| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/13/1998 | US5706946 Thin-plate supporting container |
| 01/13/1998 | US5706930 Method of and apparatus for transferring circular object |
| 01/13/1998 | US5706843 Substrate rotating device |
| 01/13/1998 | US5706578 Method for producing a three-dimensional circuit arrangement |
| 01/13/1998 | US5706577 No fixture method to cure die attach for bonding IC dies to substrates |
| 01/08/1998 | WO1998001012A1 Plasma etch reactor and method for emerging films |
| 01/08/1998 | WO1998000874A1 Dry etching of transparent electrodes in a low pressure plasma reactor |
| 01/08/1998 | WO1998000872A1 Integrated circuit device and method of making the same |
| 01/08/1998 | WO1998000871A1 Multi-layer film capacitor structures and method |
| 01/08/1998 | WO1998000866A1 Reduced parasitic capacitance semiconductor devices |
| 01/08/1998 | WO1998000863A1 Method for simplifying the manufacture of an interlayer dielectric stack |
| 01/08/1998 | WO1998000862A1 Solid porous insulated conductive lines |
| 01/08/1998 | WO1998000861A1 Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system |
| 01/08/1998 | WO1998000860A1 Method and device for heat-treating single-crystal silicon wafer, single-crystal silicon wafer, and process for producing single-crystal silicon wafer |
| 01/08/1998 | WO1998000859A1 Method and apparatus for etching a semiconductor wafer |
| 01/08/1998 | WO1998000858A1 Plasma etch reactor and method |
| 01/08/1998 | WO1998000857A1 Utilization of miscut substrates to improve relaxed graded silicon-germanium and germanium layers on silicon |
| 01/08/1998 | WO1998000856A1 Varible temperature semiconductor film deposition |
| 01/08/1998 | WO1998000855A1 Adjustable wafer cassette stand |
| 01/08/1998 | WO1998000760A1 Lithography exposure device and lithography procedures |
| 01/08/1998 | WO1998000758A1 Photomask blanks |
| 01/08/1998 | WO1998000576A1 Apparatus and method for high density plasma chemical vapor deposition |
| 01/08/1998 | WO1998000432A1 Platinum source compositions for chemical vapor deposition of platinum |
| 01/08/1998 | WO1998000244A1 Improved post plasma ashing wafer cleaning formulation |
| 01/08/1998 | WO1997039475A3 Installation for wet-treating substrates |
| 01/08/1998 | DE19726077A1 Memory cell structure for MRAM |
| 01/08/1998 | DE19725850A1 Semiconductor component with thin film resistor |
| 01/08/1998 | DE19725808A1 Phase shift mask formation method for transparent substrate |
| 01/08/1998 | DE19706495A1 Semiconductor device production using etch-resist pattern |
| 01/08/1998 | DE19702388A1 Forming aluminium@ plug by selective chemical vapour deposition |
| 01/08/1998 | DE19654703A1 Lead forming and bending mechanism |
| 01/08/1998 | DE19650820A1 Power supply interference signal elimination method in integrated circuit |
| 01/08/1998 | DE19631168C1 Pre-coating substrate holder of graphite |
| 01/08/1998 | DE19626343A1 Producing pin layer sequence on perovskite |
| 01/08/1998 | DE19626176A1 Lithographie-Belichtungseinrichtung und Lithographie-Verfahren Lithography exposure device and lithography method |
| 01/08/1998 | DE19624316A1 Etching alignment marks in silicon layer |
| 01/08/1998 | DE19624315A1 Etching structures in silicon layer |
| 01/08/1998 | CA2259976A1 Plasma etch reactor and method |
| 01/08/1998 | CA2259973A1 Plasma etch reactor and method for emerging films |
| 01/08/1998 | CA2259972A1 Method and apparatus for etching a semiconductor wafer |
| 01/08/1998 | CA2209620A1 Fet input/output pad layout |
| 01/07/1998 | EP0817559A1 Method of positioning ic and ic handler using the same |
| 01/07/1998 | EP0817550A1 Circuit board with improved positioning means |
| 01/07/1998 | EP0817388A2 Logical circuit capable of uniformizing output delays for different inputs |
| 01/07/1998 | EP0817384A2 Square-law clamping circuit |
| 01/07/1998 | EP0817383A2 Driver circuit |
| 01/07/1998 | EP0817279A1 Process for the production of a chalcopyrite structure semiconductor thin film containing a specific dopant |
| 01/07/1998 | EP0817278A2 Memory cell |
| 01/07/1998 | EP0817277A1 TRIAC array with gate reference potential being applied to common backside electrode |
| 01/07/1998 | EP0817275A2 High-frequency FET |
| 01/07/1998 | EP0817274A1 Asymmetric MOS technology power device |
| 01/07/1998 | EP0817272A2 Integrated circuit |
| 01/07/1998 | EP0817271A1 Semiconductor memory device with erasable sectors |
| 01/07/1998 | EP0817270A2 Improved semiconductor memory device including memory cells connected to a ground line |
