Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/29/2013US20130221361 Semiconductor display device
08/29/2013US20130221355 Structures and methods for testing printable integrated circuits
08/29/2013US20130221354 Flip chip semiconductor die internal signal access system and method
08/29/2013US20130221352 Process for producing indium oxide-containing layers
08/29/2013US20130221328 Pad-Less Gate-All Around Semiconductor Nanowire FETs On Bulk Semiconductor Wafers
08/29/2013US20130221327 Thick nitride semiconductor structures with interlayer structures and methods of fabricating thick nitride semiconductor structures
08/29/2013US20130221322 Substrate with Buffer Layer for Oriented Nanowire Growth
08/29/2013US20130221319 Gate-All Around Semiconductor Nanowire FET's On Bulk Semicoductor Wafers
08/29/2013US20130221317 Creating an embedded reram memory from a high-k metal gate transistor structure
08/29/2013US20130221313 Ultra high density resistive memory structure and method for fabricating the same
08/29/2013US20130221071 Capillary exchange system of semiconductor wire bonding
08/29/2013US20130220959 Hoist apparatus and hoist system thereof
08/29/2013US20130220687 Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
08/29/2013US20130220575 High definition heater system having a fluid medium
08/29/2013US20130220554 Laminate and method for separating the same
08/29/2013US20130220549 Using positive dc offset of bias rf to neutralize charge build-up of etch features
08/29/2013US20130220547 Substrate processing apparatus
08/29/2013US20130220545 Substrate mounting table and plasma etching apparatus
08/29/2013US20130220533 Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method
08/29/2013US20130220405 Process for manufacturing colloidal nanosheets by lateral growth of nanocrystals
08/29/2013US20130220390 Ultrasonic cleaning device
08/29/2013US20130220383 Substrate cleaning apparatus and substrate cleaning method
08/29/2013US20130220224 Method and Apparatus for Manufacturing Semiconductor Device
08/29/2013US20130219740 Substrate drying apparatus, substrate drying method and control program
08/29/2013US20130219693 Device for holding disk-shaped articles and method thereof
08/29/2013US20130219639 Semiconductor equipment
08/29/2013DE112011104010T5 Bearbeitungseinheit für ein Halbleiterwerkstück und Verfahren zu dessen Bearbeitung Machining unit for a semiconductor workpiece and method of processing
08/29/2013DE112011104002T5 Oxidhalbleiterschicht und Halbleiterbauelement Oxide semiconductor layer and the semiconductor component
08/29/2013DE112011103986T5 Elektronenstrahlsäule und Verfahren zur Benutzung der Elektronenstrahlsäule Electron beam column, and methods of use of the electron beam column
08/29/2013DE112011103810T5 Verfahren zum Herstellen von Surround-Gate-Silizium-Nanodraht-Transistor mit Luft als Seitenwand A process for producing surround gate silicon nanowire transistor with air as the side wall
08/29/2013DE112010004355B4 Damascene-Gate-Elektroden mit kurzschlussgeschützten Bereichen und Verfahren zu deren Herstellung Damascene gate electrode with short-circuit protected fields and methods for their preparation
08/29/2013DE10355319B4 Photoresist-Entfernerzusammensetzungen Photoresist Entfernerzusammensetzungen
08/29/2013DE10240401B4 Verfahren zum Ausbilden von Strukturen auf einem Wafer A method for forming structures on a wafer
08/29/2013DE102013203076A1 Erkennung des Latch-Up-Effekts Detection of the latch-up effect
08/29/2013DE102013202484A1 SOI-Wafer und Verfahren zu seiner Herstellung SOI wafer and process for its preparation
08/29/2013DE102013202366A1 In einer einzigen Prozesskammer hergestellte Solarzelle Produced in a single process chamber solar cell
08/29/2013DE102013201920A1 Verfahren für die Herstellung von Palladiumnanopartikeltinten A process for the production of palladium nanoparticles inks
08/29/2013DE102013101733A1 Grabenkondensatoren und Verfahren zu deren Ausbildung Grave capacitors and methods of training
08/29/2013DE102013101248A1 Feldeffekttransistor und Verfahren zum Herstellen desselben Field effect transistor and method of manufacturing the same
08/29/2013DE102013003283A1 Selbstsperrender verbundhalbleiter-tunneltransistor Self-locking composite semiconductor tunnel transistor
08/29/2013DE102013002988A1 Halbleiterbauelement mit verbesserter Robustheit A semiconductor device with improved robustness
08/29/2013DE102013002986A1 Integrierte Schottky-Diode für HEMTS Integrated Schottky Diode for HEMTs
08/29/2013DE102012202924A1 Contacting organic optoelectronic component with contacting element, comprises placing contacting element on electrode facing away from a surface of encapsulation and providing first energy input to contacting element using ultrasonic tool
08/29/2013DE102012202846A1 Integrierte sensorstruktur Integrated sensor structure
08/29/2013DE102012200329B4 Halbleiteranordnung mit einem Heatspreader und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device with a heat spreader and method of manufacturing a semiconductor device
08/29/2013DE102012108284A1 Three-dimensional integrated circuit, has switching circuits formed adjacent to one side of substrate, and polygon-shaped silicon plated-through holes extended from former side to another side and arranged at tip of polygon part
08/29/2013DE102012106901A1 FinFET und Verfahren zu dessen Herstellung FinFET and process for its preparation
08/29/2013DE102012104731A1 Mechanismen zum Ausbilden von Verbindungselementen für eine Baugruppe-auf-Baugruppe Mechanisms for forming fasteners for assembly-to-assembly
