Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/21/2013CN103258845A Semiconductor structure and forming method thereof
08/21/2013CN103258844A Method of growing a high quality iii-v compound layer on a silicon substrate
08/21/2013CN103258842A Double-layer shallow groove isolation structure, manufacturing method and transverse diffusion metal oxide semiconductor (MOS) tube
08/21/2013CN103258839A Vehicle, display device and manufacturing method for semiconductor device
08/21/2013CN103258838A A display apparatus and a method for manufacturing the same
08/21/2013CN103258828A Integrated circuit and manufacturing method
08/21/2013CN103258827A Array substrate, manufacturing method of array substrate and display device of array substrate
08/21/2013CN103258826A Nonvolatile memory device, method for operating the same, and method for fabricating the same
08/21/2013CN103258825A Semiconductor structure and manufacturing method thereof
08/21/2013CN103258824A Memory cell of flash memory and forming method
08/21/2013CN103258823A Semiconductor structure and formation method thereof
08/21/2013CN103258821A Enhancement type Flash chip with hard reset function and chip encapsulating method
08/21/2013CN103258820A Reinforced SPI port Flash chip and chip packing method
08/21/2013CN103258818A System and method for fine pitch POP structure
08/21/2013CN103258817A Semiconductor packaging structure and manufacturing method thereof
08/21/2013CN103258813A Testing structure and forming method of part depletion type SOI MOSFET
08/21/2013CN103258810A Method for reducing over electroplating on surface of wafer after through silicon via (TSV) is electroplated with copper
08/21/2013CN103258807A Circuit substrate, semiconductor encapsulation structure and manufacture process of circuit substrate
08/21/2013CN103258806A Semiconductor package structure with bridging structure and manufacturing method thereof
08/21/2013CN103258803A Semiconductor device and method for manufacturing same
08/21/2013CN103258798A Method of integrating a charge-trapping gate stack into a cmos flow
08/21/2013CN103258797A Split gate flash memory unit and manufacturing method thereof
08/21/2013CN103258796A Method for manufacturing silicon-substrate high-migration-rate channel CMOS
08/21/2013CN103258795A Technological method capable of preventing shortcomings on photoresist during wet etching
08/21/2013CN103258794A Technological method capable of preventing shortcomings on photoresist during wet etching
08/21/2013CN103258793A Manufacturing method of COA array substrate, array substrate and display device
08/21/2013CN103258792A Groove-preferential dual-damascene copper-connection method reducing redundant metal coupling capacitance
08/21/2013CN103258791A Method and relevant device for achieving metal mutual connection through preparation of micro-protruding-points with superfine spaces
08/21/2013CN103258790A Method for revealing inner metal of silicon through holes
08/21/2013CN103258789A Manufacturing method of through hole interconnection structure and product of through hole interconnection structure
08/21/2013CN103258788A Through hole interconnection structure manufacturing method based on bidirectional filling and through hole interconnection structure product
08/21/2013CN103258787A Method for fabricating semiconductor device
08/21/2013CN103258786A Method and apparatus for filling metal paste, and method for fabricating via plug
08/21/2013CN103258785A Methods for making porous insulating films and semiconductor devices including the same
08/21/2013CN103258784A Method of forming semiconductor
08/21/2013CN103258783A Method of manufacturing semiconductor device
08/21/2013CN103258782A Method for fabrication of semiconductor structure including interposer, and related structure and device
08/21/2013CN103258781A Methods and apparatus to form electrical interconnects on opthalmic devices
08/21/2013CN103258780A Novel process for forming a big via
08/21/2013CN103258779A Copper interconnection structure and manufacturing method thereof
08/21/2013CN103258778A Method for preparing substrate with hollow cavity
08/21/2013CN103258777A Methods for fabricating semiconductor devices with isolation regions having uniform stepheights
08/21/2013CN103258776A Mass damper for semiconductor wafer handling end effector
08/21/2013CN103258775A Stationary fixture
08/21/2013CN103258774A Stationery fixture
08/21/2013CN103258773A Semiconductor component coating film processing method
08/21/2013CN103258772A Heating seat and heating device of routing process
08/21/2013CN103258771A Substrate holding member and substrate bonding apparatus
08/21/2013CN103258770A Method of manufacturing semiconductor device and method of manufacturing electronic device
08/21/2013CN103258769A Assembly and method for positioning a machining tool relative to a workpiece
08/21/2013CN103258768A Target jig for calibration and semiconductor manufacturing device
