| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/21/2013 | CN103258718A Method for preparing crater-type porous silicon structure based on LSP effect |
| 08/21/2013 | CN103258717A Epitaxial substrate for electronic device and manufacturing method thereof |
| 08/21/2013 | CN103258716A Method for fabricating semiconductor layer having textured surface and method for fabricating solar cell |
| 08/21/2013 | CN103257534A Photoetching rework photoresist removing technology |
| 08/21/2013 | CN103257530A Proximity exposure apparatus, method of forming exposure light in the proximity exposure apparatus and method of manufacturing a display panel substrate |
| 08/21/2013 | CN103257497A Display pixel having oxide thin-film transistor (TFT) with reduced loading |
| 08/21/2013 | CN103255389A Method for epitaxial growth of III nitride semiconductor material on silicon substrate |
| 08/21/2013 | CN103253002A Fully-automatic multifunctional wafer machine |
| 08/21/2013 | CN103252847A Air knife |
| 08/21/2013 | CN103252714A Polishing apparatus |
| 08/21/2013 | CN103252552A Automatic ball mounter for BGAs (ball grid arrays) |
| 08/21/2013 | CN102484071B Apparatus for heat-treating semiconductor substrate |
| 08/21/2013 | CN102456677B Packaging structure for ball grid array and manufacturing method for same |
| 08/21/2013 | CN102446765B Manufacturing method of small-sized MOS (Metal Oxide Semiconductor) device |
| 08/21/2013 | CN102403253B Method for realizing silicon wafer transmission by using composite transmission path |
| 08/21/2013 | CN102358825B Polishing composition for sapphire wafer |
| 08/21/2013 | CN102358824B Polishing composition for ultra-precision surface manufacture of hard disk substrate |
| 08/21/2013 | CN102347360B Semiconductor device and manufacture method thereof |
| 08/21/2013 | CN102282655B Method of forming gate stack and structure thereof |
| 08/21/2013 | CN102282291B Raw material for chemical vapor deposition, and process for forming silicon-containing thin film using same |
| 08/21/2013 | CN102257621B Method for manufacturing transistor |
| 08/21/2013 | CN102244079B Power transistor chip structure of mesa technology and implementation method |
| 08/21/2013 | CN102244010B Preparation method of p-CuAlO2/n-ZnO:Al transparent thin film heterojunction of glass substrate |
| 08/21/2013 | CN102237376B Transmission type solar battery module and method for manufacturing same |
| 08/21/2013 | CN102237329B Chip structure, chip bonding structure and manufacturing methods for chip structure and chip bonding structure |
| 08/21/2013 | CN102197489B Underlayer film for image formation |
| 08/21/2013 | CN102197488B Thin-film transistor |
| 08/21/2013 | CN102197471B Self-centering susceptor ring assembly |
| 08/21/2013 | CN102197455B High temperature sheet handling system and methods |
| 08/21/2013 | CN102194706B Encapsulation process |
| 08/21/2013 | CN102194662B Heat treatment apparatus and heat treatment method |
| 08/21/2013 | CN102169853B Method of forming an integrated circuit structure |
| 08/21/2013 | CN102166559B Substrate processing device |
| 08/21/2013 | CN102163596B Integrated circuit device and its forming method |
| 08/21/2013 | CN102163592B Semiconductor structure and a method of manufacturing the same, method for preparing baffle with air-gap pattern |
| 08/21/2013 | CN102163550B Method for fabricating a semiconductor device |
| 08/21/2013 | CN102160187B Support for solar cells and method for producing a group of solar cells |
| 08/21/2013 | CN102160145B Formation of devices by epitaxial layer overgrowth |
| 08/21/2013 | CN102157350B Manufacturing method for semiconductor device |
| 08/21/2013 | CN102153990B Polishing liquid composition |
| 08/21/2013 | CN102148201B Semiconductor element, packaging structure and forming method of semiconductor element |
| 08/21/2013 | CN102144302B Paste and manufacturing methods of a solar cell using the same |
| 08/21/2013 | CN102130059B Method of forming an integrated circuit |
| 08/21/2013 | CN102119438B Magnetic pad for end-effectors |
| 08/21/2013 | CN102110590B Method for using deionized water as wetting agent in oxide corrosion of semiconductor device |
| 08/21/2013 | CN102074578B Semiconductor device and method for producing the same |
| 08/21/2013 | CN102067310B Stacking of wafer-level chip scale packages having edge contacts and manufacture method thereof |
| 08/21/2013 | CN102054868B Semiconductor device and manufacturing method thereof |
| 08/21/2013 | CN102037791B Plasma processing apparatus |
| 08/21/2013 | CN102024732B Substrate exchanging module for substrate processing apparatus and substrate processing apparatus having the same |
