Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/1999
01/12/1999US5858808 Process and auxiliary device for fabricating semiconductor devices
01/12/1999US5858807 Method of manufacturing liquid crystal display device
01/12/1999US5858806 Method of bonding IC component to flat panel display
01/12/1999US5858627 Image formation utilizing photosensitive compositions containing low metal content p-cresol oligomers
01/12/1999US5858625 Projecting exposure light transmitted through phase shifting mask onto photoresist placed on film to be etched for photosensitizing photoresist
01/12/1999US5858623 Ion implanted patterned photoresist layer will not substantially outgas when it is exposed to a second ion beam
01/12/1999US5858620 Semiconductor device and method for manufacturing the same
01/12/1999US5858605 Photoresist coating comprising alkali soluble resin and photoactive compound, reaction product of vinyl ether and ortho-naphthoquinonediazide sulfonyl compound, dissolved in solvent
01/12/1999US5858590 Method for forming photoresist patterns
01/12/1999US5858587 Positioning system and method and apparatus for device manufacture
01/12/1999US5858578 Photo masks for developing planar layers in a semiconductor device, and methods of forming the same
01/12/1999US5858577 Comprises a light transmitting substrate; a light shielding layer comprising an inorganic material formed on the light transmitting substrate; and a phase transition layer formed on the light shielding layer
01/12/1999US5858576 Mask comprising substrate having front and rear surfaces and window, self-supportive absorber film with pattern in region corresponding to window which can be transferred to object by photons irradiated through window
01/12/1999US5858547 Novolac polymer planarization films for microelectronic structures
01/12/1999US5858475 Dispersing coating upon substrate mounted on rotatable chuck; planarizing top surface of coating through agitation by ultrasonic waves
01/12/1999US5858473 Forming transparent film covering semiconductor film over substrate, ion doping semiconductor film with phosphorus, irradiating with beam of excimer laser pulses to activate phosphorus
01/12/1999US5858471 Selective plasma deposition
01/12/1999US5858464 Methods and apparatus for minimizing excess aluminum accumulation in CVD chambers
01/12/1999US5858259 Plasma processing apparatus and method
01/12/1999US5858258 Plasma processing method
01/12/1999US5858257 Method for wet etching and device used therein
01/12/1999US5858184 Sputtering titanium layer on substrate, forming titanium oxide layer, sputtering titanium nitride layer
01/12/1999US5858183 Titanium nitride
01/12/1999US5858162 Plasma processing apparatus
01/12/1999US5858149 Conducting a multistep curing of epoxy in epoxy applying step by performing a precuring prior to performing electrical contact step to relieve the thermal stress of the gold bump
01/12/1999US5858145 Method to control cavity dimensions of fired multilayer circuit boards on a support
01/12/1999US5858112 Rotating and cleaning utilizing a brush which is brought in to contact with the substrate
01/12/1999US5858109 Converting substrate surfaces from a hydrophobic state to a hydrophilic surface state while cleaning the wafer with a brush
01/12/1999US5858108 Removal of particulate contamination in loadlocks
01/12/1999US5858106 Cleaning method for peeling and removing photoresist
01/12/1999US5858103 Vertical wafer boat
01/12/1999US5858100 Substrate holder and reaction apparatus
01/12/1999US5858085 Method for growing a semiconductor single-crystal
01/12/1999US5857898 Method of and apparatus for dressing polishing cloth
01/12/1999US5857889 Vacuum depositing a high density boron film on a substrate surface
01/12/1999US5857848 Transfer apparatus and vertical heat-processing system using the same
01/12/1999US5857827 Cassette chamber
01/12/1999US5857826 Work transporting robot and semiconductor device manufacturing apparatus
01/12/1999US5857667 Vacuum chuck
01/12/1999US5857610 Process and apparatus for forming ball bumps
01/12/1999US5857576 For transporting semiconductor wafers
01/12/1999US5857474 Method of and apparatus for washing a substrate
01/12/1999US5857368 Apparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusion
01/12/1999US5857342 Temperature controlling cryogenic package system
01/12/1999US5857258 Electrical test structure and method for measuring the relative locations of conductive features on an insulating substrate
01/12/1999CA2136805C Diode coupled cmos logic design for quasi-static resistive dissipation with multi-output capability
01/12/1999CA2131670C Electron beam lithography system
