Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/14/2013CN102222640B Through hole forming method
08/14/2013CN102201398B Resin sealed semiconductor device and manufacturing method therefor
08/14/2013CN102197484B Memory devices and formation methods
08/14/2013CN102194679B Method for manufacturing semiconductor device
08/14/2013CN102177273B Sputtering target for forming wiring film of flat panel display
08/14/2013CN102171804B Method of enabling selective area plating on substrate
08/14/2013CN102169847B Dustproof film assembly receiving container
08/14/2013CN102169845B Multi-layer mixed synchronization bonding structure and method for three-dimensional packaging
08/14/2013CN102165281B Apparatus and method for inspecting thin film
08/14/2013CN102150252B Electrostatic chuck comprising double buffer layer (DBL) to reduce thermal stress
08/14/2013CN102150240B Adhesive film for wafer support for processing wafer of semiconductor thin film
08/14/2013CN102142358B Substrate processing method and apparatus, storage medium for storing program to execute the method
08/14/2013CN102132384B Ultraviolet light irradiation device
08/14/2013CN102122121B Process solutions containing surfactants
08/14/2013CN102119443B Schottky barrier diode and method for manufacturing schottky barrier diode
08/14/2013CN102087994B Contact hole filling method
08/14/2013CN102087963B Method for etching polycrystalline silicon layer
08/14/2013CN102084461B Apparatuses for atomic layer deposition
08/14/2013CN102067292B Methods for etching carbon nano-tube films for use in non-volatile memories
08/14/2013CN102067282B Method for forming fine pitch structures
08/14/2013CN102063025B Measurement method of two-faced registration error and lithographic equipment applying measurement method
08/14/2013CN102054787B Stack type package structure and manufacture method thereof
08/14/2013CN102049723B Method for polishing semiconductor wafer
08/14/2013CN102037164B Epitaxial growth on low degree off-axis silicon carbide substrates and semiconductor devices made thereby
08/14/2013CN102034818B Semiconductor power device and manufacture method thereof
08/14/2013CN102034700B Method of recycling silicon component for plasma etching apparatus and silicon component for plasma etching apparatus
08/14/2013CN102026896B Non-contact type of vacuum pad
08/14/2013CN102024742B Substrate processing method and substrate processing apparatus
08/14/2013CN102005541B Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
08/14/2013CN102005438B Semiconductor package and method of manufacturing the same
08/14/2013CN102005398B Method for forming via in substrate and substrate with via
08/14/2013CN101981687B Photonic clock stabilized laser comb processing
08/14/2013CN101952945B Pulsed bias plasma process to control microloading
08/14/2013CN101879642B Solder ball printing apparatus and solder ball printing method
08/14/2013CN101842898B Semiconductor device, manufacture method thereof and integrated circuit
08/14/2013CN101819936B Improved transistor devices and method of making
08/14/2013CN101814421B Method of forming fine patterns of a semiconductor device
08/14/2013CN101800198B Method for manufacturing crystalline silicon memory
08/14/2013CN101800188B Wafer protecting device of loader
08/14/2013CN101783329B Semiconductor component and manufacturing method thereof
08/14/2013CN101750916B Composition for photoresist stripper and method of fabricating thin film transistor array substrate
08/14/2013CN101740581B Thin film transistor array substrate as well as application and manufacturing method thereof
08/14/2013CN101730927B Ion implanter, internal structure of ion implanter and method of forming a coating layer in the ion implanter
08/14/2013CN101728357B Wiring structure and method for fabricating the same
08/14/2013CN101657894B Method and apparatus for singulated die testing
08/14/2013CN101651088B Tension adjusting device of cutting line which cuts wafer for semiconductor special device
08/14/2013CN101630663B Device with power semiconductor module and manufacture method thereof
08/14/2013CN101567377B Solid camera device, method for manufacturing the solid camera device, and electronic device
08/14/2013CN101561632B Photoresist resin, and method for forming pattern and method for manufacturing display panel using the same
