Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1997
03/11/1997US5609720 Thermal control of semiconductor wafer during reactive ion etching
03/11/1997US5609691 Plasma CVD apparatus for forming a thin film of uniform thickness
03/11/1997US5609690 Vacuum plasma processing apparatus and method
03/11/1997US5609689 Vacuum process apparaus
03/11/1997US5609688 Apparatus for producing semiconductor device
03/11/1997US5609514 Wafer chamfering machine
03/11/1997US5609511 Polishing method
03/11/1997US5609459 For batch loading semiconductor wafers
03/11/1997US5609376 Wafer carrier handle assembly
03/11/1997US5609287 Solder material, junctioning method, junction material, and semiconductor device
03/11/1997US5609148 Method and apparatus for dicing semiconductor wafers
03/11/1997US5608974 Steam drying apparatus, cleaning apparatus incorporating the same, and steam drying process
03/11/1997US5608943 Apparatus for removing process liquid
03/06/1997WO1997008925A1 Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate
03/06/1997WO1997008755A1 Off-state gate-oxide field reduction in cmos
03/06/1997WO1997008749A1 Deformable substrate assembly for adhesively bonded electronic device
03/06/1997WO1997008747A1 Method of producing an eeprom semiconductor structure
03/06/1997WO1997008746A1 Container for housing semiconductor wafers, structure for housing semiconductor wafers, and method of putting in and taking out semiconductor wafers
03/06/1997WO1997008745A1 Method and apparatus for peeling protective adhesive tape from semiconductor wafer
03/06/1997WO1997008744A1 Laminate for forming ohmic electrode and ohmic electrode
03/06/1997WO1997008743A1 Low mass susceptor
03/06/1997WO1997008742A1 Procedure for drying silicon
03/06/1997WO1997008741A1 Suction plate for wafer
03/06/1997WO1997008734A1 Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
03/06/1997WO1997008700A1 Reduced area sense amplifier isolation layout in a dynamic ram architecture
03/06/1997WO1997008589A1 Film-stripping process
03/06/1997WO1997008536A1 Ultrafast optical technique for the characterization of altered materials
03/06/1997WO1997008362A1 Method and apparatus for low energy electron enhanced etching of substrates
03/06/1997WO1997008361A1 Surface treatment apparatus using gas jet
03/06/1997WO1997004476A3 Method and apparatus for semiconductor etching and stripping
03/06/1997WO1997003236A3 System and method for thermal processing of a semiconductor substrate
03/06/1997DE19631389A1 Monolithischer spannungsvariabler Kondensator Monolithic voltage variable capacitor
03/06/1997DE19609449A1 HF circuitry with silicon substrate with specific resistance of more than 100 ohms per cm
03/06/1997DE19548056C1 Gate electrode mfg. method for MOS structure
03/06/1997DE19532251A1 Apparatus for diffusion soldering
03/06/1997DE19532250A1 Diffusion soldering of a multi-layered structure
03/06/1997DE19531970A1 Verfahren zur Herstellung einer Verbindung zwischen zumindest zwei elektrischen Leitern, von denen einer auf einem Trägersubstrat angeordnet ist A method for producing a connection between at least two electrical conductors, one of which is arranged on a carrier substrate
03/06/1997DE19524001A1 Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung A method of packaging a pressure-sensitive electronic circuitry on all sides with a sealing Schutzumhäusung
03/06/1997CA2228168A1 Procedure for drying silicon
03/06/1997CA2226520A1 Method for film stripping
03/06/1997CA2203557A1 Multi-layered structure for fabricating an ohmic electrode and ohmic electrode
03/06/1997CA2184435A1 Reflow soldering to mounting pads with vent channels to avoid skewing
03/05/1997EP0760529A2 Lateral IGBT
03/05/1997EP0760528A2 Semiconductor device on silicium base with a high blocking voltage edge termination
03/05/1997EP0760515A2 Method for reading and restoring data in a data storage element
03/05/1997EP0760400A2 Process for producing bismuth compounds, and bismuth compounds
03/05/1997EP0760167A1 Semiconductor structure with one or more lateral highly blocking semiconductor components
03/05/1997EP0760166A1 Gain cell dram structure and process for producing the same
03/05/1997EP0760165A1 Electronic device comprising means for compensating an undesired capacitance
03/05/1997EP0760162A1 Method for production of a structure with a low level of dislocations and having an oxide layer buried in a semiconductor substrate
03/05/1997EP0760161A1 Process for applying a metallisation layer on an insulator and for piercing through-holes in said insulator by means of a single mask
