Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/13/2013US8507038 Substrate having a coating comprising copper and method for the production thereof by means of atomic layer deposition
08/13/2013US8506832 Wafer dividing apparatus and methods
08/13/2013US8506831 Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate
08/13/2013US8506754 Cross flow CVD reactor
08/13/2013US8506753 Capacitive coupling plasma processing apparatus and method for using the same
08/13/2013US8506711 Apparatus for manufacturing flat-panel display
08/13/2013US8506710 Apparatus for fabricating semiconductor device
08/13/2013US8506363 Substrate holder and substrate holding method
08/13/2013US8506362 Polishing apparatus and polishing method
08/13/2013US8506359 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
08/13/2013US8505991 Conveying device and vacuum apparatus
08/13/2013US8505891 Method and device for fastening a planar substrate, having an electric circuit or the like, in a mounting position
08/13/2013US8505691 Forklift shipping and handling apparatus
08/13/2013US8505481 Apparatus for growth of dilute-nitride materials using an isotope for enhancing the sensitivity of resonant nuclear reaction analysis
08/13/2013US8505478 Apparatus for high-efficiency synthesis of carbon nanostructure
08/13/2013US8505468 Substrate accommodating tray
08/13/2013CA2606999C Rf and/or rf identification tag/device having an integrated interposer, and methods for making the same
08/13/2013CA2606964C Mos electronic article surveillance, rf and/or rf identification tag/device, and methods for making and using the same
08/13/2013CA2581626C Method and apparatus for growing a group (iii) metal nitride film and a group (iii) metal nitride film
08/08/2013WO2013116872A1 Multi-layer metal support
08/08/2013WO2013116871A1 Multi-layer metal support
08/08/2013WO2013116747A1 Buffer layer structures suited for iii-nitride devices with foreign substrates
08/08/2013WO2013116622A1 Epitaxy technique for reducing threading dislocations in stressed semiconductor compounds
08/08/2013WO2013116595A1 Methods of forming layers
08/08/2013WO2013116485A1 A rotary substrate processing system
08/08/2013WO2013116478A1 Multi-chamber substrate processing systems
08/08/2013WO2013116218A1 Contact-free photomixing probe for device and integrated circuit measurement or characterization
08/08/2013WO2013116215A1 Integrated vapor transport deposition method and system
08/08/2013WO2013116168A1 Method for making a redistributed electronic device using a transferrable redistribution layer
08/08/2013WO2013116167A1 Method for making a redistributed wafer using transferable redistribution layers
08/08/2013WO2013116071A1 Apparatus, hybrid laminated body, method, and materials for temporary substrate support
08/08/2013WO2013116003A1 Asymmetric dense floating gate nonvolatile memory with decoupled capacitor
08/08/2013WO2013115957A1 Stacked substrate processing chambers
08/08/2013WO2013115345A1 Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, manufacturing method of electronic device and electronic device
08/08/2013WO2013113771A1 Semiconductor arrangement with active drift zone
08/08/2013WO2013113770A1 Semiconductor arrangement with active drift zone
08/08/2013WO2013113766A1 A method of discovering a risk for damaged components in electronic assemblies
08/08/2013WO2013103600A4 Extrusion-based additive manufacturing system for 3d structural electronic, electromagnetic and electromechanical components/devices
08/08/2013WO2013070978A3 Substrate processing system and method
08/08/2013WO2010056209A3 Dicing system and method
08/08/2013US20130204425 Thermal processing apparatus, thermal processing method, and storage medium
08/08/2013US20130204424 Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing
08/08/2013US20130203269 Heat treatment apparatus for heating substrate by irradiation with flashes of light, and heat treatment method
08/08/2013US20130203268 Film deposition apparatus and film deposition method
08/08/2013US20130203267 Multiple vapor sources for vapor deposition
08/08/2013US20130203266 Methods of Forming Metal Nitride Materials
08/08/2013US20130203265 Carrier bonding and detaching processes for a semiconductor wafer
08/08/2013US20130203264 Method and apparatus for vapor and gas filtration
08/08/2013US20130203263 Silicon etchant and method for producing transistor by using same
08/08/2013US20130203262 Process for Silicon Nitride Removal Selective to SiGex
