Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1997
05/22/1997WO1997018584A1 Method for forming bump of semiconductor device
05/22/1997WO1997018583A1 VERY THIN PECVD SiO2 FOR RESISTOR PROTECTION IN 0.5 MICRON AND 0.35 MICRON TECHNOLOGIES
05/22/1997WO1997018582A1 Wafer-cleaning solution and process for the production thereof
05/22/1997WO1997018581A1 Low threshold microcavity light emitter
05/22/1997WO1997018580A1 Carrier tape with adhesive and protective walls
05/22/1997WO1997018344A1 Surface treatment method and device therefor
05/22/1997WO1997018342A1 Coating process and suitable substrate holder
05/22/1997DE19648308A1 Funkkommunikationsmodul Radiocommunication module
05/22/1997DE19648082A1 Verfahren zum Ebnen einer Halbleitereinrichtung A method for planarizing a semiconductor device
05/22/1997DE19647324A1 Laterally diffused MOS transistor device having reduced surface field
05/22/1997DE19646700A1 Vacuum treatment chamber
05/22/1997DE19637163A1 Semiconductor laser production
05/22/1997DE19636232A1 Measurement probe device for generating surface image, esp. for atomic force microscopy
05/22/1997DE19620940A1 Electronic component for e.g. high frequency resonator based on surface acoustic wave
05/22/1997DE19546045C1 Flip-Chip-Verfahren zur Herstellung eines Multichip-Moduls Flip-chip process for producing a multi-chip module
05/21/1997EP0774886A1 Method and apparatus for generating a plasma
05/21/1997EP0774832A1 Quadrature demodulator
05/21/1997EP0774788A1 A PMOS flash memory cell capable of multi-level threshold voltage storage
05/21/1997EP0774786A2 CMOS semiconductor device
05/21/1997EP0774785A2 Electrostatic protection devices for protecting semiconductor integrated circuitry
05/21/1997EP0774784A2 Semiconductor integrated circuit device including protection means
05/21/1997EP0774782A2 Semiconductor power module
05/21/1997EP0774781A2 Method of forming studs within an insulating layer on a semiconductor wafer
05/21/1997EP0774780A1 Manufacturing method of a microelectronic device having on a substrate a plurality of interconnect elements
05/21/1997EP0774779A1 Method of fabricating a micromodule, particularly for chip cards
05/21/1997EP0774778A2 Plasma etch with trifluoroacetic acid and derivatives
05/21/1997EP0774777A1 A method of chemically mechanically polishing an electronic component
05/21/1997EP0774776A2 Process for recovering substrates
05/21/1997EP0774775A1 Method of fabricating semiconductor device and semiconductor device fabricated thereby
05/21/1997EP0774774A2 Thin-plate supporting container
05/21/1997EP0774772A1 Methods for physically etching silicon electrically conducting surfaces
05/21/1997EP0774694A2 Resist removing apparatus
05/21/1997EP0774662A1 Batch manufacturing method for chips having coated selective electrodes
05/21/1997EP0774533A1 Method for depositing Si-O containing coatings
05/21/1997EP0774323A2 Apparatus and method for polishing substrates
05/21/1997EP0774167A1 A power semiconductor device
05/21/1997EP0774165A1 Method of manufacturing a three-dimensional circuit
05/21/1997EP0774164A1 Raised tungsten plug antifuse and fabrication process
05/21/1997EP0774163A1 Reduced leakage antifuse structure and fabrication method
05/21/1997EP0774162A1 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
05/21/1997EP0774161A1 Wafer cushions for wafer shipper
05/21/1997EP0773826A2 Hydrogen torch
05/21/1997EP0750530A4 Low-temperature oxidation at surfaces using ozone decomposition products formed by microwave discharge
05/21/1997EP0745275A4 Diode device to protect metal-oxide-metal capacitors
05/21/1997EP0702797B1 Integrated circuit probing apparatus including a capacitor bypass structure
05/21/1997EP0633997A4 A rapid thermal processing apparatus for processing semiconductor wafers.
