| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/22/1997 | WO1997018584A1 Method for forming bump of semiconductor device |
| 05/22/1997 | WO1997018583A1 VERY THIN PECVD SiO2 FOR RESISTOR PROTECTION IN 0.5 MICRON AND 0.35 MICRON TECHNOLOGIES |
| 05/22/1997 | WO1997018582A1 Wafer-cleaning solution and process for the production thereof |
| 05/22/1997 | WO1997018581A1 Low threshold microcavity light emitter |
| 05/22/1997 | WO1997018580A1 Carrier tape with adhesive and protective walls |
| 05/22/1997 | WO1997018344A1 Surface treatment method and device therefor |
| 05/22/1997 | WO1997018342A1 Coating process and suitable substrate holder |
| 05/22/1997 | DE19648308A1 Funkkommunikationsmodul Radiocommunication module |
| 05/22/1997 | DE19648082A1 Verfahren zum Ebnen einer Halbleitereinrichtung A method for planarizing a semiconductor device |
| 05/22/1997 | DE19647324A1 Laterally diffused MOS transistor device having reduced surface field |
| 05/22/1997 | DE19646700A1 Vacuum treatment chamber |
| 05/22/1997 | DE19637163A1 Semiconductor laser production |
| 05/22/1997 | DE19636232A1 Measurement probe device for generating surface image, esp. for atomic force microscopy |
| 05/22/1997 | DE19620940A1 Electronic component for e.g. high frequency resonator based on surface acoustic wave |
| 05/22/1997 | DE19546045C1 Flip-Chip-Verfahren zur Herstellung eines Multichip-Moduls Flip-chip process for producing a multi-chip module |
| 05/21/1997 | EP0774886A1 Method and apparatus for generating a plasma |
| 05/21/1997 | EP0774832A1 Quadrature demodulator |
| 05/21/1997 | EP0774788A1 A PMOS flash memory cell capable of multi-level threshold voltage storage |
| 05/21/1997 | EP0774786A2 CMOS semiconductor device |
| 05/21/1997 | EP0774785A2 Electrostatic protection devices for protecting semiconductor integrated circuitry |
| 05/21/1997 | EP0774784A2 Semiconductor integrated circuit device including protection means |
| 05/21/1997 | EP0774782A2 Semiconductor power module |
| 05/21/1997 | EP0774781A2 Method of forming studs within an insulating layer on a semiconductor wafer |
| 05/21/1997 | EP0774780A1 Manufacturing method of a microelectronic device having on a substrate a plurality of interconnect elements |
| 05/21/1997 | EP0774779A1 Method of fabricating a micromodule, particularly for chip cards |
| 05/21/1997 | EP0774778A2 Plasma etch with trifluoroacetic acid and derivatives |
| 05/21/1997 | EP0774777A1 A method of chemically mechanically polishing an electronic component |
| 05/21/1997 | EP0774776A2 Process for recovering substrates |
| 05/21/1997 | EP0774775A1 Method of fabricating semiconductor device and semiconductor device fabricated thereby |
| 05/21/1997 | EP0774774A2 Thin-plate supporting container |
| 05/21/1997 | EP0774772A1 Methods for physically etching silicon electrically conducting surfaces |
| 05/21/1997 | EP0774694A2 Resist removing apparatus |
| 05/21/1997 | EP0774662A1 Batch manufacturing method for chips having coated selective electrodes |
| 05/21/1997 | EP0774533A1 Method for depositing Si-O containing coatings |
| 05/21/1997 | EP0774323A2 Apparatus and method for polishing substrates |
| 05/21/1997 | EP0774167A1 A power semiconductor device |
| 05/21/1997 | EP0774165A1 Method of manufacturing a three-dimensional circuit |
| 05/21/1997 | EP0774164A1 Raised tungsten plug antifuse and fabrication process |
| 05/21/1997 | EP0774163A1 Reduced leakage antifuse structure and fabrication method |
| 05/21/1997 | EP0774162A1 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
| 05/21/1997 | EP0774161A1 Wafer cushions for wafer shipper |
| 05/21/1997 | EP0773826A2 Hydrogen torch |
| 05/21/1997 | EP0750530A4 Low-temperature oxidation at surfaces using ozone decomposition products formed by microwave discharge |
| 05/21/1997 | EP0745275A4 Diode device to protect metal-oxide-metal capacitors |
| 05/21/1997 | EP0702797B1 Integrated circuit probing apparatus including a capacitor bypass structure |
| 05/21/1997 | EP0633997A4 A rapid thermal processing apparatus for processing semiconductor wafers. |
| 05/21/1997 | CN1150334A Semiconductor apparatus |
| 05/21/1997 | CN1150332A Semiconductor package apparatus and calculating method for parasitic capacitance created by formed substance |
| 05/21/1997 | CN1150331A Method of analyzing defects of semiconductor device with three dimensions |
| 05/21/1997 | CN1150330A Window clamp and method of alignment of lead frame strip utilizing the same |
| 05/21/1997 | CN1150329A Welding method of element on matrix and apparatus thereof |
| 05/21/1997 | CN1150328A Method of manufacturing semiconductor chip package |
| 05/21/1997 | CN1150327A System and method for plasma etching |
