Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/22/2013US20130214392 Methods of forming stepped isolation structures for semiconductor devices using a spacer technique
08/22/2013US20130214391 Lateral-Dimension-Reducing Metallic Hard Mask Etch
08/22/2013US20130214388 Semiconductor Wafer Adapted to Support Transparency in Partial Wafer Processing
08/22/2013US20130214387 Chip structure with a passive device and method for forming the same
08/22/2013US20130214386 Sip system-integration ic chip package and manufacturing method thereof
08/22/2013US20130214384 Low harmonic rf switch in soi
08/22/2013US20130214383 Method for forming isolation structure
08/22/2013US20130214381 Methods of forming isolation structures for semiconductor devices
08/22/2013US20130214378 Semiconductor device including a mosfet and schottky junction
08/22/2013US20130214369 Pressure sensor
08/22/2013US20130214365 Mems pressure transducer assembly and method of packaging same
08/22/2013US20130214364 Replacement gate electrode with a tantalum alloy metal layer
08/22/2013US20130214363 Manufacturing method for a device with transistors strained by silicidation of source and drain zones
08/22/2013US20130214362 Method of producing a device with transistors strained by means of an external layer
08/22/2013US20130214358 Low external resistance etsoi transistors
08/22/2013US20130214357 Non-planar mosfet structures with asymmetric recessed source drains and methods for making the same
08/22/2013US20130214356 Mosfet with work function adjusted metal backgate
08/22/2013US20130214354 Semiconductor structure and method for forming the same
08/22/2013US20130214353 Field Effect Transistor Having Multiple Effective Oxide Thicknesses and Corresponding Multiple Channel Doping Profiles
08/22/2013US20130214352 Dual Gate Lateral MOSFET
08/22/2013US20130214351 Semiconductor device and method of manufacturing semiconductor device
08/22/2013US20130214346 Non-volatile memory cell and logic transistor integration
08/22/2013US20130214340 Semiconductor structure and manufacturing method of the same
08/22/2013US20130214339 Semiconductor device comprising capacitor and method of fabricating the same
08/22/2013US20130214336 Method for filling trench with metal layer and semiconductor structure formed by using the same
08/22/2013US20130214335 Replacement Gate Approach for High-K Metal Gate Stacks by Using a Multi-Layer Contact Level
08/22/2013US20130214331 Method for treating a substrate and a substrate
08/22/2013US20130214324 Semiconductor device and peeling off method and method of manufacturing semiconductor device
08/22/2013US20130214299 Thin film transistor array panel and manufacturing method thereof
08/22/2013US20130214296 Heat spreading substrate with embedded interconnects
08/22/2013US20130214295 Heat spreading substrate
08/22/2013US20130214291 Semiconductor element and manufacturing method therefor
08/22/2013US20130214289 Short-Resistant Metal-Gate MOS Transistor and Method of Forming the Transistor
08/22/2013US20130214287 Semiconductor device and manufacturing method thereof
08/22/2013US20130214284 Method for the reuse of gallium nitride epitaxial substrates
08/22/2013US20130214282 Iii-n on silicon using nano structured interface layer
08/22/2013US20130214281 Method of growing a high quality iii-v compound layer on a silicon substrate
08/22/2013US20130214275 Transistor having a narrow in-substrate collector region for reduced base-collector junction capacitance and a method of forming the transistor
08/22/2013US20130214274 Integrated Circuit and Manufacturing Method
08/22/2013US20130214261 Electro-Optical Device
08/22/2013US20130214253 Manufacturing method of graphene substrate and graphene substrate
08/22/2013US20130214252 Controlled synthesis of monolithically-integrated graphene structure
08/22/2013US20130214243 Nanowires made of novel precursors and method for the production thereof
08/22/2013US20130214237 Nonvolatile memory device using a tunnel oxide layer and oxygen blocking layer as a current limiter element
08/22/2013US20130213910 Boat for loading semiconductor substrates
08/22/2013US20130213572 Plasma processing apparatus
08/22/2013US20130213561 Device and device manufacture method
08/22/2013US20130213485 Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation
08/22/2013US20130213467 Production of microholes
08/22/2013US20130213442 Method for purging a substrate container
08/22/2013US20130213434 Method for eliminating contact bridge in contact hole process
08/22/2013US20130213301 Mask pattern forming method, fine pattern forming method, and film deposition apparatus
08/22/2013US20130213257 Transport Vehicle and Transport System