08/08/2013US20130203261 Plasma tuning rods in microwave resonator processing systems
08/08/2013US20130203260 Etching method and etching apparatus
08/08/2013US20130203259 Pressure control valve assembly of plasma processing chamber and rapid alternating process
08/08/2013US20130203258 Variable capacitance chamber component incorporating ferroelectric materials and methods of manufacturing and using thereof
08/08/2013US20130203257 Patterning process for fin-like field effect transistor (finfet) device
08/08/2013US20130203256 Controlled gas mixing for smooth sidewall rapid alternating etch process
08/08/2013US20130203255 Waferless auto conditioning
08/08/2013US20130203254 Polishing composition and polishing method
08/08/2013US20130203253 Method of forming pattern and method of manufacturing semiconductor device
08/08/2013US20130203252 Activation process to improve metal adhesion
08/08/2013US20130203251 Method for Three-Dimensional Packaging of Electronic Devices
08/08/2013US20130203250 Semiconductor device manufacturing method
08/08/2013US20130203249 Electroless copper deposition
08/08/2013US20130203248 Integrated circuit having a junctionless depletion-mode fet device
08/08/2013US20130203247 Method of fabricating a semiconductor structure
08/08/2013US20130203246 Semiconductor chip with graphene based devices in an interconnect structure of the chip
08/08/2013US20130203245 Methods for pfet fabrication using apm solutions
08/08/2013US20130203244 Methods for pfet fabrication using apm solutions
08/08/2013US20130203243 Methods for enhancing p-type doping in iii-v semiconductor films
08/08/2013US20130203242 Method for manufacturing a nanowire structure
08/08/2013US20130203241 Method of manufacturing semiconductor device
08/08/2013US20130203240 Method for making a redistributed electronic device using a transferrable redistribution layer
08/08/2013US20130203239 Methods for scribing of semiconductor devices with improved sidewall passivation
08/08/2013US20130203238 Method of manufacturing semiconductor device
08/08/2013US20130203237 Cutting method for device wafer
08/08/2013US20130203236 Methods for making thin layers of crystalline materials
08/08/2013US20130203235 Capped integrated device with protective cap, composite wafer incorporating integrated devices and process for bonding integrated devices with respective protective caps
08/08/2013US20130203233 Manufacturing method of memory capacitor without moat structure
08/08/2013US20130203232 Manufacturing method of random access memory
08/08/2013US20130203231 Selective etch chemistry for gate electrode materials
08/08/2013US20130203230 Semiconductor process
08/08/2013US20130203229 Method of reducing surface doping concentration of doped diffusion region, method of manufacturing super junction using the same and method of manufacturing power transistor device
08/08/2013US20130203226 Semiconductor process
08/08/2013US20130203223 Method of manufacturing semiconductor device with offset sidewall structure
08/08/2013US20130203221 Semiconductor device and method of manufacturing thereof
08/08/2013US20130203220 Method of molding semiconductor package
08/08/2013US20130203219 Semiconductor package and method of manufacturing the same
08/08/2013US20130203218 Method for Producing a Composite and a Power Semiconductor Module
08/08/2013US20130203217 Semiconductor device
08/08/2013US20130203216 Package-on-package assembly with wire bonds to encapsulation surface
08/08/2013US20130203215 Packaging Methods for Semiconductor Devices
08/08/2013US20130203214 Method for manufacturing semiconductor device
08/08/2013US20130203211 Method for coating a substrate with aluminium-doped zinc oxide
08/08/2013US20130203200 Fabrication method of package structure having mems element
08/08/2013US20130203199 Methods of Bonding Caps for MEMS Devices
08/08/2013US20130203196 Manufacture method of thin film transistor array substrate
08/08/2013US20130203191 Device and method for forming on a nanowire made of a semiconductor an alloy of this semiconductor with a metal or a metalloid
08/08/2013US20130203190 Method for making a redistributed wafer using transferrable redistribution layers
08/08/2013US20130203189 Substrate treatment apparatus, substrate treatment method, and non-transitory storage medium
08/08/2013US20130203188 Hybrid metrology for semiconductor devices
1 ... 519 520 521 522 523 524 525 526 527 528 529 530 531 532 533 534 535 536 537 538 539 ... 6590