08/14/2013CN101510557B Superjunction device having a dielectric termination and methods for manufacturing the device
08/14/2013CN101490833B Reduced capacity carrier, transport, load port, buffer system
08/14/2013CN101473415B Edge gas injection for critical dimension uniformity improvement
08/14/2013CN101467272B 氮化镓系化合物半导体发光元件 The gallium nitride-based compound semiconductor light-emitting element
08/14/2013CN101459058B Etching stopping layer, semi-conductor device with through hole and forming method thereof
08/14/2013CN101422849B Laser beam machining apparatus
08/14/2013CN101351755B Dispensable cured resin
08/14/2013CN101315998B Shaped integrated passive devices
08/14/2013CN101261985B Methods of forming packaged semiconductor light emitting devices having multiple optical elements by compression molding
08/14/2013CN101134878B 切割管芯键合膜 Cutting die bonding film
08/14/2013CN101065829B Autofocus for high power laser diode based annealing system
08/14/2013CN101009316B Flat panel display device and method of making the same
08/13/2013USRE44434 Optical position measuring system and method using a low coherence light source
08/13/2013USRE44431 Bump-on-lead flip chip interconnection
08/13/2013USRE44430 PMOS depletable drain extension made from NMOS dual depletable drain extensions
08/13/2013US8510476 Secure remote diagnostic customer support network
08/13/2013US8509938 Substrate apparatus calibration and synchronization procedure
08/13/2013US8508952 Electrical assembly
08/13/2013US8508698 Dual-view display panel structure and method for producing the same
08/13/2013US8508682 Peeling method and method for manufacturing display device using the peeling method
08/13/2013US8508051 Protection film having a plurality of openings above an electrode pad
08/13/2013US8508048 Semiconductor device utilizing a package on package structure and manufacturing method thereof
08/13/2013US8508045 Package 3D interconnection and method of making same
08/13/2013US8508035 Circuit connector apparatus and method therefor
08/13/2013US8508034 Electronic devices
08/13/2013US8508031 Electronic device and method of producing the same
08/13/2013US8508023 System and method for lowering contact resistance of the radio frequency (RF) shield to ground
08/13/2013US8508022 Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
08/13/2013US8508020 Method for manufacturing semiconductor device
08/13/2013US8508017 Test device and semiconductor integrated circuit device
08/13/2013US8508013 Backside illuminated active pixel sensor array and backside illuminated image sensor including the same
08/13/2013US8508005 STRAM with compensation element and method of making the same
08/13/2013US8507997 Mask read-only memory having a fake select transistor
08/13/2013US8507992 High-K metal gate CMOS
08/13/2013US8507990 Semiconductor device and manufacturing method of the same
08/13/2013US8507987 Radio frequency device and method for fabricating the same
08/13/2013US8507986 Silicon-carbide MOSFET cell structure and method for forming same
08/13/2013US8507976 Nonvolatile memory device and method for fabricating the same
08/13/2013US8507975 Semiconductor integrated circuit device and a method of manufacturing the same
08/13/2013US8507969 Method and system for providing contact to a first polysilicon layer in a flash memory device
08/13/2013US8507968 Memristive transistor memory
08/13/2013US8507965 Semiconductor device and manufacturing method thereof
08/13/2013US8507959 Combined-source MOS transistor with comb-shaped gate, and method for manufacturing the same
08/13/2013US8507957 Integrated circuit layouts with power rails under bottom metal layer
08/13/2013US8507955 Sensor device having MOS circuits, a gas or humidity sensor and a temperature sensor
08/13/2013US8507954 Integrated CMOS porous sensor having sensor electrodes formed with the interconnect conductors of a MOS circuit
08/13/2013US8507952 Semiconductor wafer, semiconductor device, and method for producing semiconductor wafer
08/13/2013US8507950 Method of producing semiconductor wafer and semiconductor wafer
08/13/2013US8507930 Organic light emitting diode display including a sealant auxiliary structure and method of manufacturing the same
08/13/2013US8507929 Semiconductor light emitting device including graded region
08/13/2013US8507926 Light emitting diode package