| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 02/03/1998 | US5714112 Mixing fine silica powder and fine quartz powder with binder and solvent to from slurry, slip-casting and heating |
| 02/03/1998 | US5714086 Composition for protecting solder interconnection between semiconductor and substrate comprising curable thermosetting propargyl ether-based binder including transition metal curing catalyst, accelerator, filler |
| 02/03/1998 | US5714039 Method for making sub-lithographic images by etching the intersection of two spacers |
| 02/03/1998 | US5714038 Method for forming contact hole of semiconductor device |
| 02/03/1998 | US5714037 Method of improving adhesion between thin films |
| 02/03/1998 | US5714036 Heating semiconductor wafers after etching to evaporate residues of corrosive compounds |
| 02/03/1998 | US5714031 Topology induced plasma enhancement for etched uniformity improvement |
| 02/03/1998 | US5714029 Adhering and fixing a thin adhesive sheet comprising a light permeable support and pressure sensitive acrylic layer which cures by irradiation with light to form three-dimensional network in presence of photopolymeriztion initiator |
| 02/03/1998 | US5714014 Semiconductor heterojunction material |
| 02/03/1998 | US5714011 Heating to dissociate nitrigen trifluoride, mixing with inert gas and flowing over substances to be cleaned to form volatile reaction products, evacuating wastes using vacuum or mechanical pumping |
| 02/03/1998 | US5714010 Process for continuously forming a large area functional deposited film by a microwave PCVD method and an apparatus suitable for practicing the same |
| 02/03/1998 | US5714009 Apparatus for generating large distributed plasmas by means of plasma-guided microwave power |
| 02/03/1998 | US5714006 Method of growing compound semiconductor layer |
| 02/03/1998 | US5714004 Placing seed crystals in bottom of crucible, charging raw material into crucible, heating crucible while controlling temperature of botttom of crucible so seed crystals do not melt |
| 02/03/1998 | US5713791 Modular cleanroom conduit and method for its use |
| 02/03/1998 | US5713717 Multi-substrate feeder for semiconductor device manufacturing system |
| 02/03/1998 | US5713711 Multiple interface door for wafer storage and handling container |
| 02/03/1998 | US5713652 Slide projector mountable light valve display |
| 02/03/1998 | CA2083072C Method for manufacturing polyimide multilayer wiring substrate |
| 02/03/1998 | CA2079725C X-ray mask structure, manufacturing method, x-ray exposure method using same, and device manufactured by using same |
| 02/03/1998 | CA2061119C Method of depositing conductors in high aspect ratio apertures |
| 02/02/1998 | CA2210383A1 Method and apparatus for ion beam neutralization |
| 01/29/1998 | WO1998004004A1 High density trench dmos transistor with trench bottom implant |
| 01/29/1998 | WO1998004000A1 Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
| 01/29/1998 | WO1998003995A1 Semiconductor device |
| 01/29/1998 | WO1998003994A1 Integrated circuit which uses an etch stop for producing staggered interconnect lines |
| 01/29/1998 | WO1998003993A1 Method of reducing via and contact dimensions beyond photolithography equipment limits |
| 01/29/1998 | WO1998003992A1 Method of filling trenches in a substrate |
| 01/29/1998 | WO1998003991A2 Method of producing a buried, laterally insulated zone of very high conductivity in a semiconductor substrate |
| 01/29/1998 | WO1998003990A1 Method for mounting encapsulated body on mounting board and optical converter |
| 01/29/1998 | WO1998003989A1 Method of reducing mos transistor gate beyond photolithographically patterned dimension |
| 01/29/1998 | WO1998003879A1 Process for testing a product and equipment for carrying out the process |
| 01/29/1998 | WO1998003695A1 Capped porous thin films |
| 01/29/1998 | WO1998003606A1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range |
| 01/29/1998 | WO1998003557A1 Oxygen-curable coating composition |
| 01/29/1998 | WO1998003353A1 Rigid thin windows for vacuum applications |
| 01/29/1998 | WO1998003305A1 Methods and apparatus for the in-process detection of workpieces |
| 01/29/1998 | WO1998003273A1 Wet processing methods for the manufacture of electronic components using sequential chemical processing |
| 01/29/1998 | WO1998003109A1 Charged ion cleaning devices and cleaning system |
| 01/29/1998 | WO1997038447A3 High-voltage lateral mosfet soi device having a semiconductor linkup region |
| 01/29/1998 | DE19730864A1 Neurone MOS transistor |
| 01/29/1998 | DE19730455A1 Light-emitting gallium phosphide element |
| 01/29/1998 | DE19730322A1 Verfahren zum selektiven Abätzen eines Halbleiterbauteils mit einem organischen Material A method for selectively etching a semiconductor device with an organic material |
| 01/29/1998 | DE19727817A1 Threshold voltage control circuit for semiconductor device |
| 01/29/1998 | DE19727247A1 Semiconductor device production using lithographic mask replica |
| 01/29/1998 | DE19713186A1 Semiconductor device for high frequency circuit |