| 08/21/2013 | CN102024713B Semiconductor packaging technology |
| 08/21/2013 | CN101950728B Metal pillar bump structure and method of forming same |
| 08/21/2013 | CN101946323B New thermoelectric material and producing method thereof, and thermoelectric conversion element using the same |
| 08/21/2013 | CN101943739B Method and apparatus of deembedding |
| 08/21/2013 | CN101911284B Semiconductor device and its manufacturing method |
| 08/21/2013 | CN101906288B Thermal interface material, electronic device with same and preparation method |
| 08/21/2013 | CN101852984B Method for inspecting photomask blank or intermediate thereof, method for determining dosage of high-energy radiation, and method for manufacturing photomask blank or its intermediate |
| 08/21/2013 | CN101800161B Plasma etching method and plasma etching apparatus |
| 08/21/2013 | CN101799624B Substrate processing apparatus |
| 08/21/2013 | CN101767765B Micro electromechanical element with protective ring and manufacture method thereof |
| 08/21/2013 | CN101714506B Capacitor with hafnium oxide and aluminum oxide alloyed dielectric layer and method for fabricating the same |
| 08/21/2013 | CN101714498B A machining device |
| 08/21/2013 | CN101676799B Method for etching base material |
| 08/21/2013 | CN101649177B High-temperature bonding composition, substrate bonding method, and 3-d semiconductor device |
| 08/21/2013 | CN101614969B Developing method for immersion lithography, solvent used for the developing method and electronic device using the developing method |
| 08/21/2013 | CN101593764B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/21/2013 | CN101541438B Apparatus and method for fluid meniscus wet processing |
| 08/21/2013 | CN101523563B Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus |
| 08/21/2013 | CN101521230B Semiconductor device and method of manufacturing the same |
| 08/21/2013 | CN101521182B Method for manufacturing display device |
| 08/21/2013 | CN101490826B Process and system for quality management and analysis of via drilling |
| 08/21/2013 | CN101477990B Electronic device, semiconductor device and manufacturing method thereof |
| 08/21/2013 | CN101447441B Integrated circuit package system including die having relieved active region |
| 08/21/2013 | CN101443885B Bonding tool with improved finish |
| 08/21/2013 | CN101355076B Integrated circuit having a semiconductor substrate with a barrier layer |
| 08/21/2013 | CN101313092B Interconnects and heat dissipators based on nanostructures |
| 08/21/2013 | CN101276765B Inkjet printed wire bonding, encapsulant and shielding |
| 08/21/2013 | CN101195193B Laser processing apparatus, laser processing method, substrate, manufacturing method of substrate, manufacturing method of display apparatus |
| 08/21/2013 | CN101183645B Method of manufacturing semiconductor device |
| 08/21/2013 | CN101110381B Substrate processing with rapid temperature gradient control |
| 08/21/2013 | CN101086624B Lithography systems and processes |
| 08/21/2013 | CN101064320B Semiconductor device and method for manufacturing the semiconductor device |
| 08/20/2013 | US8516145 Information processing method and information processing apparatus for transmitting data generated by device manufacturing apparatus |
| 08/20/2013 | US8514902 P-type isolation between QCL regions |
| 08/20/2013 | US8514544 Electrostatic clamp optimizer |
| 08/20/2013 | US8514371 Imaging device in a projection exposure facility |
| 08/20/2013 | US8513962 Wafer tray and test apparatus |
| 08/20/2013 | US8513823 Semiconductor package having main stamp and sub-stamp |
| 08/20/2013 | US8513821 Overlay mark assistant feature |
| 08/20/2013 | US8513816 Film for flip chip type semiconductor back surface containing thermoconductive filler |
| 08/20/2013 | US8513811 Electronic device and method for connecting a die to a connection terminal |
| 08/20/2013 | US8513810 Semiconductor device and method of manufacturing same |
| 08/20/2013 | US8513808 Semiconductor device having trench-isolated element formation region |
| 08/20/2013 | US8513807 Semiconductor devices including a ruthenium film |
| 08/20/2013 | US8513804 Nanotube-based electrodes |
| 08/20/2013 | US8513796 Package structure, fabricating method thereof, and package-on-package device thereby |
| 08/20/2013 | US8513788 Integrated circuit packaging system with pad and method of manufacture thereof |
| 08/20/2013 | US8513785 Method of manufacturing a semiconductor device |
| 08/20/2013 | US8513781 Device for removing electromagnetic interference and semiconductor package including the same |
| 08/20/2013 | US8513780 Semiconductor device having inter-level dielectric layer with hole-sealing and method for manufacturing the same |