Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/29/2013US20130224945 Methods of forming bulk finfet devices with replacement gates so as to reduce punch through leakage currents
08/29/2013US20130224944 Methods for fabricating integrated circuits using tailored chamfered gate liner profiles
08/29/2013US20130224943 Memory Device Structure and Method
08/29/2013US20130224942 Methods of Fabricating Semiconductor Devices and Structures Thereof
08/29/2013US20130224941 Silicon carbide semiconductor device and method of manufacturing thereof
08/29/2013US20130224940 Work function adjustment with the implant of lanthanides
08/29/2013US20130224939 Replacement gate electrode with multi-thickness conductive metallic nitride layers
08/29/2013US20130224938 Passivation layer for workpieces formed from a polymer
08/29/2013US20130224937 Method for manufacturing semiconductor device
08/29/2013US20130224936 Methods of manufacturing a semiconductor device
08/29/2013US20130224935 Optical input/output device for photo-electric integrated circuit device and method of fabricating same
08/29/2013US20130224934 Nanotube solution treated with molecular additive, nanotube film having enhanced adhesion property, and methods for forming the nanotube solution and the nanotube film
08/29/2013US20130224932 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
08/29/2013US20130224928 Memory device having an integrated two-terminal current limiting resistor
08/29/2013US20130224927 Methods for fabricating integrated circuits with narrow, metal filled openings
08/29/2013US20130224925 Method of Manufacturing a Semiconductor Device
08/29/2013US20130224919 Method for making gate-oxide with step-graded thickness in trenched dmos device for reduced gate-to-drain capacitance
08/29/2013US20130224913 Underfill material and method for manufacturing semiconductor device by using the same
08/29/2013US20130224912 Manufacturing method of semiconductor device
08/29/2013US20130224910 Method for chip package
08/29/2013US20130224909 Process of forming through-silicon via structure
08/29/2013US20130224891 Manufacturing method of semiconductor module
08/29/2013US20130224890 Feedback Control Using Detection Of Clearance And Adjustment For Uniform Topography
08/29/2013US20130224889 Charged particle beam apparatus, thin film forming method, defect correction method and device forming method
08/29/2013US20130224438 Method for removing oxide film formed on surface of silicon wafer
08/29/2013US20130223793 Total reflection type optical switch using polymer insertion type silica optical waveguide and manufacturing method thereof
08/29/2013US20130223790 Optical Waveguide Arrangements Comprising An Auxiliary Waveguide - Like Structure
08/29/2013US20130223789 Optical bench on substrate
08/29/2013US20130223463 Nitride semiconductor device and production method thereof
08/29/2013US20130223166 Graphene-based memory devices and methods therefor
08/29/2013US20130223010 Semiconductor package, cooling mechanism and method for manufacturing semiconductor package
08/29/2013US20130222950 Latch up detection
08/29/2013US20130221571 Pattern forming device and semiconductor device manufacturing method
08/29/2013US20130221543 Integrated circuit packaging system with interconnects and method of manufacture thereof
08/29/2013US20130221542 Functional Spacer for SIP and Methods for Forming the Same
08/29/2013US20130221539 Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact
08/29/2013US20130221535 Diffusion Barrier Layer, Metal Interconnect Arrangement and Method of Manufacturing the Same
08/29/2013US20130221531 Semiconductor device, memory system and method of manufacturing the semiconductor device
08/29/2013US20130221528 Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure
08/29/2013US20130221527 Metallic capped interconnect structure with high electromigration resistance and low resistivity
08/29/2013US20130221526 System in Package and Method for Manufacturing The Same
08/29/2013US20130221525 Semiconductor Package with Integrated Selectively Conductive Film Interposer
08/29/2013US20130221524 Integrated circuits with improved interconnect reliability using an insulating monolayer and methods for fabricating same
08/29/2013US20130221522 Mechanisms of forming connectors for package on package
08/29/2013US20130221520 Semiconductor device and method of manufacturing semiconductor device
08/29/2013US20130221517 Semiconductor workpiece with backside metallization and methods of dicing the same
08/29/2013US20130221514 Semiconductor device and fabrication method for the same
08/29/2013US20130221512 Structure and manufacturing method of chip scale package