05/21/1997CN1150334A Semiconductor apparatus
05/21/1997CN1150332A Semiconductor package apparatus and calculating method for parasitic capacitance created by formed substance
05/21/1997CN1150331A Method of analyzing defects of semiconductor device with three dimensions
05/21/1997CN1150330A Window clamp and method of alignment of lead frame strip utilizing the same
05/21/1997CN1150329A Welding method of element on matrix and apparatus thereof
05/21/1997CN1150328A Method of manufacturing semiconductor chip package
05/21/1997CN1150327A System and method for plasma etching
05/21/1997CN1150326A Method of fabricating specimen for analyzing defects of semiconductor device
05/21/1997CN1150325A Process for fabricating CVD aluminum layer in semiconductor device
05/21/1997CN1150260A Light control means in stepper
05/21/1997CN1150240A Gas recovery unit
05/21/1997CA2190416A1 Electrostatic protection devices for protecting semiconductor integrated circuitry
05/20/1997US5632019 Output buffer with digitally controlled power handling characteristics
05/20/1997US5631911 Integrated test circuit
05/20/1997US5631910 Information processing system provided with self-diagnosing circuit and the self-diagnosing method therefor
05/20/1997US5631804 Contact fill capacitor having a sidewall that connects the upper and lower surfaces of the dielectric and partially surrounds an insulating layer
05/20/1997US5631803 Erosion resistant electrostatic chuck with improved cooling system
05/20/1997US5631773 Image projection method and semiconductor device manufacturing method using the same
05/20/1997US5631731 Method and apparatus for aerial image analyzer
05/20/1997US5631721 Hybrid illumination system for use in photolithography
05/20/1997US5631609 Piezoelectric oscillator, voltage-controlled oscillator and production method thereof
05/20/1997US5631588 Power output stage with limited current absorption during high-impedance phase
05/20/1997US5631578 Programmable array interconnect network
05/20/1997US5631573 Probe-type test handler
05/20/1997US5631547 Power-supply-voltage reduction device, semiconductor integrated circuit device including the reduction device and method of producing electronic device including such devices
05/20/1997US5631502 Multi-chip module
05/20/1997US5631499 Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics
05/20/1997US5631498 Thin film metallization process for improved metal to substrate adhesion
05/20/1997US5631497 Film carrier tape and laminated multi-chip semiconductor device incorporating the same
05/20/1997US5631496 Covering layer of boron-doped, amorphous hydrogenous carbon
05/20/1997US5631495 High performance bipolar devices with plurality of base contact regions formed around the emitter layer
05/20/1997US5631493 Monolithic component including a protection diode in parallel with a plurality of pairs of series diodes
05/20/1997US5631491 Lateral semiconductor device and method of fixing potential of the same
05/20/1997US5631485 ESD and hot carrier resistant integrated circuit structure
05/20/1997US5631484 Method of manufacturing a semiconductor device and termination structure
05/20/1997US5631482 Flash EEPROM memory cell with polysilicon source/drain
05/20/1997US5631481 Flat-cell mask ROM integrated circuit
05/20/1997US5631480 DRAM stack capacitor with ladder storage node
05/20/1997US5631479 Semiconductor device with laminated refractory metal schottky barrier gate electrode
05/20/1997US5631478 Semiconductor integrated circuits with specific pitch multilevel interconnections
05/20/1997US5631477 Quaternary collector InAlAs-InGaAlAs heterojunction bipolar transistor
05/20/1997US5631476 MOS-technology power device chip and package assembly
05/20/1997US5631475 Semiconductor light emitting element
05/20/1997US5631473 Solid state array with supplemental dielectric layer crossover structure
05/20/1997US5631472 Light modulator comprising semiconductor substrate
05/20/1997US5631447 Uses of uniaxially electrically conductive articles
05/20/1997US5631199 Injecting nitrous oxide into furnace loaded with wafers, controlled heating, stabilizing furnace interior with nitrogen gas, injecting ammonia gas, oxidation, purging and heat treatment in nitrogen atmosphere
05/20/1997US5631197 Uniform surface treatment
05/20/1997US5631191 Method for connecting a die to electrically conductive traces on a flexible lead-frame
05/20/1997US5631190 Focusing preferred wavelength laser beam on part of silicon carbide surface to vaporize and cut it, then dry etching to remove by-products from laser cutting
05/20/1997US5631189 Method of forming element isolation region
05/20/1997US5631188 Low voltage coefficient polysilicon capacitor
05/20/1997US5631187 Method for making semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage
05/20/1997US5631186 Method for making a dynamic random access memory using silicon-on-insulator techniques