997US5612574 Semiconductor structures using high-dielectric-constant materials and an adhesion layer
03/18/1997US5612573 Electronic package with multilevel connections
03/18/1997US5612572 Semiconductor device with an insulation groove
03/18/1997US5612569 Semiconductor device
03/18/1997US5612565 Semiconductor device having channel boundary with uneven shape
03/18/1997US5612563 Vertically stacked vertical transistors used to form vertical logic gate structures
03/18/1997US5612561 Involatile semiconductor memory
03/18/1997US5612560 Electrode structure for ferroelectric capacitors for integrated circuits
03/18/1997US5612559 Semiconductor device having pillar shaped transistor and a method for manufacturing the same
03/18/1997US5612558 Hemispherical grained silicon on refractory metal nitride
03/18/1997US5612557 Semiconductor device having an inter-layer insulating film disposed between two wiring layers
03/18/1997US5612556 Monolithic integration of microwave silicon devices and low loss transmission lines
03/18/1997US5612553 Semiconductor integrated circuit and method of fabricating same and method of arranging cells
03/18/1997US5612551 AlPSb/InP single heterojunction bipolar transistor on InP substrate for high-speed, high-power applications
03/18/1997US5612546 Thin film transistor structure
03/18/1997US5612539 Method of evaluating lifetime related quality of semiconductor surface
03/18/1997US5612514 For providing electronic/support connections for integrated circuits
03/18/1997US5612513 Article and method of manufacturing an enclosed electrical circuit using an encapsulant
03/18/1997US5612403 Low temperature flexible die attach adhesive and articles using same
03/18/1997US5612304 Mixture includes alkanolamine, amino acid derivative, and polar solvent; photoresist strippers; corrosion resistance
03/18/1997US5612260 Oxidation of silicon carbide to form silicon dioxide
03/18/1997US5612259 Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame