Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/1999
12/21/1999US6003243 Wafer cleaning apparatus and method thereof
12/21/1999US6003221 Metal matrix composites containing electrical insulators
12/21/1999US6003185 Hesitation free roller
12/16/1999WO1999065136A1 Chuck apparatus for clamping a planar substrate in an electrostatic coating method
12/16/1999WO1999065085A1 Fast luminescent silicon
12/16/1999WO1999065083A1 Semiconductor integrated circuit device and method of its manufacture
12/16/1999WO1999065081A2 Semiconductor arrangement with ohmic contact and a method for contacting a semiconductor arrangement
12/16/1999WO1999065078A2 Semiconductor device
12/16/1999WO1999065075A1 Semiconductor device and method for manufacturing the same
12/16/1999WO1999065074A2 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
12/16/1999WO1999065073A1 Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusions
12/16/1999WO1999065072A1 Electrochemical planarization of metal layers using a bipolar electrode assembly
12/16/1999WO1999065071A1 Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
12/16/1999WO1999065070A2 Method of manufacturing a semiconductor device comprising a mos transistor
12/16/1999WO1999065069A1 Method of ion implantation
12/16/1999WO1999065068A1 Fabrication of gallium nitride semiconductor layers by lateral growth from trench sidewalls
12/16/1999WO1999065067A1 Semiconductor arrangement with ohmic contact and a method for contacting a semiconductor arrangement
12/16/1999WO1999065065A1 Etching process for producing substantially undercut free silicon on insulator structures
12/16/1999WO1999065064A1 Method and device for transferring wafers
12/16/1999WO1999065063A2 Dram storage capacitor
12/16/1999WO1999065061A2 A portable laser cleaning device for semiconductor packaging machines
12/16/1999WO1999065056A1 Chamber having improved process monitoring window
12/16/1999WO1999064940A1 Distributed control system for a semiconductor wafer processing machine
12/16/1999WO1999064932A1 193 nm positive-working photoresist composition
12/16/1999WO1999064880A1 Semiconductor wafer evaluating apparatus and method
12/16/1999WO1999064855A1 Process for monitoring the concentration of metallic impurities in a wafer cleaning solution
12/16/1999WO1999064854A1 Method and apparatus for quantitative sputter target cleanliness characterization
12/16/1999WO1999064838A1 Collector for an automated on-line bath analysis system
12/16/1999WO1999064814A1 Method and apparatus for determining processing chamber cleaning or wafer etching endpoint
12/16/1999WO1999064780A1 Chemical delivery system having purge system utilizing multiple purge techniques
12/16/1999WO1999064647A1 Method and apparatus for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipolar electrode assembly
12/16/1999WO1999064645A1 A method and apparatus for the formation of dielectric layers
12/16/1999WO1999064644A1 Ion energy attenuation
12/16/1999WO1999064643A1 A method and apparatus for forming a ti doped ta205 layer
12/16/1999WO1999064642A1 Method for fabricating metal nanostructures
12/16/1999WO1999064527A1 Composition and method for polishing in metal cmp
12/16/1999WO1999064209A1 Chuck and suction cup for platy material
12/16/1999WO1999064207A1 Prealigner for substrates in a robotic system
12/16/1999WO1999064205A1 Method and apparatus for endpoint detection for chemical mechanical polishing
12/16/1999WO1999064197A1 Feed unit for moving parts
12/16/1999WO1999056324A3 Method for producing contact structures in solar cells
12/16/1999WO1999056157A3 Optical system with anti-reflection coating
12/16/1999WO1997034320A9 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits
12/16/1999DE19925670A1 Electronic ceramic component manufacturing method, such as for laminated capacitor, inductor or LC filter
12/16/1999DE19925655A1 Cleaning device for semiconductor wafers or glass, CD, LCD or printed circuit board substrates
12/16/1999DE19924651A1 Contact fabrication for semiconductor memory device
12/16/1999DE19924076A1 Photo mask production method for producing an electron beam or EB character pattern enables faster production of masks, even when layout data are to be combined
12/16/1999DE19919939A1 IC conductor lines, e.g. DRAM contacts, are formed by a salicide process
12/16/1999DE19919795A1 New photoresist polymer useful for manufacturing semiconductors in the top surface image process
12/16/1999DE19916073A1 Thin film transistor useful in an LCD or an SRAM
12/16/1999DE19910478A1 Conveying procedure of semiconductor wafer, LCD substrate during semiconductor device manufacture
