| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 04/01/1997 | US5616937 Compound semiconductor luminescent device |
| 04/01/1997 | US5616936 Active matrix assembly with signal line crossing to equalize stray capacitance |
| 04/01/1997 | US5616935 Semiconductor integrated circuit having N-channel and P-channel transistors |
| 04/01/1997 | US5616934 Fully planarized thin film transistor (TFT) and process to fabricate same |
| 04/01/1997 | US5616933 Nitride encapsulated thin film transistor fabrication technique |
| 04/01/1997 | US5616931 Semiconductor device |
| 04/01/1997 | US5616927 Frame-supported pellicle for dustproof protection of photomask |
| 04/01/1997 | US5616921 Method of modifying an integrated circuit specimen |
| 04/01/1997 | US5616863 Transducer assembly |
| 04/01/1997 | US5616667 Containing tert-butyl ester of vinylbenzoic acid and anhydride of unsaturated carboxylic acid as monomers, for high resolution photoresists |
| 04/01/1997 | US5616524 Repair method for low noise metal lines in thin film imager devices |
| 04/01/1997 | US5616523 Method of manufacturing sensor |
| 04/01/1997 | US5616520 Semiconductor integrated circuit device and fabrication method thereof |
| 04/01/1997 | US5616519 Non-etch back SOG process for hot aluminum metallizations |
| 04/01/1997 | US5616518 Process for fabricating integrating circuits |
| 04/01/1997 | US5616517 Flip chip high power monolithic integrated circuit thermal bumps and fabrication method |
| 04/01/1997 | US5616513 Shallow trench isolation with self aligned PSG layer |
| 04/01/1997 | US5616512 Power semiconductor devices |
| 04/01/1997 | US5616511 Method of fabricating a micro-trench storage capacitor |
| 04/01/1997 | US5616510 Method for making multimedia storage system with highly compact memory cells |
| 04/01/1997 | US5616509 Method for fabricating a semiconductor device |
| 04/01/1997 | US5616508 High speed bipolar transistor using a patterned etch stop and diffusion source |
| 04/01/1997 | US5616507 Method of manufacturing substrate having semiconductor on insulator |
| 04/01/1997 | US5616506 Semiconductor device having a crystallized silicon thin film in which the crystallization direction is oriented either vertically or horizontally to the current flow direction |
| 04/01/1997 | US5616438 Reticle and a method for measuring blind setting accuracy using the same |
| 04/01/1997 | US5616421 Metal matrix composites containing electrical insulators |
| 04/01/1997 | US5616401 Oxynitride film and its formation method, and method for forming an element isolation oxide film using the oxynitride film |
| 04/01/1997 | US5616257 Wire bonding method and apparatus |
| 04/01/1997 | US5616233 Method for making a fluorinated silicon dioxide layer on silicon substrate by anodic oxidation at room temperature |
| 04/01/1997 | US5616225 Use of multiple anodes in a magnetron for improving the uniformity of its plasma |
| 04/01/1997 | US5616224 Apparatus for reducing the intensity and frequency of arcs which occur during a sputtering process |
| 04/01/1997 | US5616213 Method of dry etching InAlAs and InGaAs lattice matched to InP |
| 04/01/1997 | US5616212 Method for polishing a wafer by supplying surfactant to the rear surface of the wafer |
| 04/01/1997 | US5616208 Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
| 04/01/1997 | US5616206 Method for arranging conductive particles on electrodes of substrate |
| 04/01/1997 | US5616181 MBE apparatus and gas branch piping apparatus |
| 04/01/1997 | US5616178 Method for growth of II-VI compound semiconductors |
| 04/01/1997 | US5616063 For polishing and then washing a workpiece |
| 04/01/1997 | US5616025 Vertical diffusion furnace having improved gas flow |
| 04/01/1997 | US5615988 Wafer transfer system having rotational capability |
| 04/01/1997 | US5615824 Method of making an electrical connection |
| 04/01/1997 | US5615822 Method and apparatus for controlling bonding load of fine lead electrode |
| 04/01/1997 | US5615821 Wire bonding method and apparatus |
| 04/01/1997 | US5615477 Method for interconnecting a flip chip to a printed circuit substrate |
| 04/01/1997 | US5615476 Method for producing identity cards having electronic modules |
| 03/27/1997 | WO1997011591A1 Flexible circuits with bumped interconnection capability |
| 03/27/1997 | WO1997011589A1 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 03/27/1997 | WO1997011588A1 Microelectronic lead structures with dielectric layers |
| 03/27/1997 | WO1997011587A1 Method and device for measuring ion flow in a plasma |
| 03/27/1997 | WO1997011518A1 Semiconductor material, method of producing the semiconductor material, and semiconductor device |
| 03/27/1997 | WO1997011498A1 A varicap diode and method of manufacturing a varicap diode |