| 05/21/1997 | CN1150326A Method of fabricating specimen for analyzing defects of semiconductor device |
| 05/21/1997 | CN1150325A Process for fabricating CVD aluminum layer in semiconductor device |
| 05/21/1997 | CN1150260A Light control means in stepper |
| 05/21/1997 | CN1150240A Gas recovery unit |
| 05/21/1997 | CA2190416A1 Electrostatic protection devices for protecting semiconductor integrated circuitry |
| 05/20/1997 | US5632019 Output buffer with digitally controlled power handling characteristics |
| 05/20/1997 | US5631911 Integrated test circuit |
| 05/20/1997 | US5631910 Information processing system provided with self-diagnosing circuit and the self-diagnosing method therefor |
| 05/20/1997 | US5631804 Contact fill capacitor having a sidewall that connects the upper and lower surfaces of the dielectric and partially surrounds an insulating layer |
| 05/20/1997 | US5631803 Erosion resistant electrostatic chuck with improved cooling system |
| 05/20/1997 | US5631773 Image projection method and semiconductor device manufacturing method using the same |
| 05/20/1997 | US5631731 Method and apparatus for aerial image analyzer |
| 05/20/1997 | US5631721 Hybrid illumination system for use in photolithography |
| 05/20/1997 | US5631609 Piezoelectric oscillator, voltage-controlled oscillator and production method thereof |
| 05/20/1997 | US5631588 Power output stage with limited current absorption during high-impedance phase |
| 05/20/1997 | US5631578 Programmable array interconnect network |
| 05/20/1997 | US5631573 Probe-type test handler |
| 05/20/1997 | US5631547 Power-supply-voltage reduction device, semiconductor integrated circuit device including the reduction device and method of producing electronic device including such devices |
| 05/20/1997 | US5631502 Multi-chip module |
| 05/20/1997 | US5631499 Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics |
| 05/20/1997 | US5631498 Thin film metallization process for improved metal to substrate adhesion |
| 05/20/1997 | US5631497 Film carrier tape and laminated multi-chip semiconductor device incorporating the same |
| 05/20/1997 | US5631496 Covering layer of boron-doped, amorphous hydrogenous carbon |
| 05/20/1997 | US5631495 High performance bipolar devices with plurality of base contact regions formed around the emitter layer |
| 05/20/1997 | US5631493 Monolithic component including a protection diode in parallel with a plurality of pairs of series diodes |
| 05/20/1997 | US5631491 Lateral semiconductor device and method of fixing potential of the same |
| 05/20/1997 | US5631485 ESD and hot carrier resistant integrated circuit structure |
| 05/20/1997 | US5631484 Method of manufacturing a semiconductor device and termination structure |
| 05/20/1997 | US5631482 Flash EEPROM memory cell with polysilicon source/drain |
| 05/20/1997 | US5631481 Flat-cell mask ROM integrated circuit |
| 05/20/1997 | US5631480 DRAM stack capacitor with ladder storage node |
| 05/20/1997 | US5631479 Semiconductor device with laminated refractory metal schottky barrier gate electrode |
| 05/20/1997 | US5631478 Semiconductor integrated circuits with specific pitch multilevel interconnections |
| 05/20/1997 | US5631477 Quaternary collector InAlAs-InGaAlAs heterojunction bipolar transistor |
| 05/20/1997 | US5631476 MOS-technology power device chip and package assembly |
| 05/20/1997 | US5631475 Semiconductor light emitting element |
| 05/20/1997 | US5631473 Solid state array with supplemental dielectric layer crossover structure |
| 05/20/1997 | US5631472 Light modulator comprising semiconductor substrate |
| 05/20/1997 | US5631447 Uses of uniaxially electrically conductive articles |
| 05/20/1997 | US5631199 Injecting nitrous oxide into furnace loaded with wafers, controlled heating, stabilizing furnace interior with nitrogen gas, injecting ammonia gas, oxidation, purging and heat treatment in nitrogen atmosphere |
| 05/20/1997 | US5631197 Uniform surface treatment |
| 05/20/1997 | US5631191 Method for connecting a die to electrically conductive traces on a flexible lead-frame |
| 05/20/1997 | US5631190 Focusing preferred wavelength laser beam on part of silicon carbide surface to vaporize and cut it, then dry etching to remove by-products from laser cutting |
| 05/20/1997 | US5631189 Method of forming element isolation region |
| 05/20/1997 | US5631188 Low voltage coefficient polysilicon capacitor |
| 05/20/1997 | US5631187 Method for making semiconductor device having high energy sustaining capability and a temperature compensated sustaining voltage |
| 05/20/1997 | US5631186 Method for making a dynamic random access memory using silicon-on-insulator techniques |