Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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08/22/2013 | US20130214392 Methods of forming stepped isolation structures for semiconductor devices using a spacer technique |
08/22/2013 | US20130214391 Lateral-Dimension-Reducing Metallic Hard Mask Etch |
08/22/2013 | US20130214388 Semiconductor Wafer Adapted to Support Transparency in Partial Wafer Processing |
08/22/2013 | US20130214387 Chip structure with a passive device and method for forming the same |
08/22/2013 | US20130214386 Sip system-integration ic chip package and manufacturing method thereof |
08/22/2013 | US20130214384 Low harmonic rf switch in soi |
08/22/2013 | US20130214383 Method for forming isolation structure |
08/22/2013 | US20130214381 Methods of forming isolation structures for semiconductor devices |
08/22/2013 | US20130214378 Semiconductor device including a mosfet and schottky junction |
08/22/2013 | US20130214369 Pressure sensor |
08/22/2013 | US20130214365 Mems pressure transducer assembly and method of packaging same |
08/22/2013 | US20130214364 Replacement gate electrode with a tantalum alloy metal layer |
08/22/2013 | US20130214363 Manufacturing method for a device with transistors strained by silicidation of source and drain zones |
08/22/2013 | US20130214362 Method of producing a device with transistors strained by means of an external layer |
08/22/2013 | US20130214358 Low external resistance etsoi transistors |
08/22/2013 | US20130214357 Non-planar mosfet structures with asymmetric recessed source drains and methods for making the same |
08/22/2013 | US20130214356 Mosfet with work function adjusted metal backgate |
08/22/2013 | US20130214354 Semiconductor structure and method for forming the same |
08/22/2013 | US20130214353 Field Effect Transistor Having Multiple Effective Oxide Thicknesses and Corresponding Multiple Channel Doping Profiles |
08/22/2013 | US20130214352 Dual Gate Lateral MOSFET |
08/22/2013 | US20130214351 Semiconductor device and method of manufacturing semiconductor device |
08/22/2013 | US20130214346 Non-volatile memory cell and logic transistor integration |
08/22/2013 | US20130214340 Semiconductor structure and manufacturing method of the same |
08/22/2013 | US20130214339 Semiconductor device comprising capacitor and method of fabricating the same |
08/22/2013 | US20130214336 Method for filling trench with metal layer and semiconductor structure formed by using the same |
08/22/2013 | US20130214335 Replacement Gate Approach for High-K Metal Gate Stacks by Using a Multi-Layer Contact Level |
08/22/2013 | US20130214331 Method for treating a substrate and a substrate |
08/22/2013 | US20130214324 Semiconductor device and peeling off method and method of manufacturing semiconductor device |
08/22/2013 | US20130214299 Thin film transistor array panel and manufacturing method thereof |
08/22/2013 | US20130214296 Heat spreading substrate with embedded interconnects |
08/22/2013 | US20130214295 Heat spreading substrate |
08/22/2013 | US20130214291 Semiconductor element and manufacturing method therefor |
08/22/2013 | US20130214289 Short-Resistant Metal-Gate MOS Transistor and Method of Forming the Transistor |
08/22/2013 | US20130214287 Semiconductor device and manufacturing method thereof |
08/22/2013 | US20130214284 Method for the reuse of gallium nitride epitaxial substrates |
08/22/2013 | US20130214282 Iii-n on silicon using nano structured interface layer |
08/22/2013 | US20130214281 Method of growing a high quality iii-v compound layer on a silicon substrate |
08/22/2013 | US20130214275 Transistor having a narrow in-substrate collector region for reduced base-collector junction capacitance and a method of forming the transistor |
08/22/2013 | US20130214274 Integrated Circuit and Manufacturing Method |
08/22/2013 | US20130214261 Electro-Optical Device |
08/22/2013 | US20130214253 Manufacturing method of graphene substrate and graphene substrate |
08/22/2013 | US20130214252 Controlled synthesis of monolithically-integrated graphene structure |
08/22/2013 | US20130214243 Nanowires made of novel precursors and method for the production thereof |
08/22/2013 | US20130214237 Nonvolatile memory device using a tunnel oxide layer and oxygen blocking layer as a current limiter element |
08/22/2013 | US20130213910 Boat for loading semiconductor substrates |
08/22/2013 | US20130213572 Plasma processing apparatus |
08/22/2013 | US20130213561 Device and device manufacture method |
08/22/2013 | US20130213485 Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation |
08/22/2013 | US20130213467 Production of microholes |
08/22/2013 | US20130213442 Method for purging a substrate container |
08/22/2013 | US20130213434 Method for eliminating contact bridge in contact hole process |