| 03/27/1997 | WO1997011497A1 Fabrication method of vertical field effect transistor |
| 03/27/1997 | WO1997011496A1 Semiconductor device, method of producing the same and system using the semiconductor device |
| 03/27/1997 | WO1997011495A1 Device with a p-n junction and a means of reducing the risk of breakdown of the junction |
| 03/27/1997 | WO1997011493A1 Semiconductor memory circuitry |
| 03/27/1997 | WO1997011492A1 Semiconductor device and its manufacture |
| 03/27/1997 | WO1997011490A1 Low rc interconnection |
| 03/27/1997 | WO1997011489A1 Process for generating the source regions of a flash-eeprom storage cell field |
| 03/27/1997 | WO1997011488A1 Interconnect scheme for integrated circuits |
| 03/27/1997 | WO1997011487A1 Semiconductor device and method of producing the same |
| 03/27/1997 | WO1997011486A1 Connecting multiple microelectronic elements with lead deformation |
| 03/27/1997 | WO1997011485A1 Semiconductor device and its manufacturing method |
| 03/27/1997 | WO1997011484A1 Method of modifying an exposed surface of a semiconductor wafer |
| 03/27/1997 | WO1997011483A2 Method of producing very small structural widths on a semiconductor substrate |
| 03/27/1997 | WO1997011482A2 Removal of halogens and photoresist from wafers |
| 03/27/1997 | WO1997011481A2 Doping process for producing homojunctions in semiconductor substrates |
| 03/27/1997 | WO1997011411A1 Avoidance of pattern shortening by using an off axis illumination with twisting dipole and polarizing apertures |
| 03/27/1997 | WO1997011207A1 Dry etching method |
| 03/27/1997 | DE19638433A1 Thin film liquid crystal display of an active type |
| 03/27/1997 | DE19637277A1 Widerstand für eine integrierte Schaltung Resistance for an integrated circuit |
| 03/27/1997 | DE19634125A1 Junction layer in semiconductor component manufacturing method for integrated semiconductor module |
| 03/27/1997 | DE19627630A1 Semiconductor component for e.g. micro computer, memory or gate array |
| 03/27/1997 | DE19614524A1 Plasma installation |
| 03/27/1997 | DE19611959A1 CMOSFET mfr. |
| 03/27/1997 | DE19543389A1 MOSFET with LDD structure manufacturing method |
| 03/27/1997 | DE19535775A1 Anordnung und Verfahren zum elektrischen Verbinden eines Halbleiterchips mit zumindest einer Kontaktfläche Arrangement and method for electrically connecting a semiconductor chip with at least one contact surface |
| 03/27/1997 | DE19535618A1 Microelectronic structure in metal conductive track manufacturing method for DMOS structure |
| 03/27/1997 | DE19535322A1 Anordnung mit einem pn-Übergang und einer Maßnahme zur Herabsetzung der Gefahr eines Durchbruchs des pn-Übergangs Arrangement with a pn junction and a measure to reduce the risk of a breakdown of the pn junction |
| 03/27/1997 | DE19535150A1 Integrated semiconductor circuit with MOSFET manufacturing method |
| 03/27/1997 | DE19535068A1 Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten Coating for the structured production of conductor tracks on the surface of electrically insulating substrates |
| 03/27/1997 | CA2231159A1 Method of modifying an exposed surface of a semiconductor wafer |
| 03/26/1997 | EP0765025A2 Start-up circuit and semiconductor device for such a start-up circuit |
| 03/26/1997 | EP0764988A2 Isolated power transistor |
| 03/26/1997 | EP0764987A2 Rapid-sequence full-frame CCD sensor |
| 03/26/1997 | EP0764986A1 Semiconductor device and method for manufacturing the same |
| 03/26/1997 | EP0764985A2 Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering |
| 03/26/1997 | EP0764983A2 Semiconductor device and method of manufacturing the same |
| 03/26/1997 | EP0764982A1 Process for manufacturing an integrated CMOS circuit |
| 03/26/1997 | EP0764981A2 Application of thin crystalline Si3N4 liners in shallow trench isolation (STI) structures |
| 03/26/1997 | EP0764980A1 Improved local oxidation of silicon |
| 03/26/1997 | EP0764979A2 Electrostatically attracting electrode and a method of manufacture thereof |
| 03/26/1997 | EP0764978A2 Method for bonding electronic components on a substrate by means of pressure sintering |
| 03/26/1997 | EP0764977A2 Method of forming v-shaped grooves in a substrate |
| 03/26/1997 | EP0764976A1 Wafer processing method and equipment |
| 03/26/1997 | EP0764975A1 Process for producing superficial piling-up defects on the backside of semiconductor wafers |
| 03/26/1997 | EP0764974A1 Layer structure having contact hole and method of producing the same |
| 03/26/1997 | EP0764973A2 Processing system |
| 03/26/1997 | EP0764972A2 Apparatus for transferring semiconductor silicon wafers |
| 03/26/1997 | EP0764971A2 Opening and closing device for a container door |
| 03/26/1997 | EP0764969A2 Microwave plasma processing apparatus and microwave plasma processing method |