08/21/2013CN103258767A Apparatus for transferring solar wafer or solar cell during fabrication
08/21/2013CN103258766A Cleaning frame
08/21/2013CN103258765A Silicon wafer loader transition frame
08/21/2013CN103258764A Carrier for wafer thinning and preparation method thereof
08/21/2013CN103258763A Wafer loading platform structure commonly used by wafers of different sizes
08/21/2013CN103258762A Substrate bonding apparatus and substrate bonding method
08/21/2013CN103258761A Plasma etching chamber for controlling temperature of wafer and method thereof
08/21/2013CN103258760A Semi-conductor equipment
08/21/2013CN103258759A Precise positioning movement platform device and precise positioning movement platform method of directional semiconductor equipment
08/21/2013CN103258758A Monitoring method and control wafer for particles in film thickness measuring machine platform
08/21/2013CN103258757A Encapsulating and testing method of quantum effect photoelectric detection array and reading circuit
08/21/2013CN103258756A Stripping capacity evaluation method and stripping capacity evaluation system for stripping equipment
08/21/2013CN103258755A Flip-chip welding spot defect back view temperature measurement detecting method
08/21/2013CN103258754A Semiconductor module bonding tool and semiconductor module processing technology
08/21/2013CN103258753A Circuit connection structure, method for manufacturing same, and semiconductor substrate for circuit connection structure
08/21/2013CN103258752A Semiconductor device manufacturing method and electronic device manufacturing method
08/21/2013CN103258751A Method of manufacturing semiconductor device and method of manufacturing electronic assembly
08/21/2013CN103258750A Semiconductor device and method of manufacturing same
08/21/2013CN103258749A Die ejecting method and unit, die pickup method and pickup device
08/21/2013CN103258748A Assembling method of welding columns used for ceramic column grid array packaging
08/21/2013CN103258747A Method for carrying out aluminium wire bonding on gold conductor film circuit
08/21/2013CN103258746A 球栅结构 Ball grid structure
08/21/2013CN103258745A Thin film transistor, manufacturing method of thin film transistor, array substrate and display device
08/21/2013CN103258744A Method of manufacturing semiconductor device and semiconductor device
08/21/2013CN103258743A Thin film transistor, thin film transistor array substrate and method of fabricating same
08/21/2013CN103258742A Method for forming transistors
08/21/2013CN103258741A Nanowire field effect transistor and forming method thereof
08/21/2013CN103258740A Method for manufacturing fin-type field effect transistor
08/21/2013CN103258739A Grooved-gate gallium-nitride-based enhancement device preparation method based on self-stopped etch
08/21/2013CN103258738A Superlattice nanowire field effect transistor and forming method thereof
08/21/2013CN103258737A Microwave power transistor with double emitter regions and double poles and preparation method thereof
08/21/2013CN103258736A Device and method for surface passivation in bipolar integrated circuit manufacturing technique
08/21/2013CN103258735A Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
08/21/2013CN103258734A SiCOH thin film and preparation method thereof
08/21/2013CN103258733A Technological method capable of preventing shortcomings on photoresist during wet etching
08/21/2013CN103258732A Method for preventing surfaces of silicon substrate from being damaged
08/21/2013CN103258731A Method of preventing surface of silicon substrate from being damaged
08/21/2013CN103258730A Method for preparing table board with regular trapezoid section through ICP dry etching process
08/21/2013CN103258729A Fabrication of a silicon structure and deep silicon etch with profile control
08/21/2013CN103258728A Silicon wafer etching method and manufacturing method of solar battery piece
08/21/2013CN103258727A Etching agent, etching method and liquid for preparing etching agent
08/21/2013CN103258726A Thin film surface planarization method, array substrate, manufacturing method of array substrate and display device
08/21/2013CN103258725A Method of forming thin film interconnect and thin film interconnect
08/21/2013CN103258724A Three-dimensional semiconductor device with large-aspect-ratio FIN structure and formation method thereof
08/21/2013CN103258723A Activation process to improve metal adhesion
08/21/2013CN103258722A Method adopting AlGaInN buffering layer to grow three-group nitride in GaAs substrate
08/21/2013CN103258721A Method for manufacturing silicon carbide semiconductor device and silicon carbide semiconductor device
08/21/2013CN103258720A Photoresist pattern trimming methods
08/21/2013CN103258719A Methods of minimizing etch undercut and providing clean metal liftoff
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