Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2000
05/09/2000US6059940 Method for fabricating dual layer protective barrier copper metallization
05/09/2000US6059939 Method for high density edge mounting of chips
05/09/2000US6059938 Ionic bombardment from discharge of gas flow onto target plate; then detaching
05/09/2000US6059921 Chemical mechanical polishing apparatus and a polishing cloth for a chemical mechanical polishing apparatus
05/09/2000US6059920 Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method
05/09/2000US6059919 Film-stripping process
05/09/2000US6059917 Control of parallelism during semiconductor die attach
05/09/2000US6059895 Intermetallic on dielectric
05/09/2000US6059893 Method for cleaning a semiconductor wafer
05/09/2000US6059891 Apparatus and method for washing substrate
05/09/2000US6059889 Method for processing a substrate using a system having a roller with treading
05/09/2000US6059888 Double sides scrubbing system
05/09/2000US6059887 Removal metal impurities from interior of semiconductor using melt; diffusion
05/09/2000US6059880 Coating apparatus
05/09/2000US6059879 Method of forming semiconductor wafers, methods of treating semiconductor wafers to alleviate slip generation, ingots of semiconductive material, and wafers of semiconductive material
05/09/2000US6059877 Method for obtaining a wafer in semiconducting material of large dimensions and use of the resulting wafer for producing substrates of the semiconductor on insulator type
05/09/2000US6059872 Smooth titanium nitride films having low resistivity
05/09/2000US6059866 Air washer
05/09/2000US6059846 Bonding wire height inspection device
05/09/2000US6059637 Process for abrasive removal of copper from the back surface of a silicon substrate
05/09/2000US6059624 Screen and driver assembly for screen pixels
05/09/2000US6059567 Semiconductor thermal processor with recirculating heater exhaust cooling system
05/09/2000US6059553 Integrated circuit dielectrics
05/09/2000US6059507 Substrate processing apparatus with small batch load lock
05/09/2000US6059170 Method and apparatus for insulating moisture sensitive PBGA's
05/09/2000US6059168 Wire bond apparatus and method thereof
05/09/2000US6058950 Pressurized liquid-supply and straightening mechanism in a water-flow washing apparatus
05/09/2000US6058947 Contamination monitoring system
05/09/2000US6058945 Cleaning methods of porous surface and semiconductor surface
05/09/2000US6058676 Lid guide for electronic devices
05/09/2000US6058602 Method for encapsulating IC packages with diamond substrate
05/09/2000US6058592 Locator actuation method
05/09/2000US6058544 Scrubbing apparatus and scrubbing method
05/06/2000CA2287791A1 Regulating resistor network, semiconductor device including the resistor network, and method for fabricating the device
05/04/2000WO2000025365A2 Power semiconductor devices having improved high frequency switching and breakdown characteristics
05/04/2000WO2000025363A1 Power component bearing interconnections
05/04/2000WO2000025361A1 Semiconductor device and manufacture thereof
05/04/2000WO2000025360A1 Operating method and device
05/04/2000WO2000025359A1 Method for manufacturing an ic component
05/04/2000WO2000025358A1 Device for providing balls or preforms for making flip-chip connections
05/04/2000WO2000025357A1 Method for self-adjusted tuning of thyristors with sequential triggering
05/04/2000WO2000025355A1 Method for fabricating semiconductor device
05/04/2000WO2000025354A1 Polycrystalline silicon thin film forming method and thin film forming apparatus
05/04/2000WO2000025353A1 Substrate comprising multilayered group iii-nitride semiconductor buffer
05/04/2000WO2000025350A1 Apparatus for and method of manufacturing a semiconductor die carrier
05/04/2000WO2000025349A1 Component affixing method and apparatus
05/04/2000WO2000025348A1 Case for semiconductor wafers
05/04/2000WO2000025347A1 Plasma treatment apparatus and method
05/04/2000WO2000025343A1 Raster scan gaussian beam writing strategy and method for pattern generation
05/04/2000WO2000025181A1 Method for fabricating semiconductor device and method for forming mask suitable therefor
05/04/2000WO2000025178A2 Photoresists and processes for microlithography
05/04/2000WO2000025153A2 Simultaneously achieving circular symmetry and diminishing effects of optical defects and deviations during real time use of optical devices
05/04/2000WO2000025141A1 High density printed circuit board
05/04/2000WO2000024842A1 A chemical mechanical polishing slurry system having an activator solution
05/04/2000WO2000024692A1 Silicon nitride composite substrate
05/04/2000WO2000024687A1 Method and apparatus for cleaning objects using dilute ammonium bearing solutions
05/04/2000WO2000024551A1 Carrier system positioning method
05/04/2000WO2000024550A1 Belt for polishing semiconductors
05/04/2000WO2000024549A2 Stiffly bonded thin abrasive wheel
05/04/2000WO2000005748A3 Blind pin placement on circuit boards
05/04/2000WO1999067087A9 Method of making an adhesive preform lid for electronic devices
05/04/2000WO1999066540A9 An integrated inorganic/organic complementary thin-film transistor circuit and a method for its production
05/04/2000WO1999060607A3 Tool for wafer bonding in a vacuum
05/04/2000WO1999060165A9 Chemically assembled nano-scale devices
05/04/2000WO1999028951A3 Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
05/04/2000DE19947976A1 Semiconductor device e.g. application specific integrated circuit chip, includes macro cell distributed to periphery functional block on semiconductor chip
05/04/2000DE19946112A1 Electron beam test device and adjustment for testing electronic devices accurately determines slice level of S-curve used in determination of secondary electron current
05/04/2000DE19945349A1 Preventing droplet dripping from discharge of electric valve for semiconductor wafer coating with liq.
05/04/2000DE19934031A1 Ohmic contact, especially for p-type gallium nitride, e.g. in LEDs, laser diodes, photodetectors and microelectronic components, is produced by metal thermal oxidation to form a p-type semiconductor oxide
05/04/2000DE19851703A1 Electronic structure, e.g. FET, is produced by plotting, spraying, spin coating or spreading of insulating, semiconducting and-or conductive layers onto a substrate
05/04/2000DE19850078A1 Regelungsverfahren beim Ätzen mit Fluorwasserstoff Regulatory procedure after etching with hydrofluoric
05/04/2000DE19849970A1 Rotary container used in surface treatment of semiconductors has a receptacle for the product, liquid distributor and removal device
05/04/2000DE19848460A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterchips A semiconductor device and method of manufacturing a semiconductor chip
05/04/2000CA2348724A1 Device for providing balls or preforms for making flip-chip connections
05/04/2000CA2346660A1 Stiffly bonded thin abrasive wheel
05/04/2000CA2316302A1 Raster scan gaussian beam writing strategy and method for pattern generation
05/03/2000EP0998170A2 System and process for fabricating an organic electro-luminescent display device
05/03/2000EP0997994A1 Method for manufacturing diffraction gratings and semiconductor laser
05/03/2000EP0997952A2 Semiconductor image position sensitive device
05/03/2000EP0997951A1 Field-effect transistor
05/03/2000EP0997950A2 Method of improving the crystallization of semiconductor films particularly for thin film transistors
05/03/2000EP0997948A2 Semiconductor memory device
05/03/2000EP0997947A1 Trench capacitor DRAM cell
05/03/2000EP0997946A1 Deep divot in shallow trench isolation for a buried-channel PFET
05/03/2000EP0997942A2 Chip Size Semiconductor Package and process for producing it
05/03/2000EP0997940A1 Process for electrically connecting IGBTs mounted on an IC
05/03/2000EP0997939A1 Semiconductor device comprising a lead wire
05/03/2000EP0997937A2 Semiconductor device module with a heat sink
05/03/2000EP0997936A1 Manufacturing method for an IGBT gate electrode
05/03/2000EP0997935A1 Printed wiring board and method for manufacturing the same
05/03/2000EP0997934A2 An electronic component package assembly and method of manufacturing the same
05/03/2000EP0997933A1 Tapered electrode for stacked capacitors
05/03/2000EP0997932A2 Wafer with dielectrically isolated silicon islands and method of manufacturing the same
05/03/2000EP0997931A1 Process for forming an isolating wall in a semiconductor substrate
05/03/2000EP0997930A1 Integration method for sidewall split gate flash transistor
05/03/2000EP0997929A1 Plasma etching of polymer materials
05/03/2000EP0997928A1 Process for fabricating a capacitor
05/03/2000EP0997927A2 Microwave applicator with annular waveguide, plasma processing apparatus having the same, and plasma processing method
05/03/2000EP0997832A2 Simulating method of ion inplantation process in which number of particles can be reduced
05/03/2000EP0997782A1 Reticle having mark for detecting alignment and method for detected alignment
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