08/22/2013US20130213171 Substrate transfer apparatus
08/22/2013DE112011103882T5 Verbesserte Vorlagenschichten für die heteroepitaxiale Abscheidung von III-Nitridhalbleitermaterialien unter Verwendung von HVPE-Vorgängen Improved template layers for heteroepitaxial deposition of III-nitride semiconductor materials using HVPE processes
08/22/2013DE112011103869T5 Verfahren zum Ausbilden von III-Nitridgrundmaterialien auf Metallnitrid-Wachstumsvorlagenschichten und Strukturen, die durch derartige Verfahren ausgebildet sind A method of forming metal nitride III-Nitridgrundmaterialien on growth template layers and structures formed by such methods
08/22/2013DE112011103788T5 Struktur und Verfahren zum Herstellen von Widerständen auf der Grundlage von Finfet-Prozessen Structure and method for manufacturing resistors on the basis of FinFET processes
08/22/2013DE112011103782T5 Halbleiterelement, Halbleitervorrichtung und Verfahren zum Herstellen eines Halbleiterelemts Semiconductor element, semiconductor device and method of manufacturing a Halbleiterelemts
08/22/2013DE112011103772T5 Halbleiterbauelement und Verfahren zum Herstellen desselben Of the same semiconductor device and method of manufacturing
08/22/2013DE112011103769T5 Verfahren zur Herstellung eines epitaktischen Wafers und der epitaktische Wafer A method for producing an epitaxial wafer and the epitaxial wafer
08/22/2013DE112011103400T5 Integrierte Schaltung und Verbindung und Verfahren zur Herstellung derselben Integrated circuit and method for producing the same compound and
08/22/2013DE112011102837T5 Speichereinrichtung und Halbleitereinrichtung Storage device and semiconductor device
08/22/2013DE112011102446T5 3D-Durchkontaktierungskondensator mit einer potentialfreien leitfähigen Platte für eine verbesserte Zuverlässigkeit 3D Durchkontaktierungskondensator with a floating conductive plate for improved reliability
08/22/2013DE112010006019T5 Verfahren zur Herstellung einer Passivierungsschicht und eines Matrixsubstrats für einen Dünnschichttransistor A process for producing a passivation layer and an array substrate for a thin film transistor
08/22/2013DE112008002467B4 Verfahren für die Entnahme von Halbleiterchips von einem Wafertisch und die Montage der Halbleiterchips auf einem Substrat A process for the removal of semiconductor chips from a wafer table and the mounting of the semiconductor chip on a substrate
08/22/2013DE112006004099B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
08/22/2013DE112006002430B4 Verfahren zur Herstellung von Super-Gittern unter Verwendung von abwechselnden Hoch und Niedrig-Temperatur-Schichten zum Sperren von parasitären Strompfaden A process for the production of super-lattices using alternating high and low-temperature layers to block parasitic current paths
08/22/2013DE112005001387B4 Anwendung einer vom waferemissionsvermögen unabhängigen aktiven wafertemperaturregeleinrichtung, verfahren, vorrichtung und maschinenlesbares medium Application of a wafer from emission assets independent active wafer temperature regulating device, process, apparatus and computer readable medium
08/22/2013DE102013202546A1 Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung Laser processing method and laser processing apparatus
08/22/2013DE102013201513A1 Anordnung und Verfahren zur Positionierung eines Bearbeitungswerkzeuges gegenüber einem Werkstück Arrangement and method for positioning of a machining tool relative to a workpiece
08/22/2013DE102013200046A1 Verfahren zum Herstellen eines Siliciumcarbid-Halbleiterbauelements und Siliciumcarbid-Halbleiterbauelement A method of manufacturing a silicon carbide semiconductor device and the silicon carbide semiconductor device
08/22/2013DE102013101327A1 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device
08/22/2013DE102013101114A1 Verfahren zum Ablösen eines Resist nach einer Metallabscheidung A method for peeling a resist according to a metal deposition
08/22/2013DE102012222672A1 Gerät zur Abscheidung organischer Schichten und Verfahren zum Fertigen von Geräten mit organischer lichtemittiereder Anzeige unter Verwendung desselben Apparatus for deposition of organic layers, and method of fabricating devices with organic lichtemittiereder display using the same
08/22/2013DE102012205320A1 Polysiliziumentfernung durch Trockenätzung in Austauschgates Polysilicon removal by dry etching in exchange Gates
08/22/2013DE102012205298A1 Austauschgateverfahren für Metallgatestapel mit großem ε unter Anwendung einer Mehrschichtkontaktebene und Halbleiterbauelement Replacement gate process for metal gate stack with large ε, using a multi-layer semiconductor device and the contact plane