| 01/07/1998 | EP0817269A2 Wordline layout for semiconductor memory device |
| 01/07/1998 | EP0817268A1 Semiconductor integrated circuit device with digital circuit and analog circuit on common substrate and fabrication process therefor |
| 01/07/1998 | EP0817266A2 Mounting structure for an integrated circuit |
| 01/07/1998 | EP0817264A2 Semiconductor device |
| 01/07/1998 | EP0817261A1 Method for manufacturing plastic package for electronic device having a fully insulated dissipator |
| 01/07/1998 | EP0817260A2 IC package, IC prober and connector and method of forming the same |
| 01/07/1998 | EP0817259A2 Thin film capacitor with resistance measuring element |
| 01/07/1998 | EP0817258A2 Method for manufacturing an interconnection structure in a semiconductor device |
| 01/07/1998 | EP0817257A1 Integrated circuit containing devices dielectrically isolated and junction isloated from a substrate |
| 01/07/1998 | EP0817256A1 A wafer chuck for inducing an electrical bias across wafer heterojunctions |
| 01/07/1998 | EP0817255A2 Dummy wafer |
| 01/07/1998 | EP0817254A2 Semiconductor device and methods for producing and mounting the semiconductor device |
| 01/07/1998 | EP0817253A2 Attaching heat sinks directly to flip chips and ceramic chip carriers |
| 01/07/1998 | EP0817252A2 Method for manufacturing surface channel type P-channel MOS transistor while supressing P-type impurity penetration |
| 01/07/1998 | EP0817251A1 Method of forming a doped silicon oxide film |
| 01/07/1998 | EP0817250A1 Dry etch process control using electrically biased stop junctions |
| 01/07/1998 | EP0817249A2 Capacitor designing method of MOS transistor |
| 01/07/1998 | EP0817248A2 Method of manufacturing SOI substrate |
| 01/07/1998 | EP0817247A1 Process for the fabrication of integrated circuits with contacts self-aligned to active areas |
| 01/07/1998 | EP0817246A2 Apparatus and method for wet cleaning or etching of flat substrates |
| 01/07/1998 | EP0817245A1 Apparatus and method for encapsulating products |
| 01/07/1998 | EP0817237A2 Methods and apparatus for treating workpieces with plasmas |
| 01/07/1998 | EP0817236A2 Plasma etching electrode and process for production thereof |
| 01/07/1998 | EP0817215A2 Capacitor dielectric thick film composition |
| 01/07/1998 | EP0817197A2 Improvements in or relating to integrated circuits |
| 01/07/1998 | EP0816892A2 Catadioptric lens system |
| 01/07/1998 | EP0816461A2 Solvent-free epoxy based adhesives for semiconductor chip attachment and process |
| 01/07/1998 | EP0816457A2 Slurry using Mn oxide abrasives and fabrication process of a semiconductor device using such a polishing slurry |
| 01/07/1998 | EP0816419A2 Ultraviolet-curable polysiloxane composition and method for the formation of cured patterns therefrom |
| 01/07/1998 | EP0815953A2 Method for depositing substituted fluorocarbon polymeric layers |
| 01/07/1998 | EP0815638A1 Transponder for electronic identification system |
| 01/07/1998 | EP0815637A1 Integrated circuit full-wave rectifier |
| 01/07/1998 | EP0815596A1 Improved non-destructively read ferroelectric memory cell |
| 01/07/1998 | EP0815595A1 UNCOOLED YBaCuO THIN FILM INFRARED DETECTOR |
| 01/07/1998 | EP0815594A1 Read-only storage cell arrangement and process for its production |
| 01/07/1998 | EP0815593A2 Solder bump fabrication methods and structure including a titanium barrier layer |
| 01/07/1998 | EP0815592A1 Single-etch stop process for the manufacture of silicon-on-insulator wafers |
| 01/07/1998 | EP0815591A2 Microcircuit via interconnect |
| 01/07/1998 | EP0815590A1 Method for making improved lsco stack electrode |
| 01/07/1998 | EP0815589A2 Process for fabricating layered superlattice materials and making electronic devices including same |
| 01/07/1998 | EP0815588A1 Low temperature process for fabricating layered superlattice materials and making electronic devices including same |
| 01/07/1998 | EP0815587A1 Uv radiation process for making electronic devices having low-leakage-current and low-polarization fatigue |
| 01/07/1998 | EP0815586A1 Integrated circuits having mixed layered superlattice materials and precursor solutions for use in a process of making the same |
| 01/07/1998 | EP0815585A1 Preferential etch of semiconductor substrate with respect to epitaxial layers |
| 01/07/1998 | EP0815565A1 Method and apparatus for micromachining using hard x-rays |
| 01/07/1998 | EP0815522A1 Synthesis shell generation and use in asic design |