| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/19/1999 | US5860585 Substrate for transferring bumps and method of use |
| 01/19/1999 | US5860575 Stability enhancement of molten solder droplets as ejected from a nozzle of droplet pump |
| 01/19/1999 | US5860211 Applying polyimide precursor containing reactive metal salt to integrated circuit chips; curing; forming passivating layer |
| 01/19/1999 | US5860181 Method of and apparatus for cleaning workpiece |
| 01/19/1999 | US5860178 Substrate spin cleaning apparatus |
| 01/19/1999 | CA2125729C Continuous film feed device and method therefor |
| 01/19/1999 | CA2017720C Sog with moisture-resistant protective capping layer |
| 01/19/1999 | CA2017719C Moisture-free sog process |
| 01/14/1999 | WO1999001900A1 Bipolar power transistor and manufacturing method |
| 01/14/1999 | WO1999001899A1 Method of transferring thin film devices, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display, and electronic apparatus |
| 01/14/1999 | WO1999001895A1 Method for rapid thermal processing (rtp) of a silicon substrate |
| 01/14/1999 | WO1999001894A1 Storage assembly for wafers |
| 01/14/1999 | WO1999001893A2 Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method |
| 01/14/1999 | WO1999001892A2 Captured-cell solder printing and reflow methods and apparatuses |
| 01/14/1999 | WO1999001888A1 Apparatus and method for uniform, low-damage anisotropic plasma processing |
| 01/14/1999 | WO1999001887A1 Plasma processing apparatus |
| 01/14/1999 | WO1999001842A1 Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification |
| 01/14/1999 | WO1999001840A1 Method and apparatus for maskless semiconductor and liquid crystal display inspection |
| 01/14/1999 | WO1999001595A1 Method and apparatus for growing thin films |
| 01/14/1999 | WO1999001594A1 Thermal mismatch compensation to produce free standing substrates by epitaxial deposition |
| 01/14/1999 | WO1999001593A2 Elimination of defects in epitaxial films |
| 01/14/1999 | WO1999001586A2 Device for transferring structures |
| 01/14/1999 | WO1999001519A1 Adhesive for semiconductor components |
| 01/14/1999 | DE19830838A1 Semiconductor light emitting diode chip |
| 01/14/1999 | DE19828477A1 Chemical and mechanical (CMP) polisher for microelectronic industry |
| 01/14/1999 | DE19824046A1 Removal of emulsion from semiconductor wafer in chemical-mechanical polishing |
| 01/14/1999 | DE19820319A1 Substrate-supported chip component production |
| 01/14/1999 | DE19813457A1 Non-volatile memory production, e.g. EEPROM |
| 01/14/1999 | DE19810579A1 Integrated semiconductor switching arrangement and Zener diode e.g. for IC voltage regulator |
| 01/14/1999 | DE19807745A1 Semiconductor device with trench structure |
| 01/14/1999 | DE19807012A1 Non-volatile memory array of EEPROM cells |
| 01/14/1999 | DE19807010A1 Non-volatile memory e.g. EEPROM production |
| 01/14/1999 | DE19807009A1 Non volatile memory e.g. EEPROM production |
| 01/14/1999 | DE19756527A1 Wafer with circuit pattern in element forming and peripheral regions |
| 01/14/1999 | DE19755705A1 Double sided lapping method for large sized wafer |
| 01/14/1999 | DE19729714A1 Semiconductor wafer substrate orientation system |
| 01/14/1999 | DE19729578A1 Wire saw |
| 01/14/1999 | DE19729396A1 Elektrischer Kontakt für ein II-VI-Halbleiterbauelement und Verfahren zum Herstellen des elektrischen Kontaktes An electrical contact for a II-VI semiconductor device and method of manufacturing the electrical contact |
| 01/14/1999 | DE19729186A1 Verfahren zum Herstellen eines II-VI-Halbleiter-Bauelements A method of manufacturing a II-VI semiconductor device |
| 01/14/1999 | DE19729073A1 Verfahren zur Herstellung einer Klebeverbindung zwischen einem elektronischen Bauelement und einem Trägersubstrat A process for producing an adhesive connection between an electronic component and a carrier substrate |
| 01/14/1999 | CA2294806A1 Bipolar power transistor and manufacturing method |
| 01/13/1999 | EP0891127A2 TAB circuit protective coating |
| 01/13/1999 | EP0891125A1 Reworkable circuit board assembly including a flip chip |
| 01/13/1999 | EP0891045A1 A coupling charge compensation device for VLSI circuits |
| 01/13/1999 | EP0890994A2 Power MOSFET and fabrication method |
| 01/13/1999 | EP0890992A1 Interconnection track connecting by several levels of metal an isolated gate of a transistor to a discharge diode inside an integrated circuit and method of manufacturing such a track |
| 01/13/1999 | EP0890991A2 A layout design method for a semiconductor device |
| 01/13/1999 | EP0890989A1 Semiconductor device and method for manufacturing thereof |
| 01/13/1999 | EP0890987A2 Fine wire of a gold alloy, method of making the same and its use |
| 01/13/1999 | EP0890985A1 Array of electrically programmable non-volatile semiconductor memory cells comprising ROM memory cells |
