| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/26/1999 | US5862823 Substrate cleaning method and a substrate cleaning apparatus |
| 01/26/1999 | US5862560 Roller with treading and system including the same |
| 01/26/1999 | CA2147401C Surface treatment for silicon substrates |
| 01/26/1999 | CA2133422C Process for producing a strong bond between copper layes and ceramic |
| 01/26/1999 | CA2009068C Trench jfet integrated circuit elements |
| 01/21/1999 | WO1999003313A1 Plasma processing apparatus |
| 01/21/1999 | WO1999003312A1 Method for improved cleaning of substrate processing systems |
| 01/21/1999 | WO1999003308A1 Frequency selected, variable output inductor heater system and method |
| 01/21/1999 | WO1999003204A1 Sr flip flop |
| 01/21/1999 | WO1999003156A1 II-VI SEMICONDUCTOR COMPONENT WITH AT LEAST ONE JUNCTION BETWEEN AN Se-CONTAINING LAYER AND A BeTe CONTAINING LAYER AND METHOD FOR PRODUCING SAID JUNCTION |
| 01/21/1999 | WO1999003152A2 Semiconductor device with memory capacitor and method of manufacturing such a device |
| 01/21/1999 | WO1999003151A2 A process for manufacturing ic-components to be used at radio frequencies |
| 01/21/1999 | WO1999003150A1 Method of filling a recess |
| 01/21/1999 | WO1999003149A1 Semiconductor device having a nitrogen bearing isolation region and process of manufacture thereof |
| 01/21/1999 | WO1999003148A1 Method for minimising corner effect by densifying the insulating layer |
| 01/21/1999 | WO1999003147A1 Thermally insulated integrated circuits |
| 01/21/1999 | WO1999003145A1 Method for making a glued joint between an electronic component and a supporting substrate |
| 01/21/1999 | WO1999003144A1 Method for producing a ii-vi semi-conducting component |
| 01/21/1999 | WO1999003143A1 Patterned copper etch for micron and submicron features, using enhanced physical bombardment |
| 01/21/1999 | WO1999003142A1 Method for optimising the etch rate of a polycrystalline layer |
| 01/21/1999 | WO1999003141A1 Method and apparatus for in situ vapor generation |
| 01/21/1999 | WO1999003140A1 Solutions for cleaning silicon semiconductors or silicon oxides |
| 01/21/1999 | WO1999003139A1 Accommodation case and aligner |
| 01/21/1999 | WO1999003138A1 Substrate cooling system |
| 01/21/1999 | WO1999003137A1 Fuel delivery system and method |
| 01/21/1999 | WO1999003136A1 Two-piece slit valve insert for vacuum processing system |
| 01/21/1999 | WO1999003135A1 Lid assembly |
| 01/21/1999 | WO1999003133A1 Modular architecture for semiconductor wafer fabrication equipment |
| 01/21/1999 | WO1999003132A1 Two-piece slit valve door with molded-in-place seal for a vacuum processing system |
| 01/21/1999 | WO1999003131A1 Apparatus and method for delivering a gas |
| 01/21/1999 | WO1999003130A1 Heat-transfer enhancing features for semiconductor carriers and devices |
| 01/21/1999 | WO1999003129A1 Method for transporting goods and transportation device |
| 01/21/1999 | WO1999003128A2 Singulation system for chip-scale packages |
| 01/21/1999 | WO1999003125A1 Method and apparatus for neutralising space charge in an ion beam |
| 01/21/1999 | WO1999003062A1 Noncontact ic card |
| 01/21/1999 | WO1999003049A1 Method for intelligent data acquisition in a measurement system |
| 01/21/1999 | WO1999003022A1 High efficiency laser pattern generator |
| 01/21/1999 | WO1999002999A1 Spreading resistance profiling system |
| 01/21/1999 | WO1999002996A2 Multiple point position scanning system |
| 01/21/1999 | WO1999002952A1 Apparatus for measuring the temperature of wafers |
| 01/21/1999 | WO1999002757A1 Reflective surface for cvd reactor walls |
| 01/21/1999 | WO1999002756A1 Method and apparatus for fabrication of thin films by chemical vapor deposition |
| 01/21/1999 | WO1999002754A1 Remote plasma cleaning apparatus |
| 01/21/1999 | WO1999002752A1 Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer |
| 01/21/1999 | WO1999002751A1 Automatic positive pressure seal access door |
| 01/21/1999 | WO1999002743A1 Metal article with fine uniform structures and textures and process of making same |
| 01/21/1999 | WO1999002623A1 Composition and method for polishing a composite comprising titanium |
| 01/21/1999 | WO1999002582A1 Acrylic sheet having uniform distribution of coloring and mineral filler before and after thermoforming |
| 01/21/1999 | WO1999002437A1 Method and apparatus for inverting a tray |
| 01/21/1999 | WO1999002436A1 Smif pod storage, delivery and retrieval system |
| 01/21/1999 | WO1999002305A1 Substrate polishing |
| 01/21/1999 | WO1999002304A1 A carrier head with a flexible membrane for a chemical mechanical polishing system |
| 01/21/1999 | WO1999002276A1 Low temperature, high quality silicon dioxide thin films deposited using tetramethylsilane (tms) |
| 01/21/1999 | WO1999002251A2 Bulk chemical delivery system |
