Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/28/2013CN103270613A Resin coating device and resin coating method
08/28/2013CN103270602A Oxide for semiconductor layer of thin film transistor, sputtering target, and thin-film transistor
08/28/2013CN103270601A Semiconductor device and display device
08/28/2013CN103270600A Uniaxially strained quantum well device and method of making same
08/28/2013CN103270599A Transistors with high concentration of boron doped germanium
08/28/2013CN103270598A Contact resistance reduction employing germanium overlayer pre-ontact metalization
08/28/2013CN103270597A Column iv transistors for pmos integration
08/28/2013CN103270594A Capacitor with recessed plate portion for dynamic random access memory (dram) and method to form the same
08/28/2013CN103270593A Rectangular capacitors for dynamic random access memory (dram) and dual-ass lithography methods to form the same
08/28/2013CN103270590A Power/ground layout for chips
08/28/2013CN103270585A Method for producing semiconductor device, and semiconductor device
08/28/2013CN103270584A System and method for offloading IC units
08/28/2013CN103270583A Post implant wafer heating using light
08/28/2013CN103270582A Tape adhering device and tape adhering method
08/28/2013CN103270581A Field-effect transistor, method for producing same, and electronic device including same
08/28/2013CN103270580A Semiconductor wafer cleaning method
08/28/2013CN103270579A Substrate heat treatment apparatus
08/28/2013CN103270578A Thin film deposition using microwave plasma
08/28/2013CN103270577A Flow meter with improved thermal stability and methods of use
08/28/2013CN103270576A Group-iii-nitride based layer structure and semiconductor device
08/28/2013CN103270454A Film exposure device and film exposure method
08/28/2013CN103270426A Process for manufacture of thin film solar cell, and thin film solar cell
08/28/2013CN103270192A Retaining device for substrates and method for coating a substrate
08/28/2013CN103269858A Printing table assembly for printing e.g. substrate, has table with transport device to transport substrates in plane below another plane, where fixed distance between planes corresponds to distance between transport and printing planes
08/28/2013CN103268904A Preparation for X-ray detector based on polycrystal mercury iodide thin film
08/28/2013CN103268891A Thin film transistor, amorphous silicon flat detecting substrate and preparation method
08/28/2013CN103268887A Field effect transistor, marginal structure and relative manufacture method
08/28/2013CN103268884A Active matrix organic light emitting diode panel and manufacturing method thereof
08/28/2013CN103268883A OLED (organic light emitting diode) display and manufacturing method thereof
08/28/2013CN103268880A Production method for pixel unit and production method for image sensor
08/28/2013CN103268878A TFT (thin film transistor) array substrate, and production method thereof and display device
08/28/2013CN103268877A Semiconductor device and manufacturing method thereof
08/28/2013CN103268872A Payment-by -pure-card intelligent card loading belt and manufacturing method thereof
08/28/2013CN103268871A Ultra-thin high-density multi-layer circuit chip front packaging structure and manufacturing method
08/28/2013CN103268869A IC packaging structure and preparing mold and preparing technology of IC packaging structure
08/28/2013CN103268868A Gas tightness metal shell used for surface mounting
08/28/2013CN103268867A Method for manufacturing TFT array substrate
08/28/2013CN103268866A Through-hole-priority dual damascene copper interconnection method for reducing coupling capacitance of redundant metal
08/28/2013CN103268865A Groove-priority dual damascene copper interconnection method for reducing coupling capacitance of redundant metal
08/28/2013CN103268864A Through-hole-priority dual damascene copper interconnection method for reducing coupling capacitance of redundant metal
08/28/2013CN103268863A Separating device of crystal particle
08/28/2013CN103268862A Semiconductor encapsulation structure and manufacturing method thereof
08/28/2013CN103268861A Method for manufacturing FS (field stop) type IGBT (insulated gate bipolar transistor) by multiple epitaxies
08/28/2013CN103268860A Manufacturing method of IGBT (insulated gate bipolar transistor) device integrated with diode
08/28/2013CN103268859A Manufacturing method of back of IGBT (Insulated Gate Bipolar Transistor) chip
08/28/2013CN103268858A Method for preparing near-infrared light electrical silicon materials
08/28/2013CN103268857A Self-stop etching method based on gallium nitride based material
08/28/2013CN103268856A Two-beam laser annealing with improved temperature performance
08/28/2013CN103268855A Polycrystalline silicon forming method, TFT (thin film transistor) array substrate manufacturing method and display device