| 01/13/1999 | EP0890984A1 Dual damascene structure and method of making it |
| 01/13/1999 | EP0890983A1 Measurement pattern set and method for measuring dimension accuracy and overlay accuracy of circuit pattern |
| 01/13/1999 | EP0890982A2 Process for reinforcing a semiconductor wafer and a reinforced semiconductor wafer |
| 01/13/1999 | EP0890981A1 Enhanced underfill adhesion of flip chips |
| 01/13/1999 | EP0890980A2 Method of making integrated circuit capacitors |
| 01/13/1999 | EP0890979A1 Method for optimisation of the deposition and etching process as a function of the structure of the polycrystalline film to be deposited and etched |
| 01/13/1999 | EP0890978A1 Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and relative sensors |
| 01/13/1999 | EP0890956A2 Semiconductor device having a security circuit for preventing illegal access |
| 01/13/1999 | EP0890945A1 Exposure recording method for optical recording materials |
| 01/13/1999 | EP0890917A2 Impurity quantity transfer device enabling reduction in pseudo diffusion error generated at integral interpolation of impurity quantities and impurity interpolation method thereof |
| 01/13/1999 | EP0890866A2 Display device and electronic watch |
| 01/13/1999 | EP0890843A2 Test socket assembly |
| 01/13/1999 | EP0890662A1 Method and apparatus for manufacturing a silicon single crystal having few crystal defects, and a silicon single crystal and silicon wafers manufactured by the same |
| 01/13/1999 | EP0890657A1 Method of implanting low doses of ions into a substrate |
| 01/13/1999 | EP0890623A1 Coating fluid for low-permittivity silica coating and substrate provided with low-permittivity coating |
| 01/13/1999 | EP0890425A1 Method of resin molding and resin molding machine |
| 01/13/1999 | EP0890191A1 Insulated gate bipolar transistor having a trench and a method for production thereof |
| 01/13/1999 | EP0890189A1 Dynamic feedback electrostatic wafer chuck |
| 01/13/1999 | EP0890188A1 Method of processing a semiconductor wafer for controlling drive current |
| 01/13/1999 | EP0890187A1 A method for producing a semiconductor device by the use of an implanting step and a device produced thereby |
| 01/13/1999 | EP0890186A2 A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR LAYERS OF SiC BY THE USE OF AN IMPLANTING STEP AND A DEVICE PRODUCED THEREBY |
| 01/13/1999 | EP0890185A1 Solid state temperature controlled substrate holder |
| 01/13/1999 | EP0890184A2 A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR LAYER OF SiC AND SUCH A DEVICE |
| 01/13/1999 | EP0890183A2 A FIELD EFFECT TRANSISTOR OF SiC AND A METHOD FOR PRODUCTION THEREOF |
| 01/13/1999 | EP0890137A1 Articulated platform mechanism for laser pattern generation on a workpiece |
| 01/13/1999 | EP0890136A1 Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
| 01/13/1999 | EP0890050A1 Method and apparatus for pressure control in vacuum processors |
| 01/13/1999 | EP0889976A1 Showerhead for uniform distribution of process gas |
| 01/13/1999 | EP0864170A4 Thermal processing apparatus and process |
| 01/13/1999 | EP0740853B1 Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened |
| 01/13/1999 | EP0644953B1 Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten cvd |
| 01/13/1999 | CN1205114A Process for single mask C4 solder bump fabrication |
| 01/13/1999 | CN1204938A Furnace sidewall temperature control system |
| 01/13/1999 | CN1204871A Semiconductor device and method of manufacturing the same |
| 01/13/1999 | CN1204870A Method for fabricating nonvolatile memory device |
| 01/13/1999 | CN1204869A Method for forming dynamic random access storage |
| 01/13/1999 | CN1204868A Method for fabricating nonvolatile memory device |
| 01/13/1999 | CN1204867A Semiconductor device, and method of manufacturing same |
| 01/13/1999 | CN1204866A Method for planarizing semiconductor substrate |
| 01/13/1999 | CN1204865A Improved silica insulation film with reduced dielectric constant and method of forming same |
| 01/13/1999 | CN1204864A Methods for metal etching with reduced sidewall build up during integrated circuit manufacturing |
| 01/13/1999 | CN1204863A Treatment method of semiconductor wafer and the like and treatment system thereof |
| 01/13/1999 | CN1204861A Electrode assembly |
| 01/13/1999 | CN1204860A Partial collective mask for charged particle beam |
| 01/13/1999 | CN1204704A Process and apparatus for producing polycrystalline semiconductor |
| 01/13/1999 | CN1204702A Process for depositing layer of material on substrate and plating system |
| 01/13/1999 | CN1204698A Tunable and removable plasma deposited antireflective coatings |
| 01/13/1999 | CN1041666C EEPROM and method for fabricating the same |
| 01/13/1999 | CN1041665C Method for partition of aperture patterns profile |
| 01/12/1999 | US5859964 System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes |