| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 07/25/2000 | US6093252 Process chamber with inner support |
| 07/25/2000 | US6093243 Semiconductor device and its fabricating method |
| 07/25/2000 | US6093242 Anisotropy-based crystalline oxide-on-semiconductor material |
| 07/25/2000 | US6093091 Holder for flat subjects in particular semiconductor wafers |
| 07/25/2000 | US6093087 Wafer processing machine and a processing method thereby |
| 07/25/2000 | US6093085 Apparatuses and methods for polishing semiconductor wafers |
| 07/25/2000 | US6093082 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
| 07/25/2000 | US6093081 Polishing method and polishing apparatus using the same |
| 07/25/2000 | US6093080 Polishing apparatus and method |
| 07/25/2000 | US6092981 Modular substrate cassette |
| 07/25/2000 | US6092980 Substrate treatment equipment and method with testing feature |
| 07/25/2000 | US6092971 Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container |
| 07/25/2000 | US6092851 Wafer carrier having both a rigid structure and resistance to corrosive environments |
| 07/25/2000 | US6092786 Gate valve |
| 07/25/2000 | US6092713 Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof |
| 07/25/2000 | US6092542 Cleaning apparatus |
| 07/25/2000 | US6092539 In-situ cleaning apparatuses for wafers used in integrated circuit devices and methods of cleaning using the same |
| 07/25/2000 | US6092538 In a closed recycle system for cleaning semiconductors without using any high pressure generating device |
| 07/25/2000 | US6092537 Post-treatment method for dry etching |
| 07/25/2000 | US6092485 Apparatus and method for processing substrate |
| 07/25/2000 | US6092299 Vacuum processing apparatus |
| 07/25/2000 | US6092280 Flexible interface structures for electronic devices |
| 07/25/2000 | US6092253 Flexible-leaf substrate edge cleaning apparatus |
| 07/21/2000 | CA2296621A1 Ultrasonic vibration cutting method and apparatus |
| 07/20/2000 | WO2000042667A1 A semiconductor device having a metal barrier layer for a dielectric material having a high dielectric constant and a method of manufacture thereof |
| 07/20/2000 | WO2000042665A1 Power mos element and method for producing the same |
| 07/20/2000 | WO2000042662A1 Power semiconductor structural part with a mesa edge |
| 07/20/2000 | WO2000042661A1 Edge termination for a semiconductor component, schottky diode with an end termination and method for producing a schottky diode |
| 07/20/2000 | WO2000042660A1 Ferroelectric memory with ferroelectric thin film and method of fabrication |
| 07/20/2000 | WO2000042657A1 Electronic component and use of a protective structure contained therein |
| 07/20/2000 | WO2000042653A1 Method for protecting an integrated circuit chip |
| 07/20/2000 | WO2000042652A1 Semiconductor device and its production method |
| 07/20/2000 | WO2000042651A1 Semiconductor device |
| 07/20/2000 | WO2000042650A1 Vacuum treatment device |
| 07/20/2000 | WO2000042648A1 Attaching a semiconductor to a substrate |
| 07/20/2000 | WO2000042647A1 Mos transistor and method for making same on a semiconductor substrate |
| 07/20/2000 | WO2000042646A1 Method for structuring a layer |
| 07/20/2000 | WO2000042645A1 Low temperature process for fabricating layered superlattice materials and making electronic devices including same |
| 07/20/2000 | WO2000042644A1 System and method for surface passivation |
| 07/20/2000 | WO2000042643A1 Ferroelectric device with capping layer and method of making same |
| 07/20/2000 | WO2000042642A1 Circuit board production method and its apparatus |
| 07/20/2000 | WO2000042641A1 Method of producing silicon device |
| 07/20/2000 | WO2000042638A2 Device for positioning a wafer |
| 07/20/2000 | WO2000042637A1 Method and device for treating tabular substrates, especially silicon wafers for producing microelectronic elements |
| 07/20/2000 | WO2000042630A1 System for production of large area display panels with improved precision |
| 07/20/2000 | WO2000042621A2 Epitaxial thin films |
| 07/20/2000 | WO2000042614A1 Read/write architecture for a mram |
| 07/20/2000 | WO2000042534A2 Method and arrangement for verifying the layout of an integrated circuit with the aid of a computer and use thereof in the production of an integrated circuit |
| 07/20/2000 | WO2000042475A1 Chemical filtering for optimising the light transmittance of a gas |
| 07/20/2000 | WO2000042474A1 Method for depositing photoresist onto a substrate |
| 07/20/2000 | WO2000042473A1 Multilayer attenuating phase-shift masks |
| 07/20/2000 | WO2000042381A1 Method and device for inspecting objects |
| 07/20/2000 | WO2000042373A1 Method and device for drying substrate |
| 07/20/2000 | WO2000042330A1 Shaft bearing |
| 07/20/2000 | WO2000042239A1 Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system for supplying fluid and exhausting gas |
| 07/20/2000 | WO2000042236A2 Processing system and method for chemical vapor deposition |
| 07/20/2000 | WO2000042235A1 Film forming device |
| 07/20/2000 | WO2000042232A1 Tungsten layer forming method and laminate structure of tungsten layer |
| 07/20/2000 | WO2000042231A2 Polycrystalline silicon germanium films for forming micro-electromechanical systems |
| 07/20/2000 | WO2000041892A1 Thermal transfer element for forming multilayer devices |
| 07/20/2000 | WO2000041855A1 Workpiece handling robot |
| 07/20/2000 | WO2000041854A1 Improved handling of wet thin wafers |
| 07/20/2000 | WO2000041841A1 Conductive leads with non-wettable surfaces |
| 07/20/2000 | WO2000041834A1 Method and device for thermally connecting the contact surfaces of two substrates |
| 07/20/2000 | WO2000041518A2 Electrodeposition chemistry for filling of apertures with reflective metal |
| 07/20/2000 | WO2000041459A2 Semiconductor element with a tungsten oxide layer and method for its production |
| 07/20/2000 | WO2000041456A2 Optical detector with a filter layer made of porous silicon and method for the production thereof |
| 07/20/2000 | WO2000025153A3 Simultaneously achieving circular symmetry and diminishing effects of optical defects and deviations during real time use of optical devices |
| 07/20/2000 | WO2000019510A3 Elevated channel mosfet |
| 07/20/2000 | WO2000003421A9 Improved endpoint detection for substrate fabrication processes |
| 07/20/2000 | DE19963674A1 Oxynitride gate dielectric, especially for a semiconductor memory device, produced by silicon substrate reaction or CVD to form an oxynitride layer and back-oxidation to form an intermediate silicon dioxide layer |
| 07/20/2000 | DE19936777A1 Electronic circuit system for improved signal transmission efficiency has looped macro circuits that forward signals not designated for them, and accept signals that are designated for them |
| 07/20/2000 | DE19901767A1 Verfahren und Vorrichtung zum Testen der Funktion einer Vielzahl von Mikrostrukturelementen Method and device for testing the function of a plurality of micro-structural elements |
| 07/20/2000 | DE19901749A1 Chemical-mechanical wafer polishing pad has angle and depth of curved grooves, which are calculated by boundary layer effect of streamlined groove function, used to design optimum structure for polishing pad |
| 07/20/2000 | DE19901540A1 Verfahren zur Feinabstimmung eines passiven, elektronischen Bauelementes A method for fine tuning of a passive electronic component |
| 07/20/2000 | DE19901088A1 Vorrichtung zum Behandeln eines bandförmigen Substrates mit einem Gas An apparatus for treating a strip-shaped substrate with a gas |
| 07/20/2000 | DE19900970A1 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs |
| 07/20/2000 | DE19900805A1 Production of ultra-pure water in semiconductor plants comprises varying final degree of purity to suit various processes |
| 07/20/2000 | DE19900671A1 System for separating disc-shaped substrates for wafer prodn. etc. which are fixed together in sequence on carrier |
| 07/20/2000 | DE10000690A1 System for determining the yield influence on semiconductor wafers with several matrices in in-line examination and testing |
| 07/20/2000 | DE10000624A1 Double gate MOST production suppresses n-MOS dopant depletion and p-MOS boron penetration and minimizes outwards diffusion of injected gate electrode impurities |
| 07/20/2000 | CA2359832A1 Metal material having formed thereon chromium oxide passive film and method for producing the same, and parts contacting with fluid and system for supplying fluid and exhausting gas |
| 07/20/2000 | CA2355217A1 Optical detector with a filter layer made of porous silicon and method for the production thereof |
| 07/19/2000 | EP1020928A1 Thin film capacitor including an anchored metal plug |
| 07/19/2000 | EP1020927A1 Thin film capacitor comprising a barrier layer between a tantalum pentoxide layer and a copper layer |
| 07/19/2000 | EP1020926A2 Split gate memory cell |
| 07/19/2000 | EP1020923A2 Vertical bipolar transistor and method of manufacturing the same |
| 07/19/2000 | EP1020922A2 Insulated gate field effect transistor and method of manufacture thereof |
| 07/19/2000 | EP1020921A2 Analog MOSFET devices |
| 07/19/2000 | EP1020920A2 Semiconductor device having a driver TFT and a pixel TFT on a common substrate and manufacturing method thereof |
| 07/19/2000 | EP1020919A2 Stacked capacitor DRAM cell |
| 07/19/2000 | EP1020918A2 DRAM capacitor and method of making the same |
| 07/19/2000 | EP1020917A2 Semiconductor device and a process for producing same |
| 07/19/2000 | EP1020916A2 Method for making an integrated circuit including alignment marks |
| 07/19/2000 | EP1020915A2 Semiconductor device |
| 07/19/2000 | EP1020907A1 Periphery barrier structure for integrated circuits |
| 07/19/2000 | EP1020906A2 DRAM capacitor and method of making the same |
| 07/19/2000 | EP1020905A1 Integrated circuit device having dual damascene interconnect structure and metal electrode capacitor and associated method for making |
| 07/19/2000 | EP1020904A1 Thermocompression bonding device and bonding head thereof |
| 07/19/2000 | EP1020903A1 A semiconductor device using a lead frame and its manufacturing method |