| 01/29/1998 | DE19649410A1 Non volatile memory cell for e.g. flash EEPROM or flash memory card |
| 01/29/1998 | DE19631565A1 Uniform adherent palladium contact bump production |
| 01/29/1998 | DE19630316A1 Electronic component contacting device for function testing |
| 01/29/1998 | DE19630110A1 Schichtaufbau mit einer ferroelektrischen Schicht und Herstellverfahren Layer structure having a ferroelectric layer and manufacturing method |
| 01/29/1998 | DE19630050A1 Photoresist layer mask production method for manufacture of ROM |
| 01/29/1998 | DE19629766A1 Herstellverfahren von Shallow-Trench-Isolationen auf einem Substrat Preparation process of shallow trench isolations on a substrate |
| 01/29/1998 | DE19629705A1 Ultrasonic cleaning especially of wafer |
| 01/29/1998 | DE19628459A1 Halbleiterbauelement mit niedrigem Kontaktwiderstand zu hochdotierten Gebieten Semiconductor component with low contact resistance for highly doped regions |
| 01/29/1998 | CA2261838A1 Method for mounting encapsulated body on mounting board and optical converter |
| 01/29/1998 | CA2259290A1 Oxygen-curable coating composition |
| 01/28/1998 | EP0821427A1 Dielectric line waveguide |
| 01/28/1998 | EP0821425A2 A semiconductor device having a semiconductor switch structure |
| 01/28/1998 | EP0821415A2 A capacitor and method of manufacture thereof |
| 01/28/1998 | EP0821414A1 CMOS compatible EPROM device |
| 01/28/1998 | EP0821413A1 Differential poly-edge oxidation for stable SRAM cells |
| 01/28/1998 | EP0821410A1 Monolithic device associating a high-voltage device and logic devices |
| 01/28/1998 | EP0821409A2 Collar etch method for DRAM cell |
| 01/28/1998 | EP0821408A2 A structure of mounting a semiconductor element onto a substrate and a mounting method thereof |
| 01/28/1998 | EP0821407A2 Semiconductor devices having protruding contacts and method for making the same |
| 01/28/1998 | EP0821406A2 Method of wire bonding an integrated circuit to an ultra-flexible substrate |
| 01/28/1998 | EP0821405A2 MOSFET gate insulation and process for production thereof |
| 01/28/1998 | EP0821404A2 Lift pin and support pin apparatus for a processing chamber |
| 01/28/1998 | EP0821403A2 Semiconductor wafer support with graded thermal mass |
| 01/28/1998 | EP0821402A2 A pad and roller assembly |
| 01/28/1998 | EP0821401A2 Particle monitor and particle-free processing system with particle monitor |
| 01/28/1998 | EP0821397A2 Silicon carbide composite article particularly useful for plasma reactors |
| 01/28/1998 | EP0821396A2 Method and apparatus for measuring etch uniformity of a semiconductor |
| 01/28/1998 | EP0821392A1 Deflection system |
| 01/28/1998 | EP0821274A1 Chemical-sensitization resist composition |
| 01/28/1998 | EP0821216A2 Position detection device |
| 01/28/1998 | EP0821085A1 Apparatus for introducing gas into a rapid thermal processing chamber |
| 01/28/1998 | EP0821084A1 Multi-zone gas flow control in a process chamber |
| 01/28/1998 | EP0820645A1 Bipolar silicon-on-insulator transistor with increased breakdown voltage |
| 01/28/1998 | EP0820644A2 Semiconductor device provided with transparent switching element |
| 01/28/1998 | EP0820642A1 METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR LAYER OF SiC COMPRISING A MASKING STEP |
| 01/28/1998 | EP0820641A1 Method for water vapor enhanced charged-particle-beam machining |
| 01/28/1998 | EP0820640A1 Laser separation of semiconductor elements formed in a wafer of semiconductor material |
| 01/28/1998 | EP0820639A1 Process for passivating a silicon carbide surface against oxygen |
| 01/28/1998 | EP0820638A1 PROCESS FOR PRODUCING AN ELECTRICAL CONTACT ON A SiC SURFACE |
| 01/28/1998 | EP0820637A1 A METHOD FOR INTRODUCTION OF AN IMPURITY DOPANT IN SiC, A SEMICONDUCTOR DEVICE FORMED BY THE METHOD AND A USE OF A HIGHLY DOPED AMORPHOUS LAYER AS A SOURCE FOR DOPANT DIFFUSION INTO SiC |
| 01/28/1998 | EP0820636A1 METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR LAYER OF SiC |
| 01/28/1998 | EP0820359A1 Method and apparatus for circuit board treatment |
| 01/28/1998 | EP0711420B1 Process of manufacturing a silicon semiconductor substrate with an integrated waveguide coupled to an optical fibre |
| 01/28/1998 | EP0654739B1 Automatic repair data editing system associated with repairing system for semiconductor integrated circuit device |
| 01/28/1998 | EP0564660B1 Tray for integrated circuits |
| 01/28/1998 | CN1171858A Wet chemical treatment installation |
| 01/28/1998 | CN1171848A Low metal ions p-cresol oligomers and photosensitive compositions |
| 01/28/1998 | CN1171847A Metal ion reduction using ion exchange resin in polar solvent |
| 01/28/1998 | CN1171800A Isolation of novolak resin by low temp. sub-surface forced steam distillation |
| 01/28/1998 | CN1171631A Semiconductor device with double junction structure |
| 01/28/1998 | CN1171630A Semiconductor device and method of manufacturing same |
| 01/28/1998 | CN1171629A Semiconductor device and method for fabricating same |
| 01/28/1998 | CN1171628A Method for manufacturing semiconductor device |
| 01/28/1998 | CN1171627A Plastic molded type semiconductor device and method of manufacturing same |