08/29/2013US20130221511 Method for forming die assembly with heat spreader
08/29/2013US20130221510 Methods for bonding material layers to one another and resultant apparatus
08/29/2013US20130221507 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package
08/29/2013US20130221502 Joined body, power semiconductor device, and manufacturing methods of joined body and power semiconductor device
08/29/2013US20130221500 System-In-Package with Integrated Socket
08/29/2013US20130221498 Semiconductor device and method for manufacturing the same
08/29/2013US20130221497 Method for the production of a substrate comprising embedded layers of getter material
08/29/2013US20130221496 Metallic carrier for layer transfer and methods for forming the same
08/29/2013US20130221495 Oxide microchannel with controllable diameter
08/29/2013US20130221494 Structure and method for strain-relieved tsv
08/29/2013US20130221491 Fin field-effect transistors having controlled fin height and method of making
08/29/2013US20130221489 Inks and processes to make a chalcogen-containing semiconductor
08/29/2013US20130221487 Method of forming resistor of semiconductor memory device and structure thereof
08/29/2013US20130221484 Through silicon via noise suppression using buried interface contacts
08/29/2013US20130221483 Trench Capacitors and Methods of Forming the Same
08/29/2013US20130221482 Metal-insulator-metal capacitor
08/29/2013US20130221478 Methods of forming isolation structures for semiconductor devices by employing a spin-on glass material or a flowable oxide material
08/29/2013US20130221469 Semiconductor package and method of fabricating the same
08/29/2013US20130221460 Engineered Magnetic Layer with Improved Perpendicular Anisotropy using Glassing Agents for Spintronic Applications
08/29/2013US20130221459 Engineered Magnetic Layer with Improved Perpendicular Anisotropy using Glassing Agents for Spintronic Applications
08/29/2013US20130221455 Methods for Embedding Controlled-Cavity MEMS Package in Integration Board
08/29/2013US20130221452 Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus
08/29/2013US20130221449 Manufacturing method of semiconductor device and semiconductor manufacturing device
08/29/2013US20130221448 Fin profile structure and method of making same
08/29/2013US20130221445 Atomic Layer Deposition Methods For Metal Gate Electrodes
08/29/2013US20130221444 Semiconductor device and manufacturing method of semiconductor device
08/29/2013US20130221443 Finfets and method of fabricating the same
08/29/2013US20130221442 Embedded power stage module
08/29/2013US20130221441 Replacement gate electrode with multi-thickness conductive metallic nitride layers
08/29/2013US20130221440 Method of manufacturing a semiconductor device
08/29/2013US20130221439 Soi wafer and method of manufacturing the same
08/29/2013US20130221436 Electronic device including a trench and a conductive structure therein and a process of forming the same
08/29/2013US20130221435 Closed cell trenched power semiconductor structure
08/29/2013US20130221428 Process of forming an electronic device including a trench and a conductive structure therein
08/29/2013US20130221427 Semiconductor Device With Improved Robustness
08/29/2013US20130221426 Electric power semiconductor device and manufacturing method of the same
08/29/2013US20130221424 Semiconductor device and method for fabricating semiconductor device
08/29/2013US20130221423 Nonvolatile semiconductor memory device and method for manufacturing same
08/29/2013US20130221420 Structure comprising a ruthenium metal material
08/29/2013US20130221418 Analog Floating-Gate Memory Manufacturing Process Implementing N-Channel and P-Channel MOS Transistors
08/29/2013US20130221414 Semiconductor FET and Method for Manufacturing the Same
08/29/2013US20130221413 Divot-free planarization dielectric layer for replacement gate
08/29/2013US20130221408 Semiconductor device, manufacturing method thereof, protective element, and manufacturing method thereof
08/29/2013US20130221404 Semiconductor structure and method for forming the same
08/29/2013US20130221377 Heterogrowth
08/29/2013US20130221376 Semiconductor device and method of manufacturing the same
08/29/2013US20130221370 Compound semiconductor device
08/29/2013US20130221366 Normally-off compound semiconductor tunnel transistor
08/29/2013US20130221365 Method For Processing Semiconductors Using A Combination Of Electron Beam And Optical Lithography
08/29/2013US20130221364 Semiconductor structure and method of forming the same
08/29/2013US20130221363 Integrated Schottky Diode for HEMTs
08/29/2013US20130221362 Electro-Optical Device and Electronic Device
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