03/05/1997EP0760159A1 Fast magnetic scanning of heavy ion beams
03/05/1997EP0760148A1 Electronic devices comprising an array
03/05/1997EP0760020A1 Device having a switch comprising a chromium layer and method for depositing chromium layers by sputtering
03/05/1997EP0759893A1 Coating of substrates
03/05/1997EP0759845A1 Method and installation for encasing articles
03/05/1997EP0759830A1 Device for holding and guiding a joining component
03/05/1997EP0557318B1 Method of manufacturing semiconductor elements, in particular diodes
03/05/1997EP0514547B1 SEMICONDUCTOR MEMORY HAVING A FERROELECTRIC CAPACITOR AND A TiON BARRIER FILM
03/05/1997EP0388790B1 Method and apparatus for testing high pin count integrated circuits
03/05/1997EP0354226B1 Process for forming isolation regions in a semiconductor substrate
03/05/1997CN1144573A Stabilized amorphous silicon and devices containing same
03/05/1997CN1144406A Planar dielectric line and integrated circuit using the same
03/05/1997CN1144403A Semiconductor diode consisting of groove form casing component and packaging method
03/05/1997CN1144402A High frequency static induction transistor having high output
03/05/1997CN1144401A Semiconductor device and method for fabricating the same
03/05/1997CN1144400A Semiconductor device having bond pad and process for forming the device
03/05/1997CN1144399A Method of cleaning substrate
03/05/1997CN1144398A Rotary type apparatus for processing semiconductor wafers and method of processing semiconductor wafers
03/05/1997CN1144397A Method of manufacturing semiconductor device
03/05/1997CN1144396A Fabricating method of semiconductor device and semiconductor device
03/05/1997CN1144344A Method for forming photoresist pattern
03/05/1997CN1034198C Semiconductor device having double-layered silicide structure
03/04/1997WO1997012162A1 Feed screw and method of forming film of lubricant
03/04/1997USH1637 Laser-assisted fabrication of bipolar transistors in silicon-on-sapphire (SOS)
03/04/1997US5608749 Semiconductor laser diode and semiconductor laser diode array including plated heat sink (PHS) electrode
03/04/1997US5608736 Method and apparatus for a universal programmable boundary scan driver/sensor circuit
03/04/1997US5608638 Device and method for automation of a build sheet to manufacture a packaged integrated circuit
03/04/1997US5608576 Projection method and projection system and mask therefor
03/04/1997US5608575 Image projection method and semiconductor device manufacturing method using the same
03/04/1997US5608569 Method for manufacturing an array of thin film actuated mirrors
03/04/1997US5608557 Circuitry with gate line crossing semiconductor line at two or more channels
03/04/1997US5608492 Scanning type exposure apparatus and method and device manufacturing method
03/04/1997US5608385 Device for determining state of electricity generation of solar battery
03/04/1997US5608340 Four-terminal semiconductor device
03/04/1997US5608338 Evaluating the lifetime and reliability of a TFT in a stress test using gate voltage and temperature measurements
03/04/1997US5608337 Method and apparatus of testing an integrated circuit device
03/04/1997US5608335 Method for the testing of integrated circuit chips and corresponding integrated circuit device
03/04/1997US5608334 Device testing system with cable pivot and method of installation
03/04/1997US5608314 Incremental output current generation circuit
03/04/1997US5608266 Thin film for a multilayer semiconductor device for improving thermal stability and a method thereof
03/04/1997US5608265 Encapsulated semiconductor device package having holes for electrically conductive material
03/04/1997US5608258 MOS precision capacitor with low voltage coefficient
03/04/1997US5608257 Fuse element for effective laser blow in an integrated circuit device
03/04/1997US5608256 Recessed sidewall-sealed and sandwiched poly-buffered LOCOS isolation regions, VLSI structures and methods
03/04/1997US5608254 Method for forming electrical contact to the optical coating of an infrared detector using conductive epoxy
03/04/1997US5608253 Advanced transistor structures with optimum short channel controls for high density/high performance integrated circuits
03/04/1997US5608252 Semiconductor with implanted dielectric layer having patched pin-holes
03/04/1997US5608251 Thin film semiconductor integrated circuit and method of fabricating the same
03/04/1997US5608250 Volatile memory cell with interface charge traps