08/28/2013CN103268854A Photoetching groove covering technology
08/28/2013CN103268853A Optical element quantitative etching and cleaning device
08/28/2013CN103268852A Method for preparing supersaturated-doping semiconductor thin film
08/28/2013CN103268049A Array substrate and preparation method thereof, liquid crystal panel and display device
08/28/2013CN103268047A LTPS (Low Temperature Poly-silicon) array base plate and manufacturing method thereof
08/28/2013CN103268046A Thin film transistor (TFT) liquid crystal display device, array substrate and production method of array substrate
08/28/2013CN103268045A TFT (thin film transistor) array substrate, and production method thereof and liquid crystal display device
08/28/2013CN103268044A Naked eye 3D (three-dimensional) liquid crystal display device and manufacturing method of naked eye 3D liquid crystal display device
08/28/2013CN103264202A Brazed layer predeposition method
08/28/2013CN102738014B Flip chip packaging method
08/28/2013CN102543866B Manufacturing method of array substrate of penetration type liquid crystal display(LCD)
08/28/2013CN102403282B Packaging structure with basic islands and without pins at four sides and manufacturing method thereof
08/28/2013CN102386226B 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
08/28/2013CN102361014B State monitoring and fault diagnosis method for large-scale semiconductor manufacture process
08/28/2013CN102315266B Semiconductor structure and making method thereof
08/28/2013CN102315122B Process for manufacturing bipolar-type device by adopting two-time stibium buried-layer extending technology
08/28/2013CN102290399B Stacking type chip packaging structure and method
08/28/2013CN102257617B Method for manufacturing optical matrix device
08/28/2013CN102246276B Workpiece cooling method and system for transferring heat away
08/28/2013CN102244018B Manufacturing method of chip embedded type printed circuit board
08/28/2013CN102237269B Method for etching laminated structure of molybdenum-base (Mo-base) metal gate by using aluminum nitride (AlN) as barrier layer
08/28/2013CN102237268B Preparing and etching method of plugged-in TiN metal gate lamination structure
08/28/2013CN102214623B Chip package and method for forming the same
08/28/2013CN102208383B Circuit board and formation method thereof
08/28/2013CN102208346B Nonvolatile charge capture type storage device, preparation method thereof and application
08/28/2013CN102157453B Stack-type package structure and manufacturing method thereof
08/28/2013CN102157423B Substrate mounting table and method for manufacturing the same, and substrate processing apparatus
08/28/2013CN102157393B Fan-out high-density packaging method
08/28/2013CN102144286B Mounting apparatus and mounting method
08/28/2013CN102142487B Method for preparing graphical GaN substrate
08/28/2013CN102142374B Process method for reducing drain-source ON resistance RDS (ON) of metal-oxide-semiconductor field effect transistor (MOSFET) power device
08/28/2013CN102137952B High-k dielectric films and methods of producing using cerium-based precursors
08/28/2013CN102132212B Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component
08/28/2013CN102117732B Substrate processing system and unloading interlock module thereof
08/28/2013CN102113114B Complementary logical gate device
08/28/2013CN102113095B Method and apparatus for producing dislocation-free crystalline sheet
08/28/2013CN102112410B Substrate holding device, substrate holding method, and method of manufacturing laminated glass
08/28/2013CN102104070B Semiconductor structure and forming method thereof
08/28/2013CN102089870B Gate insulating material, gate insulating film, and organic field effect transistor
08/28/2013CN102084301B Coating composition and pattern-forming method
08/28/2013CN102074498B Integrated circuits and methods for forming the integrated circuits
08/28/2013CN102033372B TFT-LCD array substrate and manufacturing, detecting and driving methods thereof
08/28/2013CN101996990B 电子部件及其制造方法 An electronic component and its manufacturing method
08/28/2013CN101986421B Dielectric film, method of manufacturing semiconductor device using dielectric film, and semiconductor manufacturing apparatus
08/28/2013CN101981664B Methods for etching edge of silicon wafer
08/28/2013CN101960575B Semiconductor device and manufacturing method therefor
08/28/2013CN101894797B Manufacture method of backside illumination image sensor
08/28/2013CN101887869B Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
08/28/2013CN101847653B Light emitting element and light emitting device using the same
08/28/2013CN101809719B Methods and arrangements for plasma processing system with tunable capacitance
08/28/2013CN101740431B Detecting and sorting method for posterior flow of LED (Light Emitting Diode)