08/22/2013 | US20130213301 Mask pattern forming method, fine pattern forming method, and film deposition apparatus |
08/22/2013 | US20130213257 Transport Vehicle and Transport System |
08/22/2013 | US20130213171 Substrate transfer apparatus |
08/22/2013 | DE112011103882T5 Verbesserte Vorlagenschichten für die heteroepitaxiale Abscheidung von III-Nitridhalbleitermaterialien unter Verwendung von HVPE-Vorgängen Improved template layers for heteroepitaxial deposition of III-nitride semiconductor materials using HVPE processes |
08/22/2013 | DE112011103869T5 Verfahren zum Ausbilden von III-Nitridgrundmaterialien auf Metallnitrid-Wachstumsvorlagenschichten und Strukturen, die durch derartige Verfahren ausgebildet sind A method of forming metal nitride III-Nitridgrundmaterialien on growth template layers and structures formed by such methods |
08/22/2013 | DE112011103788T5 Struktur und Verfahren zum Herstellen von Widerständen auf der Grundlage von Finfet-Prozessen Structure and method for manufacturing resistors on the basis of FinFET processes |
08/22/2013 | DE112011103782T5 Halbleiterelement, Halbleitervorrichtung und Verfahren zum Herstellen eines Halbleiterelemts Semiconductor element, semiconductor device and method of manufacturing a Halbleiterelemts |
08/22/2013 | DE112011103772T5 Halbleiterbauelement und Verfahren zum Herstellen desselben Of the same semiconductor device and method of manufacturing |
08/22/2013 | DE112011103769T5 Verfahren zur Herstellung eines epitaktischen Wafers und der epitaktische Wafer A method for producing an epitaxial wafer and the epitaxial wafer |
08/22/2013 | DE112011103400T5 Integrierte Schaltung und Verbindung und Verfahren zur Herstellung derselben Integrated circuit and method for producing the same compound and |
08/22/2013 | DE112011102837T5 Speichereinrichtung und Halbleitereinrichtung Storage device and semiconductor device |
08/22/2013 | DE112011102446T5 3D-Durchkontaktierungskondensator mit einer potentialfreien leitfähigen Platte für eine verbesserte Zuverlässigkeit 3D Durchkontaktierungskondensator with a floating conductive plate for improved reliability |
08/22/2013 | DE112010006019T5 Verfahren zur Herstellung einer Passivierungsschicht und eines Matrixsubstrats für einen Dünnschichttransistor A process for producing a passivation layer and an array substrate for a thin film transistor |
08/22/2013 | DE112008002467B4 Verfahren für die Entnahme von Halbleiterchips von einem Wafertisch und die Montage der Halbleiterchips auf einem Substrat A process for the removal of semiconductor chips from a wafer table and the mounting of the semiconductor chip on a substrate |
08/22/2013 | DE112006004099B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
08/22/2013 | DE112006002430B4 Verfahren zur Herstellung von Super-Gittern unter Verwendung von abwechselnden Hoch und Niedrig-Temperatur-Schichten zum Sperren von parasitären Strompfaden A process for the production of super-lattices using alternating high and low-temperature layers to block parasitic current paths |
08/22/2013 | DE112005001387B4 Anwendung einer vom waferemissionsvermögen unabhängigen aktiven wafertemperaturregeleinrichtung, verfahren, vorrichtung und maschinenlesbares medium Application of a wafer from emission assets independent active wafer temperature regulating device, process, apparatus and computer readable medium |
08/22/2013 | DE102013202546A1 Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung Laser processing method and laser processing apparatus |
08/22/2013 | DE102013201513A1 Anordnung und Verfahren zur Positionierung eines Bearbeitungswerkzeuges gegenüber einem Werkstück Arrangement and method for positioning of a machining tool relative to a workpiece |
08/22/2013 | DE102013200046A1 Verfahren zum Herstellen eines Siliciumcarbid-Halbleiterbauelements und Siliciumcarbid-Halbleiterbauelement A method of manufacturing a silicon carbide semiconductor device and the silicon carbide semiconductor device |
08/22/2013 | DE102013101327A1 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device |
08/22/2013 | DE102013101114A1 Verfahren zum Ablösen eines Resist nach einer Metallabscheidung A method for peeling a resist according to a metal deposition |
08/22/2013 | DE102012222672A1 Gerät zur Abscheidung organischer Schichten und Verfahren zum Fertigen von Geräten mit organischer lichtemittiereder Anzeige unter Verwendung desselben Apparatus for deposition of organic layers, and method of fabricating devices with organic lichtemittiereder display using the same |
08/22/2013 | DE102012205320A1 Polysiliziumentfernung durch Trockenätzung in Austauschgates Polysilicon removal by dry etching in exchange Gates |
08/22/2013 | DE102012205298A1 Austauschgateverfahren für Metallgatestapel mit großem ε unter Anwendung einer Mehrschichtkontaktebene und Halbleiterbauelement Replacement gate process for metal gate stack with large ε, using a multi-layer semiconductor device and the contact plane |