08/29/2013DE102012103583A1 Substrat mit vergrößerter Chipinsel Substrate with increased chip island
08/29/2013DE102012101590A1 Method for separating several discs of ingot from brittle-hard material e.g. semiconductor material, involves adjusting tension of moving wire such that storing axles of wire guide rollers are not supported in parallel to each other
08/29/2013DE102012101463A1 Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes optoelektronisches Bauelement A method for producing an optoelectronic component and thus produced optoelectronic component
08/29/2013DE102012007804A1 Verfahren zum technologisch optimierten Ausführen von Lötverbindungen A method for performing technologically optimized solder joints
08/29/2013DE102012004314A1 Verfahren zur Herstellung einer dünnen Si-Absorberschicht, Dünnschicht-Silizium-Absorber und seine Verwendung A process for producing a thin Si-absorber layer, thin-film silicon absorber and its use
08/29/2013DE102012003903A1 Verfahren zur thermischen Behandlung von Siliziumcarbidsubstraten A process for the thermal treatment of Siliziumcarbidsubstraten
08/29/2013DE102012003638A1 Leuchtdiode Light-emitting diode
08/29/2013DE102012003585A1 Verfahren zur Herstellung einer einkristallinen Metall-Halbleiter-Verbindung A process for producing a single-crystal metal-semiconductor compound
08/29/2013DE102009057590B4 Verfahren zur thermischen Behandlung eines Werkstücks A method for heat treating a workpiece
08/29/2013DE102009052744B4 Verfahren zur Politur einer Halbleiterscheibe Method for polishing a semiconductor wafer
08/29/2013DE102009010846B4 Verfahren zum Herstellen einer Gateelektrodenstruktur mit großem ε zum Erhöhen deren Integrität durch Einschluss einer Metalldeckschicht nach der Abscheidung A method of forming a gate electrode structure with large ε for increasing its integrity by incorporating a metal coating layer after deposition
08/29/2013DE102007023860B4 Schaltungsmodul zum Aufbau einer als Mehrschichtkörper ausgebildeten elektronischen Schaltung Circuit module to establish a form of a multi-layer body electronic circuit
08/29/2013DE102006036798B4 Elektronisches Bauteil und Verfahren zum Herstellen Electronic component and methods for making
08/29/2013DE102005034485B4 Verbindungselement für ein Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterleistungsbauelements Connecting element for a semiconductor device and method of manufacturing a semiconductor power device
08/29/2013CA2807716A1 Punctal plug with energized containment array
08/28/2013EP2632236A1 Patterned base, method for manufacturing same, information input device, and display device
08/28/2013EP2631951A2 High power insulated gate bipolar transistors
08/28/2013EP2631950A1 Semiconductor device and method for manufacturing same
08/28/2013EP2631947A1 Damascene word line
08/28/2013EP2631945A2 Microelectronic package with terminals on dielectric mass
08/28/2013EP2631941A2 Method for forming die assembly with heat spreader
08/28/2013EP2631939A1 Method for manufacturing mems device
08/28/2013EP2631938A1 Sheet adhesion device and adhesion method
08/28/2013EP2631937A1 Station assembly for processing and/or measuring semiconductor wafers and processing method
08/28/2013EP2631936A1 Plate conveying system for manufacturing of photovoltaic modules
08/28/2013EP2631935A2 Substrate cleaning apparatus and substrate cleaning method
08/28/2013EP2631934A1 Semiconductor junction structure and method for manufacturing semiconductor junction structure
08/28/2013EP2631933A1 Semiconductor substrate and field effect transistor, and manufacturing method for same
08/28/2013EP2631932A1 Photo-curable nanoimprint composition, method for forming pattern using the composition, and nanoimprint replica mold comprising cured product of composition
08/28/2013EP2631661A1 Method and apparatus for measuring electrostatic charge
08/28/2013EP2631253A2 Preparation of polymer, resulting polymer, resist composition, and patterning process
08/28/2013EP2631215A1 Chunk polycrystalline silicon and process for cleaning polycrystalline silicon chunks
08/28/2013EP2631008A1 Solution-processable tungsten oxide buffer layers and electronics comprising same
08/28/2013EP2630663A2 Improved schottky rectifier
08/28/2013EP2630662A1 Cmos devices and method for manufacturing the same
08/28/2013EP2630659A2 Integrated circuitry comprising nonvolatile memory cells and methods of forming a nonvolatile memory cell
08/28/2013EP2630656A1 Method of making a multi-chip module having a reduced thickness and related devices
08/28/2013EP2630655A2 System and method for packaging electronic devices
08/28/2013EP2630654A2 Method and system for pump priming
08/28/2013EP2630653A1 Apparatus for coating a wafer
08/28/2013EP2630278A2 Process for growing silicon carbide single crystal and device for the same
08/28/2013EP2629930A2 Parallellism conservation mechanism for nanopositioner
08/28/2013EP2629911A2 Starter material for a sintering compound and method for producing said sintering compound
08/28/2013EP1640474B1 Thin film forming device
08/28/2013CN203165872U Fixing device for wafer thinning processing
08/28/2013CN203165871U Contactless wafer feeding device
08/28/2013CN203165870U Wafer processing thinning machine
08/28/2013CN203165869U Wafer testing loading board and wafer testing machine platform
08/28/2013CN203165868U Multi-chip welding structure
08/28/2013CN203165867U Diode packaging equipment
08/28/2013CN203165866U Auxiliary device for stacking and welding chip
08/28/2013CN203165865U Novel etching groove
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