01/12/1999CA2127299C Resin coating method for semiconductor laser device capable of coating thinly and uniformly surfaces of a semiconductor laser chip and photodiode chips with a resin
01/12/1999CA2059407C Gaas device fabrication and devices so produced
01/07/1999WO1999000889A1 A method and an apparatus for offsetting plasma bias voltage in bipolar electrostatic chucks
01/07/1999WO1999000853A1 METHOD OF DOPING GaN LAYERS
01/07/1999WO1999000847A1 Sram-cell assembly and method for realising the same
01/07/1999WO1999000842A1 Substrate for mounting semiconductor chips
01/07/1999WO1999000841A1 High dose p+ buried layer structure
01/07/1999WO1999000840A1 Interconnect spacer structures
01/07/1999WO1999000839A1 Dual damascene etch process
01/07/1999WO1999000838A1 Method for fabricating semiconductor integrated circuit device
01/07/1999WO1999000837A1 Vacuum processing chamber workpiece lifter
01/07/1999WO1999000836A1 Method and apparatus for inspection of pin grid array packages for bent leads
01/07/1999WO1999000835A1 Method and apparatus for injection molded flip chip encapsulation
01/07/1999WO1999000834A2 Method and apparatus for injection molded flip chip encapsulation
01/07/1999WO1999000833A1 Self-aligned power field effect transistor in silicon carbide
01/07/1999WO1999000832A1 Methods and apparatus for improving microloading while etching a substrate
01/07/1999WO1999000831A1 Method of manufacturing semiconductor devices
01/07/1999WO1999000830A1 Improved deposition of tungsten nitride using plasma pretreatment in a chemical vapor deposition chamber
01/07/1999WO1999000829A1 Method of producing thin semiconductor film and apparatus therefor
01/07/1999WO1999000828A1 Method of manufacturing semiconductor device
01/07/1999WO1999000827A1 Apparatus for processing workpieces
01/07/1999WO1999000823A1 Toroidal low-field reactive gas source
01/07/1999WO1999000707A1 Developing solution for resists
01/07/1999WO1999000706A1 Transferring a programmable pattern by photon lithography
01/07/1999WO1999000695A1 Wire electrode structure and liquid crystal display employing the structure
01/07/1999WO1999000640A1 Method and device for measuring the concentration of ions implanted in semiconductor materials
01/07/1999WO1999000532A1 Gas injection system for plasma processing apparatus
01/07/1999WO1999000531A1 Method and apparatus for reducing deposition of contaminants
01/07/1999WO1999000530A1 Low temperature chemical vapor deposition process for forming bismuth-containing ceramic thin films useful in ferroelectric memory devices
01/07/1999WO1998038597A3 Data-conversion method for a multibeam laser writer for very complex microlithographic patterns
01/07/1999EP0889687A2 Misinsert sensing in pick and place tooling
01/07/1999EP0889593A1 Programmable logic module for field programmable gate array device
01/07/1999EP0889591A1 Method and corresponding circuit to prevent a parasitic transistor turn on in an output stage of an electronic circuit
01/07/1999EP0889532A1 Capacitance element and method of manufacturing the same
01/07/1999EP0889528A2 Bit line configuration for DRAM
01/07/1999EP0889527A2 Semiconductor device with reduced number of trough holes and method of manufacturing the same
01/07/1999EP0889520A1 Method of fabrication a non-volatile semiconductor memory device with shielded single polysilicon gate memory part
01/07/1999EP0889519A2 An integrated circuit capacitor
01/07/1999EP0889518A1 Method for forming complementary wells and self-aligned trench with a single mask
01/07/1999EP0889517A1 CMOS Integrated circuits with reduced substrate defects
01/07/1999EP0889516A2 Formation of sublithographic features
01/07/1999EP0889515A1 Method and apparatus for conveying thin sheet-like substrate
01/07/1999EP0889514A1 Method for determination of resistivity of N-type silicon epitaxial layer
01/07/1999EP0889513A2 Integrated circuit contact
01/07/1999EP0889512A2 Method for controlling solder bump shape and stand-off height
01/07/1999EP0889511A2 Trench contact process
01/07/1999EP0889510A1 Method and device for heat-treating single-crystal silicon wafer, single-crystal silicon wafer, and process for producing single-crystal silicon wafer
01/07/1999EP0889509A2 Lifetime control for semiconductor devices
01/07/1999EP0889508A2 Mask for the dry etching of an electrode structure
01/07/1999EP0889507A1 Plasma etching process using a flurocarbon and silane
01/07/1999EP0889506A2 Etching process
01/07/1999EP0889505A1 Process for cutting trenches in a single crystal substrate
01/07/1999EP0889504A1 Method of manufacturing MOS transistor gates with a high germanium content