08/22/2013 | DE102012202727A1 Verfahren zur Verbindung eines ersten elektronischen Bauelements mit einem zweiten Bauelement A method for connecting a first electronic component with a second component |
08/22/2013 | DE102012202615A1 Method for manufacturing thermoelectric generator used in exhaust line of motor car, involves forming electric conductive surfaces apart from electrical conductive layer to ensure electric connection between semiconductor elements |
08/22/2013 | DE102012202611A1 Manufacturing a micro-system by deep reactive-ion etching, comprises e.g.: providing an etching tool for deep reactive-ion etching, carrying out multiple repeating-processing intervals of the deep ion etching including an etching step |
08/22/2013 | DE102012202367A1 Semiconductor device i.e. interdigitated-back-contact-solar cell, manufacturing method, involves selectively coating dopant-source material on surface regions with high wettability, and advancing dopant from material into dopant regions |
08/22/2013 | DE102012202281A1 Semiconductor device includes semiconductor chip that includes upper and lower contact plates which are integrally connected to upper chip metallization and lower chip metallization by upper and lower connecting layers |
08/22/2013 | DE102012108015B3 Method for forming e.g. complementary metal oxide semiconductor fin-like FET component, involves recessing insulation elements in n- and p-type metal oxide semiconductor regions, so that machined corrugated elements are defined in regions |
08/22/2013 | DE102012102533B3 Integrierte Leistungstransistorschaltung mit Strommesszelle und Verfahren zu deren Herstellung sowie eine Anordnung diese enthaltend Integrated power transistor circuit with current sensing cell and process for their preparation and to an arrangement comprising these |
08/22/2013 | DE102012101251A1 Method for separating silicon wafer from each other by semiconductor material ingot using e.g. multi-wire saw, involves separating wafers from each other by relative movement between ingot and wire groups |
08/22/2013 | DE102012101237A1 Verfahren zum temporären Verbinden eines Produktsubstrats mit einem Trägersubstrat A method for temporarily bonding a substrate product having a support substrate |
08/22/2013 | DE102012101211A1 Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements A process for producing a radiation-emitting semiconductor component |
08/22/2013 | DE102012003455A1 Method for producing thin film solar module, involves providing sequence of flexible thin-film solar cells for designing side portions in electrically conductive terminals and forming photovoltaic active layer with electrical conductor |
08/22/2013 | DE102010000407B4 Halbleiter-Package mit einem aus Metallschichten bestehenden Band und Verfahren zum Herstellen eines derartigen Halbleiter-Package The semiconductor package with a band consisting of metal layers and method for manufacturing such a semiconductor package |
08/22/2013 | DE102009039418B4 Einstellung der Austrittsarbeit in Gate-Stapeln mit großem ε, die Gatedielektrika mit unterschiedlicher Dicke enthalten Setting the work function in gate stacks with large ε containing gate dielectrics with different thickness |
08/22/2013 | DE102008059044B4 Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht A method of polishing a semiconductor wafer with a strained-relaxed Si1-xGex layer |
08/22/2013 | DE102008033651B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls Method for producing a power semiconductor module |
08/22/2013 | DE102004064161B4 Verfahren zum Ätzen von Metallen, ausgewählt aus Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium A method of etching of metals selected from nickel, chromium, nickel-chromium alloys, and / or palladium |
08/22/2013 | DE102004042149B4 Halbleitervorrichtung und Schaltungen mit der Halbleitervorrichtung sowie mit einer Treibeschaltung für die Halbleitervorrichtung Semiconductor device and circuits with the semiconductor device and with a drive circuit for the semiconductor device |
08/22/2013 | DE102004032703B4 Verfahren zum Ausbilden von Isolationsgebieten eines Halbleiterbauelements und Halbleiterbauelemente A method of forming isolation regions of a semiconductor device and semiconductor devices |
08/22/2013 | DE102004012013B4 Waferanordnung Wafer assembly |
08/21/2013 | EP2629334A2 Power transistor having segmented gate |
08/21/2013 | EP2629333A2 Semiconductor device and method for producing the same |
08/21/2013 | EP2629329A2 Semiconductor device and manufacturing method thereof |
08/21/2013 | EP2629328A1 Semiconductor device using close proximity wireless communication |
08/21/2013 | EP2629327A2 Semiconductor manufacturing apparatus |