08/22/2013DE102012202727A1 Verfahren zur Verbindung eines ersten elektronischen Bauelements mit einem zweiten Bauelement A method for connecting a first electronic component with a second component
08/22/2013DE102012202615A1 Method for manufacturing thermoelectric generator used in exhaust line of motor car, involves forming electric conductive surfaces apart from electrical conductive layer to ensure electric connection between semiconductor elements
08/22/2013DE102012202611A1 Manufacturing a micro-system by deep reactive-ion etching, comprises e.g.: providing an etching tool for deep reactive-ion etching, carrying out multiple repeating-processing intervals of the deep ion etching including an etching step
08/22/2013DE102012202367A1 Semiconductor device i.e. interdigitated-back-contact-solar cell, manufacturing method, involves selectively coating dopant-source material on surface regions with high wettability, and advancing dopant from material into dopant regions
08/22/2013DE102012202281A1 Semiconductor device includes semiconductor chip that includes upper and lower contact plates which are integrally connected to upper chip metallization and lower chip metallization by upper and lower connecting layers
08/22/2013DE102012108015B3 Method for forming e.g. complementary metal oxide semiconductor fin-like FET component, involves recessing insulation elements in n- and p-type metal oxide semiconductor regions, so that machined corrugated elements are defined in regions
08/22/2013DE102012102533B3 Integrierte Leistungstransistorschaltung mit Strommesszelle und Verfahren zu deren Herstellung sowie eine Anordnung diese enthaltend Integrated power transistor circuit with current sensing cell and process for their preparation and to an arrangement comprising these
08/22/2013DE102012101251A1 Method for separating silicon wafer from each other by semiconductor material ingot using e.g. multi-wire saw, involves separating wafers from each other by relative movement between ingot and wire groups
08/22/2013DE102012101237A1 Verfahren zum temporären Verbinden eines Produktsubstrats mit einem Trägersubstrat A method for temporarily bonding a substrate product having a support substrate
08/22/2013DE102012101211A1 Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements A process for producing a radiation-emitting semiconductor component
08/22/2013DE102012003455A1 Method for producing thin film solar module, involves providing sequence of flexible thin-film solar cells for designing side portions in electrically conductive terminals and forming photovoltaic active layer with electrical conductor
08/22/2013DE102010000407B4 Halbleiter-Package mit einem aus Metallschichten bestehenden Band und Verfahren zum Herstellen eines derartigen Halbleiter-Package The semiconductor package with a band consisting of metal layers and method for manufacturing such a semiconductor package
08/22/2013DE102009039418B4 Einstellung der Austrittsarbeit in Gate-Stapeln mit großem ε, die Gatedielektrika mit unterschiedlicher Dicke enthalten Setting the work function in gate stacks with large ε containing gate dielectrics with different thickness
08/22/2013DE102008059044B4 Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht A method of polishing a semiconductor wafer with a strained-relaxed Si1-xGex layer
08/22/2013DE102008033651B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls Method for producing a power semiconductor module
08/22/2013DE102004064161B4 Verfahren zum Ätzen von Metallen, ausgewählt aus Nickel, Chrom, Nickel-Chrom-Legierungen und/oder Palladium A method of etching of metals selected from nickel, chromium, nickel-chromium alloys, and / or palladium
08/22/2013DE102004042149B4 Halbleitervorrichtung und Schaltungen mit der Halbleitervorrichtung sowie mit einer Treibeschaltung für die Halbleitervorrichtung Semiconductor device and circuits with the semiconductor device and with a drive circuit for the semiconductor device
08/22/2013DE102004032703B4 Verfahren zum Ausbilden von Isolationsgebieten eines Halbleiterbauelements und Halbleiterbauelemente A method of forming isolation regions of a semiconductor device and semiconductor devices
08/22/2013DE102004012013B4 Waferanordnung Wafer assembly
08/21/2013EP2629334A2 Power transistor having segmented gate
08/21/2013EP2629333A2 Semiconductor device and method for producing the same
08/21/2013EP2629329A2 Semiconductor device and manufacturing method thereof
08/21/2013EP2629328A1 Semiconductor device using close proximity wireless communication
08/21/2013EP2629327A2 Semiconductor manufacturing apparatus