12/16/1999DE19904258A1 Ball grid array semiconductor device e.g. for mobile telephone or personal computer
12/16/1999DE19855602A1 Buffer circuit for digital data using dynamic threshold voltage MOS transistor
12/16/1999DE19854187A1 Semiconductor component trench isolation structure
12/16/1999DE19844405C1 Protection components installation for integrated circuit consisting of standard cells
12/16/1999DE19842683A1 Semiconductor chip lead-frame pre-stage structure
12/16/1999DE19838475A1 Static random access memory (SRAM) cell
12/16/1999DE19826382A1 Anisotropic plasma etching of silicon using sulfur hexafluoride etching gas especially to produce recesses of precise lateral dimensions in silicon wafers
12/16/1999DE19825612A1 Semiconductor device, especially as a CMOS circuit such as a chip card processor, with a polysilicon wiring
12/16/1999DE19825607A1 Integrierte Halbleiterschaltung mit Füllstrukturen A semiconductor integrated circuit with dummy
12/16/1999CA2334175A1 Fast luminescent silicon
12/16/1999CA2333116A1 Chuck apparatus for clamping a planar substrate in an electrostatic coating method
12/16/1999CA2301083A1 Semiconductor device and method for manufacturing the same
12/15/1999EP0964605A2 Low-thermal expansion circuit board and multilayer circuit board
12/15/1999EP0964520A1 Integrated circuit with off chip drivers
12/15/1999EP0964456A2 Deep trench capacitor
12/15/1999EP0964455A1 SOI semiconductor device and method of making the same
12/15/1999EP0964454A1 Field-effect transistor having a lightly doped drain region and method of making the same
12/15/1999EP0964453A2 Article comprising an oxide layer on a GaAs-Based semiconductor body, and method of making the article
12/15/1999EP0964450A1 Integrated semiconductor circuit with pad
12/15/1999EP0964449A2 Integrated semiconductor circuit with dummy features
12/15/1999EP0964448A2 Vertical transistor DRAM cell and method of producing the same
12/15/1999EP0964447A1 Self-aligned local interconnection for cmos and its manufacturing method
12/15/1999EP0964445A2 Stress reduction for flip chip package
12/15/1999EP0964444A2 Semiconductors having denuded zones
12/15/1999EP0964443A2 Method for heat treatment of silicon wafer and silicon wafer
12/15/1999EP0964442A1 Ball arranging substrate for forming bump, ball arranging head, ball arranging device, and ball arranging method
12/15/1999EP0964441A2 Deposition of silicon dioxide and silicon oxynitride using bis(tertiarybutylamino)silane
12/15/1999EP0964440A2 Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus
12/15/1999EP0964439A1 Gas phase removal of SIO2/metallic contaminants from silicon
12/15/1999EP0964438A1 Dry etching method
12/15/1999EP0964437A2 Process for producing semiconductor integrated circuit device and semiconductor integrated circuit device
12/15/1999EP0964436A2 Method for manufacturing SOI wafer and SOI wafer
12/15/1999EP0964435A1 Pre-epitaxial heat treatment method for a silicon epitaxial wafer
12/15/1999EP0964434A2 Adapter device for confinement boxes with at least one flat object in ultra-clean atmosphere
12/15/1999EP0964433A2 Multiple-layered ceramic heater
12/15/1999EP0964426A2 Ion dosage measurement apparatus for an ion beam implanter and method
12/15/1999EP0964425A2 Apparatus for processing a work piece with a uniformly neutralised ion beam
12/15/1999EP0964308A2 Exposure method and apparatus and device manufacturing method using the same
12/15/1999EP0964282A2 Projection exposure apparatus with a catadioptric projection optical system
12/15/1999EP0964083A2 Method and apparatus for growing a compound semiconductor layer
12/15/1999EP0964082A1 Silicon single crystal wafer and a method for producing it
12/15/1999EP0964074A2 Ion implantation control using optical emission spectroscopy
12/15/1999EP0963930A2 Apparatus for grasping and holding a flat substrate
12/15/1999EP0963610A1 Bipolar soi device having a tilted pn-junction, and a method for producing such a device
12/15/1999EP0963609A1 Power/ground metallization routing in a semiconductor device
12/15/1999EP0963608A1 Subscriber interface protection circuit
12/15/1999EP0963606A1 An integrated circuit which uses a recessed local conductor for producing staggered interconnect lines
12/15/1999EP0963604A1 High density plasma oxide gap filled patterned metal layers with improved electromigration resistance
12/15/1999EP0963603A1 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections
1 ... 5596 5597 5598 5599 5600 5601 5602 5603 5604 5605 5606 5607 5608 5609 5610 5611 5612 5613 5614 5615 5616 ... 6590