Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1998
03/10/1998US5726091 Silicon nitride layer
03/10/1998US5726090 Gap-filling of O3 -TEOS for shallow trench isolation
03/10/1998US5726089 Semiconductor device and method for fabricating the same
03/10/1998US5726088 Method of manufacturing a semiconductor device having a buried insulated gate
03/10/1998US5726087 Method of formation of semiconductor gate dielectric
03/10/1998US5726086 Only one photolithography mask
03/10/1998US5726085 Method of fabricating a dynamic random access memory (DRAM) cell capacitor using hemispherical grain (HSG) polysilicon and selective polysilicon etchback
03/10/1998US5726084 Method for forming integrated circuit structure
03/10/1998US5726083 Process of fabricating dynamic random access memory device having storage capacitor low in contact resistance and small in leakage current through tantalum oxide film
03/10/1998US5726082 Easy control of threshold voltage
03/10/1998US5726081 Method of fabricating metal contact of ultra-large-scale integration metal-oxide semiconductor field effect transistor with silicon-on-insulator structure
03/10/1998US5726080 Method of performing edge-aligned implants
03/10/1998US5726079 Thermally enhanced flip chip package and method of forming
03/10/1998US5726077 Method of producing an electro-optical device
03/10/1998US5726075 Method for fabricating microbump interconnect for bare semiconductor dice
03/10/1998US5726074 Method and apparatus for manufacturing semiconductor device
03/10/1998US5726071 Manufacturing method of CMOS transistor
03/10/1998US5726070 Silicon-rich tunnel oxide formed by oxygen implantation for flash EEPROM
03/10/1998US5726069 Use of oblique implantation in forming emitter of bipolar transistor
03/10/1998US5726067 Method of and apparatus for monitoring etching by-products
03/10/1998US5725996 Phosphorus ester polymer resist composition used in lithographic process
03/10/1998US5725995 Transistors and integrated circuits
03/10/1998US5725994 Containing an acid precursor and a hydroxyl group containing linear polymer
03/10/1998US5725974 Method and apparatus for producing scanning data used to produce a photomask
03/10/1998US5725973 Photo mask and method for manufacturing same
03/10/1998US5725971 Method of manufacturing phase shift masks and a method of manufacturing semiconductor integrated circuit devices
03/10/1998US5725969 Forming a phase-shifting and attenuating layer on a transparent substrate, selectively removing layer to form a halftone and forming a light shielding pattern on layer between transparent regions
03/10/1998US5725948 Polyimide from a bismaleimide and a diamine
03/10/1998US5725914 Process and apparatus for producing a functional structure of a semiconductor component
03/10/1998US5725788 Apparatus and method for patterning a surface
03/10/1998US5725786 Polyimide
03/10/1998US5725753 Apparatus and method for cleaning semiconductor wafers
03/10/1998US5725742 Device for electrolytic oxidation of silicon wafers
03/10/1998US5725740 Eliminating free exposed titanium from an edge of a substrate having sequentially sputtered layers of titanium and titanium nitride thereon
03/10/1998US5725739 Sputtering for forming semiconductor integrated circuits
03/10/1998US5725728 Pellet pick-up device
03/10/1998US5725718 Clamp ring for domed heated pedestal in wafer processing chamber
03/10/1998US5725677 Dry cleaning process for cleaning a surface
03/10/1998US5725674 Device and method for epitaxially growing gallium nitride layers
03/10/1998US5725673 Semiconductor wafer process chamber with susceptor back coating
03/10/1998US5725664 Semiconductor wafer processing apparatus including localized humidification between coating and heat treatment sections
03/10/1998US5725663 Apparatus for control of contamination in spin systems
03/10/1998US5725661 Equipment for producing silicon single crystals
03/10/1998US5725660 Semiconductor single crystal growing apparatus
03/10/1998US5725658 Reducing residual inner stress of gaas
03/10/1998US5725640 Solution containing an acid and a salt of an inorganic or organic nitrogen compound
03/10/1998US5725634 Method for collecting impurities in the atmosphere by state and apparatus for analyzing the same in real time
03/10/1998US5725420 Polishing device having a pad which has grooves and holes
03/10/1998US5725414 Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
03/10/1998US5725347 Carousel pin stacker
03/10/1998US5725101 Thin-plate supporting container
03/10/1998US5725100 Semiconductor wafer case
03/10/1998US5724825 Automatic temperature controlling system
03/10/1998US5724727 Method of forming electronic component
03/10/1998US5724726 Method of making leadframe for lead-on-chip (LOC) semiconductor device
03/06/1998CA2214639A1 Non-corrosive cleaning composition for removing plasma etching residues
03/05/1998WO1998009333A1 Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method
03/05/1998WO1998009332A1 Semiconductor device provided with low melting point metal bumps and process for producing same
03/05/1998WO1998009329A1 Resin-sealed semiconductor device and method of manufacturing the same
03/05/1998WO1998009328A1 Method of partially plating electronic component board
03/05/1998WO1998009326A1 Process for smoothening a substrate surface
03/05/1998WO1998009325A1 A method of advanced trench isolation scaling
03/05/1998WO1998009324A1 A glass/metal package and method for producing the same
03/05/1998WO1998009323A1 Method and device for forming very small ball bump
03/05/1998WO1998009322A1 Method and device for forming a lead frame
03/05/1998WO1998009321A1 Process for selective application of solder
03/05/1998WO1998009320A1 Surface treatment for micromachining
03/05/1998WO1998009319A2 Electronic device manufacture
03/05/1998WO1998009318A1 Conductive layer with anti-reflective surface portion
03/05/1998WO1998009299A1 Electroceramic component and method for its manufacture
03/05/1998WO1998009097A1 A roller positioning apparatus
03/05/1998WO1998008937A1 Method for sorting antifungal molecules acting on the glucanosyltransferase activity
03/05/1998WO1998008780A1 Unibody crucible and effusion source employing such a crucible
03/05/1998WO1998008754A1 Compliant process cassette
03/05/1998WO1998008664A1 Method for obtaining a wafer in semiconducting material of large dimensions and use of the resulting wafer for producing substrates of the semiconductor on insulator type
03/05/1998WO1998008622A1 Roller with treading and system including same
03/05/1998WO1998008418A1 A brush assembly apparatus
03/05/1998WO1998005076A3 Semiconductor component for high voltage
03/05/1998WO1998005066A3 Methods and apparatus for the in-process detection and measurement of thin film layers
03/05/1998WO1998002924A3 Sic semiconductor device comprising a pn junction with a voltage absorbing edge
03/05/1998DE19738149A1 Solid state electrolytic capacitor
03/05/1998DE19737372A1 Flüssigkristallanzeige und Herstellungsverfahren dafür Liquid crystal display and manufacturing method thereof
03/05/1998DE19734512A1 Semiconductor device especially integrated memory circuit
03/05/1998DE19714687A1 Semiconductor component with conductive film on semiconductor substrate
03/05/1998DE19709246A1 High surface planarity phase shifting mask
03/05/1998DE19708031A1 RAM with field regions in semiconductor substrate
03/05/1998DE19708003A1 Method of analysing failure or faults in measured semiconductor device
03/05/1998DE19706533A1 Semiconductor component with electric separation of adjacent element forming regions
03/05/1998DE19700672A1 Semiconductor component with substrate with two main surfaces
03/05/1998DE19652254C1 Marking device for identifying integrated electronic component connections
03/05/1998DE19640271C1 Verfahren zur Herstellung einer integrierten Halbleiterspeicheranordnung A process for producing an integrated semiconductor memory arrangement
03/05/1998DE19640213C1 Speicheranordnung mit selbstjustierender nicht integrierter Kondensatoranordnung Memory device having self-aligned non-integrated capacitor arrangement
03/05/1998DE19635816A1 Conductivity adjustment in semiconductor doped surface layers
03/05/1998DE19634841A1 Verfahren zum Planarisieren einer Substratoberfläche A method of planarizing a substrate surface
03/05/1998DE19634646A1 Verfahren zur selektiven Belotung Process for the selective Belotung
03/05/1998DE19634498A1 Elektro-keramisches Bauelement und Verfahren zu seiner Herstellung Electro-ceramic device and process for its preparation
03/05/1998CA2264129A1 Electroceramic component and method for its manufacture
03/05/1998CA2213840A1 Method of forming power semiconductor devices with controllable integrated buffer
03/04/1998EP0827282A1 Connection configuration for reducing noise radiation in an integrated circuit
03/04/1998EP0827212A2 Method of fabricating integrated thin film solar cells
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