| 01/21/1999 | WO1998044552A3 Method of manufacturing a non-volatile memory combining an eprom with a standard cmos process |
| 01/21/1999 | DE19831582A1 Current converter arrangement for AC motor drive |
| 01/21/1999 | DE19827925A1 Silicon carbide semiconductor contacting process |
| 01/21/1999 | DE19731114A1 Protection for a silicone wafer, e.g during etching |
| 01/21/1999 | DE19731075A1 Joining workpieces of metal, metalloid and their compounds |
| 01/21/1999 | DE19730582A1 Photolithographic processing of microelectronic components |
| 01/21/1999 | DE19730581A1 Cleaning silicon wafers with fluid media |
| 01/21/1999 | DE19730118A1 Verfahren und Vorrichtung zur Herstellung einer Chip-Substrat-Verbindung Method and apparatus for producing a chip-substrate connection |
| 01/21/1999 | DE19730083A1 Verfahren zur gezielten Herstellung von n-leitenden Bereichen in Diamantschichten mittels Ionenimplantation A process for the targeted production of n-type regions in diamond layers by ion implantation |
| 01/21/1999 | CA2295990A1 A process for manufacturing ic-components to be used at radio frequencies |
| 01/21/1999 | CA2295567A1 Noncontact ic card |
| 01/21/1999 | CA2295554A1 High efficiency laser pattern generator |
| 01/20/1999 | EP0892446A2 Method of manufacturing an aggregate of semiconductor micro-needles and method of manufacturing a semiconductor device comprising an aggregate of semiconductor micro-needles |
| 01/20/1999 | EP0892445A2 Semiconductor device comprising an aggregate of semiconductor micro-needles |
| 01/20/1999 | EP0892444A2 Semiconductor device comprising an aggregate of semiconductor micro-needles |
| 01/20/1999 | EP0892443A2 Electrode of n-type nitride semiconductor, semiconductor device having the electrode, and method of fabricating the same |
| 01/20/1999 | EP0892442A1 Process for manufacturing a metal-metal capacity in an integrated circuit and corresponding integrated circuit |
| 01/20/1999 | EP0892441A2 Field effect transistor with recessed gate and a method for manufacturing the same |
| 01/20/1999 | EP0892440A1 Controllable conduction device |
| 01/20/1999 | EP0892437A2 Precision capacitor ladder using differential equal-perimeter pairs |
| 01/20/1999 | EP0892436A2 Electrostatic protection structure for MOS circuits |
| 01/20/1999 | EP0892435A1 Integrated semiconductor transistor with current sensing |
| 01/20/1999 | EP0892430A1 Process for manufacturing an integrated circuit comprising an array of memory cells |
| 01/20/1999 | EP0892429A2 Process for semiconductor device fabrication |
| 01/20/1999 | EP0892428A2 Method of producing low resistance contacts between integrated circuit metal levels and structure produced thereby. |
| 01/20/1999 | EP0892427A2 Method of sealing electronic parts with a resin |
| 01/20/1999 | EP0892426A2 Multi-layer approach for optimizing ferroelectric film performance |
| 01/20/1999 | EP0892425A2 Fabriciation method for a platinum-metal pattern by means of a lift-off process |
| 01/20/1999 | EP0892424A2 Use of deuterated materials in semiconductor processing |
| 01/20/1999 | EP0892422A2 Improvements in or relating to plasma reactors |
| 01/20/1999 | EP0892409A2 Semiconductor memory device |
| 01/20/1999 | EP0892275A2 Method and apparatus for testing semiconductor and integrated circuit structures |
| 01/20/1999 | EP0892083A1 Method and apparatus for seasoning a substrate processing chamber |
| 01/20/1999 | EP0892027A1 Drop-resistant conductive epoxy adhesive |
| 01/20/1999 | EP0891957A1 Corrosion-resistant member, wafer-supporting member, and method of manufacturing the same |
| 01/20/1999 | EP0891635A1 REDUCING REVERSE SHORT-CHANNEL EFFECT WITH LIGHT DOSE OF P WITH HIGH DOSE OF As IN N-CHANNEL LDD |
| 01/20/1999 | EP0891634A1 A semiconductor processing method for forming a contact pedestal for a storage node of a capacitor in integrated circuitry |
| 01/20/1999 | EP0891632A1 Calibration standard for calibrating a defect inspection system and a method of forming same |
| 01/20/1999 | EP0891631A1 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits |
| 01/20/1999 | EP0891630A1 Laser diode array packaging |
| 01/20/1999 | EP0891629A1 Coupling system for the transfer of a confined planar object from a containment pod to an object processing unit |
| 01/20/1999 | EP0891311A1 Tape cast silicon carbide dummy wafer |
| 01/20/1999 | EP0651893B1 Hexahydroxybenzophenone sulfonate esters of diazonaphthoquinone sensitizers and positive photoresists employing same |
| 01/20/1999 | EP0557415B1 Process for achieving controlled precipitation profiles in silicon wafers |
| 01/20/1999 | CN1205801A Process for prototyping of mixed signal applications and field programmable system on chip for applying said process |
| 01/20/1999 | CN1205800A Process for producing contacts on electrical components suitable for flip-chip assembly |